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ST STPS3030CT/CG/CR Manual

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1. Unit Junction to case TO 220AB D PAK Per diode 1 2 C W Total 0 8 0 4 Coupling C W Symbol Rith c Rth c STATIC ELECTRICAL CHARACTERISTICS per diode Symbol Parameter Tests Conditions In Reverse leakage Tj 25 C current Tj 126 C Forward voltage drop Tj 25 C 125 15A Tj 25 125 30A Pulse test 1 380 us lt 2 To evaluate the conduction losses use the following equation P 0 26 0 0107 Fig 1 Conduction losses versus average current Fig 2 Average forward current versus ambient temperature d 0 5 P W IF av A 10 T T F 1 18 8 01 8 02 8 0 5 9 8 0 05 y Y 8 7 6 5 4 3 2 1 IFav A Tam 0 0 2 4 6 8 10 12 14 16 18 20 Fig 3 Normalized avalanche power derating versus pulse duration 0 25 50 75 100 125 150 Fig 4 Normalized avalanche power derating versus junction temper
2. stpssosocticaicr LOW DROP POWER SCHOTTKY RECTIFIER MAJOR PRODUCTS CHARACTERISTICS IF AV 2x15A VRRM 30 V A2 p Tj max 150 C Vr max 0 42 V FEATURES AND BENEFITS VERY SMALL CONDUCTION LOSSES NEGLIGIBLE SWITCHING LOSSES EXTREMELY FAST SWITCHING zu aes LOW FORWARD VOLTAGE DROP FOR STPS3030CG HIGHER EFFICIENCY LOW THERMAL RESISTANCE AVALANCHE CAPABILITY SPECIFIED DESCRIPTION Dual Schottky rectifier suited for switch Mode Power Supply and high frequency DC to DC converters A1 Packaged in TO 220AB D PAK and I PAK this device is intended for use in low voltage high STPS3030CR frequency inverters free wheeling and polarity protection applications ABSOLUTE RATINGS limiting values per diode Parameter Repetitive peak reverse voltage RMS forward current Average forward Tc 135 current 0 5 Surge non repetitive forward current 10 Sinusoidal 250 Peak repetitive reverse current tp 2 us square F 1kHz 1 Repetitive peak avalanche power ius 25 4100 Storage temperature range Tj Maximum operating junction temperature 150 C dV dt Critical rate of rise of reverse voltage rated Vr Tj 25 C 10000 V us dPtot lt 1 dTj Rth j a July 2003 Ed 3A 1 6 thermal runaway condition for a diode on its own heatsink STPS3030CT CG CR THERMAL RESISTANCES _ o Parameter
3. 0 93 144 1 70 0 045 0 067 A A2 B2 D 895 935 0 352 0 368 M R 1 27 1 40 1 40 1 75 240 3 20 0 094 0 126 0 40 typ 0 016 typ 8 o V2 gt FLAT ZONE NO LESS THAN 2mm FOOTPRINT 16 90 10 30 L T 5 08 3 70 8 90 ky 56 STPS3030CT CG CR PACKAGE MECHANICAL DATA TO 220AB REF DIMENSIONS Millimeters Inches Min Max Min Max A 4 40 4 60 0 173 123 1 32 0 048 0 051 D 240 E 049 0 70 0 019 F 0 61 0 88 0 024 0 034 F1 1 14 i3 F2 144 170 0 044 G 495 5 15 0 194 0 202 Gi 240 H2 10 10 40 0 393 0 409 L2 16 4 typ 0 645 typ L4 13 L5 2 65 2 95 0 104 L6 1525 15 75 0 600 0 620 L7 620 6 60 0 244 L9 350 393 0 137 0 154 M 2 6 typ 0 102 typ Diam 3 75 3 85 0 147 0 151 COOLING METHOD C RECOMMENDED TORQUE VALUE 0 55 M N 1 MAXIMUM TORQUE VALUE 0 70 Ordering type Marking Package Weight Base qty Delivery mode STPS3030CT STPS3030CT TO 220AB 229 50 Tube STPS30300G STPS3030CG D PAK 148g 50 STPS3030CG TR STPSS3030CG 2 1 489 1000 Tape amp reel STPS3030CR STPS3030CR 1 499 50 Tube EPOXY MEETS UL94 V0 Information furnished is believed to be accurate and reliab
4. versus pulse duration Zth j c Rth j c 0 0 9 0 8 0 7 0 5 0 6 0 5 0 4 5 02 0 3 5 01 0 2 Single pulse H 0 1 tp s H 0 0 S tp T i i t 1 E 03 1 E 02 1 E 01 1 00 Fig 8 Junction capacitance versus reverse voltage applied typical values C nF 10 0 F 1MHz Vysc 30MV 25 1 0 VR V 0 1 1 10 100 Fig 10 Thermal resistance junction to ambient versus copper surface under tab epoxy printed board FR4 Cu 35um Rth j a C W D PAK 10 S cm 30 35 40 3 6 STPS3030CT CG CR PACKAGE MECHANICAL DATA DIMENSIONS Millimeters Inches A 4 40 4 60 0 173 0 181 A1 2 49 2 69 0 098 0 106 b 070 09 b1 144 147 0 044 b2 114 1 17 0 046 c 045 0 60 c2 1 23 1 36 0 048 0 054 D 8 95 9 35 0 352 0 368 10 0 10 4 131 13 6 0 516 0 535 Li L2 5 e 240 270 E L 12 4 ky STPS3030CT CG CR PACKAGE MECHANICAL DATA D PAK REF DIMENSIONS Millimeters Inches Min Max 4 40 4 60 249 2 69 0 03 0 23 0 001 0 009 0 70
5. ature PARM tp PARM tp PArm 1us i5 PARM 25 C 1 0 1 0 8 0 6 0 01 0 4 0 2 0 001 ipu 0 x uhi 0 01 0 1 1 10 100 1000 0 25 50 75 100 125 150 2 6 ky STPS3030CT CG CR Fig 5 Non repetitive surge peak forward current versus overload duration maximum values IM A 25 t s 1 E 02 1 E 01 1 00 Fig 7 Reverse leakage current versus reverse voltage applied typical values IR mA 1 03 T 150 0 1 02 125 Tj 100 C 1 E 01 T 75 1 E 00 T 50 C 1 E 01 T 25 VR V 1 E 02 0 5 10 15 20 25 30 Fig 9 Forward voltage drop versus forward current IFM A 100 te 125 Maximum values Ks Y T 125 Typical values 10 T 25 0 7 Maximum values i H 1 F 0 0 0 2 0 4 0 6 0 8 1 0 1 2 Fig 6 Relative variation of thermal impedance junction to case
6. le However STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics Specifications mentioned in this publication are subject to change without notice This publication supersedes and replaces all information previously supplied STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics The ST logo is a registered trademark of STMicroelectronics O 2003 STMicroelectronics Printed in Italy All rights reserved STMicroelectronics GROUP OF COMPANIES Australia Brazil Canada China Finland France Germany Hong Kong India Israel Italy Japan Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom United States http www st com 66 ky

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