ST DCPL-WB-02D3 Wide-band dual-path directional coupler with integrated 50 ohm loaded isolated port handbook
Contents
1. y DCPL WB 02D3 Wide band dual path directional coupler with integrated 50 ohm loaded isolated port Datasheet production data Features 50 Q nominal input output impedance Wide operating frequency range 2400 MHz 5850 MHz Low insertion loss High ESD ruggedness Lead free CSP Small footprint 1670 x 1440 um Very low profile 600 um after reflow Benefits m High RF performance m RF module size reduction Applications Multi band equipment such as B Power amplifier module B Front end module B WLAN June 2012 Figure 1 Pin configuration bump view Description The DCPL WB 02D3 is a wide band dual path directional coupler designed to measure transmission output power in WLAN applications This dual path CPL has been customized for wide band operating frequencies 2G 5G WLAN with low insertion losses in the transmission bandwidth 2400 MHz 5850 MHz This device is built with two different RF couplers one dedicated to LB the other dedicated to HB sharing the same coupled ports Isolated port is loaded with an integrated 50 Q resistor The DCPL WB 02D3 has been designed using SIMicroelectronics IPD integrated passive device technology on non conductive glass substrate to optimize RF performance The device is delivered 100 tested in tape and reel Doc ID 023285 Rev 1 1 8 This is information on a product in full production www st com 2 8 Characteristics DCPL WB 02. FITNESS FOR A PARTICULAR PURPOSE AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES ST PRODUCTS ARE NOT RECOMMENDED AUTHORIZED OR WARRANTED FOR USE IN MILITARY AIR CRAFT SPACE LIFE SAVING OR LIFE SUSTAINING APPLICATIONS NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY DEATH OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ST PRODUCTS WHICH ARE NOT SPECIFIED AS AUTOMOTIVE GRADE MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK Resale of ST products with provisions different from the statements and or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever any liability of ST ST and the ST logo are trademarks or registered trademarks of ST in various countries Information in this document supersedes and replaces all information previously supplied The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners 2012 STMicroelectronics All rights reserved STMicroelectronics group of companies Australia Belgium Brazil Canada China Czech Republic Finland France Germany Hong Kong India Israel Italy Japan M
3. ome m NEN 18 Jun 2012 Initial release Doc ID 023285 Rev 1 7 8 DCPL WB 02D3 Please Read Carefully Information in this document is provided solely in connection with ST products STMicroelectronics NV and its subsidiaries ST reserve the right to make changes corrections modifications or improvements to this document and the products and services described herein at any time without notice All ST products are sold pursuant to ST s terms and conditions of sale Purchasers are solely responsible for the choice selection and use of the ST products and services described herein and ST assumes no liability whatsoever relating to the choice selection or use of the ST products and services described herein No license express or implied by estoppel or otherwise to any intellectual property rights is granted under this document If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY
4. WB 02D3 Package information 4 Package information In order to meet environmental requirements ST offers these devices in different grades of ECOPACK packages depending on their level of environmental compliance ECOPACK specifications grade definitions and product status are available at www st com ECOPACK is an ST trademark Figure 4 Package dimensions 255 um 40 um 630 um 60 E E o LO H E E t 1 1 67 mm 50 um 4 Figure 5 Footprint Figure 6 Marking Dot ST logo Copper pad diameter ECOPACK status 220 um recommended xx marking z manufacturing Solder mask opening location 300 um minimum yww datecode y year ww week Solder stencil opening 220 um recommended d Doc ID 023285 Rev 1 5 8 Package information DCPL WB 02D3 Figure 7 Tape and reel specifications User direction of unreeling All dimensions in mm typical values Note More packing information is available in the STMicroelectronics Application notes AN2348 IPAD 400 um Flip Chip package description and recommendations for use AN1751 EMI Filters recommendations and measurements x 6 8 Doc ID 023285 Rev 1 DCPL WB 02D3 Ordering information 5 Ordering information Table 5 Ordering information DCPL WB 02D3 Flip Chip 5000 Tape and reel 7 Revision history Table 6 Document revision history
5. 2D3 Characteristics Table 1 Absolute maximum rating limiting values vae Symbol Parameter TED es ranore oana 3 ww Done Mee se somsa V es com Shane evee meae eozer ano m V we oeme O e ee Table 2 Electrical characteristics impedances Tamp 25 C Value Nominal output impedance LB and HB paths rs NEN a lt Doc ID 023285 Rev 1 DCPL WB 02D3 Characteristics Table 3 Electrical characteristics LB WLAN path RF performance Tamb 25 C Symbol Parameter Test condition Typ fat From 2400 MHz RL LB path return loss From 2400 MHz LB IN OUT pins to 2500 MHz CPLDig CPLDig LB LB path coupling factor coupling LB path coupling factor at 2 45 at245GHz ILI 2400 MHz Table 4 Electrical characteristics HB WLAN path RF performance Tamp 25 C Symbol Parameter Test condition Typ dua pm From 4900 MHz ILL HB HB path insertion oss insertion HB path insertion toss to 5850 MHz ee HB path return loss From 4900 MHz IN OUT pins to 5850 MHz CPLDyp HB path coupling factor at 5 375 at5375GHz EE 4900 MHz Doc ID 023285 Rev 1 3 8 d PCB recommendation DCPL WB 02D3 2 PCB recommendation Figure2 Recommended land pattern 3 Ordering information scheme Figure 3 Ordering information scheme Dual high directivity coupler Wide band Version D3 Bump diameter 255 um 4 8 Doc ID 023285 Rev 1 oZ DCPL
6. alaysia Malta Morocco Philippines Singapore Spain Sweden Switzerland United Kingdom United States of America www st com 8 8 Doc ID 023285 Rev 1 ky
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ST DCPL WB 02D3 Wide band dual path directional coupler with integrated 50 ohm loaded isolated port