ST DIP2450-01D3 2 G 5 G WLAN diplexer handbook
Contents
1. y DIP2450 01D3 2 G 5 G WLAN diplexer Datasheet production data Features B Low insertion loss in pass band m High attenuation levels m High rejection of out of band frequencies m Small footprint 1 4 mm Benefits B Very low profile 600 um after reflow High Q low loss High RF performance Tight tolerance Bill of materials and area reduction Applications B WLAN B Bluetooth m Mobile phone application B Wireless networking Description This diplexer targets the use of dual band 2 4 GHz and 5 GHz The DIP2450 01D3 is a diplexer dedicated to the WLAN BT application It is designed using STMicroelectronics IPD integrated passive device technology on non conductive glass substrate to optimize RF performance June 2012 This is information on a product in full production Flip Chip package 4 bumps Figure 1 Pin configuration bump view Doc ID 023193 Rev 1 1 10 www st com Characteristics DIP2450 01D3 1 Characteristics Table 1 Absolute rating limiting values H me vs Pay Average power Vesp ESD ratings antenna MIL STD883C HBM C 100 pF R 1 5 kQ air discharge and 2G Charged device model CDM ports Machine model MM C 200 pF R 25 Q L 500 nH Top Operating temperature range Table 2 Electrical characteristics and RF performance Tamp 25 C Pass band 2 G band pass 5 G band pass LEN Nominal impedance sap 2 G to antenna insertion2. ST products and services described herein and ST assumes no liability whatsoever relating to the choice selection or use of the ST products and services described herein No license express or implied by estoppel or otherwise to any intellectual property rights is granted under this document If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY FITNESS FOR A PARTICULAR PURPOSE AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES ST PRODUCTS ARE NOT RECOMMENDED AUTHORIZED OR WARRANTED FOR USE IN MILITARY AIR CRAFT SPACE LIFE SAVING OR LIFE SUSTAINING APPLICATIONS NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY DEATH OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ST PRODUCTS WHICH ARE NOT SPECIFIED AS AUTOM
3. loss 2400 to 2483 5 MHz o6 07 dB 5 G to antenna insertion loss 4900 to 5850 MHz o6 07 dB Attenuation 2 G to antenna attenuation 4900 to 5850 MHz 30 B 5 G to antenna attenuation 2400 to 2483 5 MHz 18 dB Out of band attenuation w Iw I 1 3 2 G to antenna attenuation 7000t09500MHz 9 Sere uw i mt queue www ui 1e 9 2 10 Doc ID 023193 Rev 1 DIP2450 01D3 Characteristics 1 1 Measured performance Figure 2 2 Gand 5 G forward transmission Figure 3 2G 5 Gand antenna reflection Tamp 25 C coefficient Tamb 25 C 21 and S31 dB 11 S22 and S33 dB 0 10 20 2 S21 2 G gt ANT S11 ANT S31 5 G gt ANT E S22 2 G S33 5 G F GHz T F GHz Figure 4 2 G insertion loss Tamp 25 C Figure 5 2 Gattenuation in 5 G band Tamb 25 C S21 dB S21 dB 10 20 30 40 7 50 60 F GHz m F GHz 4 9 5 7 Figure 6 2 G attenuation in high frequency Figure 7 2 G return loss Tamp 25 C band T amp 25 C S22 dB G Doc ID 023193 Rev 1 3 10 Characteristics DIP2450 01D3 Figure 8 Antenna return loss in 2 G band Figure 9 Antenna return loss in 5 G band Tamp 7 25 C Tamb 25 C S11 dB 49 S11 9B 4 F GHz F GHz E GHz GHz 2 46 2 48 2 50 Figure 10 5 G insertion loss Tamp 25 C Figure 11 5 G attenuation in 2 G band Ta
4. OTIVE GRADE MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK Resale of ST products with provisions different from the statements and or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever any liability of ST ST and the ST logo are trademarks or registered trademarks of ST in various countries Information in this document supersedes and replaces all information previously supplied The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners 2012 STMicroelectronics All rights reserved STMicroelectronics group of companies Australia Belgium Brazil Canada China Czech Republic Finland France Germany Hong Kong India Israel Italy Japan Malaysia Malta Morocco Philippines Singapore Spain Sweden Switzerland United Kingdom United States of America www st com 10 10 Doc ID 023193 Rev 1 Ay
5. m 630 um 60 um Figure 20 Footprint Figure 21 Marking oe pad EE um recommende Dot ST 2 i ot ogo 62 pm maximum ECOPACK status Sold k ing xx marking 300 SUA Sa Z manufacturing location yww datecode y year Solder stencil opening 220 um recommended ww week d Doc ID 023193 Rev 1 7 10 Package information DIP2450 01D3 Figure 22 Flip Chip tape and reel specifications 1 50 0 10 0 20 0 02 I 4 o T o L 2 o qa e co 0 71 0 05 1 20 0 05 a User direction of unreeling All dimensions in mm x 8 10 Doc ID 023193 Rev 1 DIP2450 01D3 Ordering information 4 Ordering information Table 3 Ordering information DIP2450 01D3 Flip Chip 1 88mg 5000 Tape and reel 7 Revision history Table 4 Document revision history BEN GENE QN 27 June 2012 Initial release Doc ID 023193 Rev 1 9 10 DIP2450 01D3 Please Read Carefully Information in this document is provided solely in connection with ST products STMicroelectronics NV and its subsidiaries ST reserve the right to make changes corrections modifications or improvements to this document and the products and services described herein at any time without notice All ST products are sold pursuant to ST s terms and conditions of sale Purchasers are solely responsible for the choice selection and use of the
6. mp 25 C 0 49 93 dB LLLI e P i91 G o o aaa eee ENNEN 0 65 60 id 1 Le a or 4 9 5 1 5 3 5 5 5 7 5 9 2 40 2 42 2 44 2 46 2 48 2 50 Figure 12 5 G attenuation in high frequency Figure 13 5 G return loss Tamp 25 C band Tampb 25 C S31 dB ap S33 dB F GHz SZA 4 10 Doc ID 023193 Rev 1 DIP2450 01D3 Characteristics Figure 14 2 G to 5G isolation Tamb 225 C Figure 15 2 G to 5 G isolation in 2 G band Tamb 25 C S23 dB 4 amp 4 923 dB 0 5 10 15 F GHz F GHz 40 l k k 2 40 2 42 2 44 2 46 2 48 2 50 Figure 16 2 G to 5 G isolation in 5 G band Tamp 25 C S23 dB F GHz d Doc ID 023193 Rev 1 5 10 Application information DIP2450 01D3 2 Application information Figure 17 Application schematic 5GHz Td 2GHz Tx gt 5GHz Rx 2GHz Rx lt Figure 18 PCB recommendation ANT Pad diameter 220 um distance from ground 100 um 6 10 Doc ID 023193 Rev 1 ky DIP2450 01D3 Package information 3 Package information In order to meet environmental requirements ST offers these devices in different grades of ECOPACK packages depending on their level of environmental compliance ECOPACK specifications grade definitions and product status are available at www st com ECOPACK is an ST trademark Figure 19 Package dimensions 0255 um 40 u
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ST DIP2450 01D3 2 G 5 G WLAN diplexer handbook