ST EMIF01-TV01F3 Single line IPAD EMI filter ESD protection handbook
Contents
1. 4 Doc ID 12078 Rev 3 EMIF01 TV01F3 Revision history 6 Revision history Table 4 Document revision history Date Revision Changes 09 Feb 2006 1 Initial release Updated ECOPACK statement Updated Figure 9 Figure 10 and Figure 13 Reformatted to current standards 28 Apr 2008 2 26 May 2011 3 Updated figure in Table 2 Updated ECOPACK statement ky Doc ID 12078 Rev 3 7 8 EMIF01 TV01F3 Please Read Carefully Information in this document is provided solely in connection with ST products STMicroelectronics NV and its subsidiaries ST reserve the right to make changes corrections modifications or improvements to this document and the products and services described herein at any time without notice All ST products are sold pursuant to ST s terms and conditions of sale Purchasers are solely responsible for the choice selection and use of the ST products and services described herein and ST assumes no liability whatsoever relating to the choice selection or use of the ST products and services described herein No license express or implied by estoppel or otherwise to any intellectual property rights is granted under this document If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services or any intellectual property contained therein or2. ky EMIF01 TV01F3 Single line IPAD M EMI filter and ESD protection Features EMI symmetrical I O low pass filter High efficiency EMI filtering Lead free package 400 um pitch Very low PCB space occupation 0 6 mm Very thin package 0 6 mm High reliability offered by monolithic integration Reduction of parasitic elements through CSP integration Complies with the following standards m IEC 61000 4 2 level 4 on internal and external pins 15 RV air discharge 8 RV contact discharge m MIL STD 883F Method 3015 7 Class 3 Application m TV analog signal in TV_OUT interface Description The EMIFO1 TVO1F3 is a highly integrated array designed to suppress EMI RFI noise and provide impedance matching for mobile phone and portable applications The EMIFO1 TVO1F3 is in a Flip Chip package to offer space saving and high RF performance This low pass filter includes ESD protection circuitry which prevents damage to the protected device when subjected to ESD surges up to 15 KV May 2011 Flip Chip 4 bumps Figure 1 Pin configuration bump side Pin A1 A2 A B 1 O Description Pin Description TV OUT internal B1 TV OUT external GND B2 GND 2 Figure 2 Device configuration TV out R Internal A1 TV out External B1 GND GND Doc ID 12078 Rev 3 TM IPAD is a trademark of STMicroelectronics 1 8 www st com Charact
3. 10 00 1 20 00 UY TV out 2900 1 external 10 V d 40 00 f Hz Eu ar 100 ns d 100 0k 1 0M 10 0M 100 0M Figure 5 ESD response to IEC61000 4 2 Figure 6 Line capacitance versus applied 15 kV air discharge voltage a Las CLINE PF F 1MHz __ i Vosc 30MV ans 7 30 T 25 C TV out 25 internal 10 V d 20 S ae are De ieee es pees eT 10 TV out 5 external Vine V 10 V d o 8 100 ns d 0 1 2 3 4 5 6 Doc ID 12078 Rev 3 3 8 Application information EMIF01 TV01F3 2 4 8 Application information Figure 7 Aplac model i Lbump Rbump Rline Rbump Lbump O1 2 e model d1 model d2 Rbump Rbump Lbump Lbump Figure8 Aplac parameters Variables aplacvar Rline 75 Diode D1 Diode D2 aplacvar C_d1 17 5p BV 7 BV 7 aplacvar C d2 17 5p IBV 1m IBV 1m aplacvar Ls 950pH CJO C di CJO C_d2 aplacvar Rs 150m M 0 28 M 0 28 aplacvar Lbump96pH RS 0 48 RS 0 7 aplacvar Rbump 20m VJ 0 6 VJ 0 6 aplacvar Lgnd 75pH TT 100n TT 100n Doc ID 12078 Rev 3 EMIF01 TV01F3 Ordering information seheme 3 Ordering information seheme Figure 9 Ordering information scheme EMIF yy xx zz Fx EMI Filter Number of lines Information x resistance value Ohms z capacitance value 10 pF or 2 letters application 2 digits version Package F Flip Chip x 3 Lead free pitch 400 um bump 255 um 4 Packa
4. considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY FITNESS FOR A PARTICULAR PURPOSE AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE ST PRODUCTS ARE NOT RECOMMENDED AUTHORIZED OR WARRANTED FOR USE IN MILITARY AIR CRAFT SPACE LIFE SAVING OR LIFE SUSTAINING APPLICATIONS NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY DEATH OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ST PRODUCTS WHICH ARE NOT SPECIFIED AS AUTOMOTIVE GRADE MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER S OWN RISK Resale of ST products with provisions different from the statements and or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever any liability of ST ST and the ST logo are trademarks or registered trademarks of ST in various countries Information in this document supersedes and replaces all inf
5. eristics EMIF01 TV01F3 2 8 Characteristics Table 1 Absolute maximum ratings Symbol Parameter and test conditions Value Unit Internal pins A1 and external pin B1 Vpp ESD discharge IEC 61000 4 2 air discharge 15 kV ESD discharge IEC 61000 4 2 contact discharge 8 Tj Maximum junction temperature 125 C Top Operating temperature range 30 to 85 C P Maximum power dissipation 80 C Tstg Storage temperature range 55 to 150 C Table 2 Electrical characteristics Tamp 25 C Symbol Parameters Van Breakdown voltage IRM Leakage current Van VnM _ Stand off voltage Vc Clamping voltage Rg Dynamic impedance lpp Peak pulse current Ryo Series resistance between Input amp Output Cline Input capacitance per line Symbol Test conditions Veser ig 1mA IM VRM 3V R Tolerance 5 96 Cine OV 75 30 Max 35 Unit pF Doc ID 12078 Rev 3 4 EMIF01 TV01F3 Characteristics ESD response to IEC61000 4 2 Figure 3 S21 db attenuation measurement Figure 4 15 kV air discharge sig OB l TV out l internal if 10 V d
6. ge information In order to meet environmental requirements ST offers these devices in different grades of ECOPACK packages depending on their level of environmental compliance ECOPACK specifications grade definitions and product status are available at www st com ECOPACK is an ST trademark Figure 10 Package dimensions l 1 400 um 40 605 um 5 185 um 10 um I 770 um z 30um 255 um 40 ky Doc ID 12078 Rev 3 5 8 Ordering information EMIF01 TV01F3 Note 6 8 Figure 11 Footprint Figure 12 Marking Dot xx marking z manufacturing location yww datecode Copper pad Diameter 220 um recommended 260 um maximum y year o ww week Solder mask opening 300 um minimum X X Z Solder stencil opening y wW wW 220 um recommended BWS Figure 13 Flip Chip tape and reel specification Dot identifying Pin A1 location 0or8 _ I i 0 71 0 05 O User direction of unreeling All dimensions in mm More information is available in the application notes AN2348 STMicroelectronics 400 micro metre Flip Chip Package description and recommendation for use AN1751 EMI filters Recommendations and measurements Ordering information Table 3 Ordering information Order code Marking Package Weight Base qty Delivery mode EMIFO1 TVO1F3 HC Flip Chip 0 79 mg 5000 Tape and reel 7
7. ormation previously supplied The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners 2011 STMicroelectronics All rights reserved STMicroelectronics group of companies Australia Belgium Brazil Canada China Czech Republic Finland France Germany Hong Kong India Israel Italy Japan Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom United States of America www st com 4 8 8 Doc ID 12078 Rev 3
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ST EMIF01 TV01F3 Single line IPAD EMI filter ESD protection handbook