Winbond ISD1700A Series handbook
Contents
1. Publication Release Date September 27 2006 252 Revision 1 3 S www DataSheet4U com amp Winbond Y Electronics Corp 4 PINOUT CONFIGURATION Vssa Analn MIC MIC Vsspz SP Voce Sp Vsspi AUD AUX AGC OO CO PN Oo oy BY OIN e N ow A2 ISD1700 ISD1700 SERIES V INT RDY FWD SOIC PDIP AGC AUD AUX Vsspi Sp 39 lo N o Jon 2 e mo a a VOL R CCA Osc e A Q ES ISD1700 ss SCLK MOSI MISO RESET LED V CCD Vsso INT RDY FWD ERASE REC PLAY FT www DataSheet4U com ISD1700 SERIES Winbond Electronics Corp 5 PIN DESCRIPTION PDIP TSOP FUNCTIONS SOIC Digital Power Supply Power supply for digital circuitry CEN RESET When active the device enters into a known state Master In Slave Out Data is shifted out on the falling edge of SCLK When the SPI is inactive SS high it s tri state MOSI Master Out Slave In Data input of the SPI interface when ISD1700 is a slave2. ISD1700 je EET ww 12 15 Speaker 13 or Buzzer AUD AUX 17 I 3900 i E b7 100 ko AUX INT RDY i Optional i At 8kHz sampling freq Rosc 80 K Digital ground V Analog ground W Ground for SP Wet Ground for SP 16 www DataSheet4U com g Winbond Electronics Corp ISD1700 SERIES Example 2 Recording using Analn input via push button controls At 8kHz sampling freq Rosc 80 K ISD1700 AUD AUX INT RDY Speaker or Buzzer Y Optional based upon the applications Digital ground NY Analog ground v Ground for SP Ground for SP ie Publication Release Date September 27 2006 Revision 1 3 S www DataSheet4U com ISD1700 SERIES Winbond Example 3 Connecting the SPI Interface to a microcontroller ISD1700 Speaker i V cc or Buzzer Speaker 1 AUD AUX L7 Kaave i e 3900 hr Zioa 0 1uF INT RDY 2 E Optional Y Optional based upon the applications At 8kHz sampling freq Rosc 80 K Digital ground Analog ground W Ground for SP 7 Ground for SP 10 1 GooD AUDIO DE
3. www DataSheet4U com ISD1700 SERIES Winbond Electronics Corp 11 3 28 LEAD 600 MiL PLASTIC DUAL INLINE PACKAGE PDIP 28 27 26 25 24 23 22 21 20 19 18 17 16 15 DS O a 1 2 3 4 5 6 7 amp 10 11 12 13 14 J F o Plastic Dual Inline Package PDIP P Dimensions INCHES MILLIMETERS Min Nom Max Min Nom Max A 1 445 1 450 1 455 36 70 36 83 36 96 B1 3 81 B2 1 65 1 78 1 91 C1 15 24 15 88 C2 0 530 0 540 0 550 13 46 13 72 13 97 D 4 83 D1 0 38 E 3 18 3 43 F 0 015 0 018 0 022 0 38 0 46 0 56 G 0 055 0 060 0 065 1 40 1 52 1 65 H 2 54 J 0 008 0 010 0 012 0 20 0 25 0 30 S 0 070 0 075 0 080 1 78 1 91 2 03 0 0 15 0 15 11 4 DIE INFORMATION For die info please conatct the local Winbond Sales Representatives Publication Release Date September 27 2006 21 Revision 1 3 S www DataSheet4U com ISD1700 SERIES Winbond 12 ORDERING INFORMATION Product Number Descriptor Key 1177100000000 Product Name MEN G Special Features Field l ISD Blank None 01 vAlert Product Series Tape amp Reel 17 1700 Blank None Duration R Tape amp Reel 30 20 60 secs 40 26 80 secs Temperature 50 33 100 secs Industrial 40 C to 85 C Blank Commercial 60 40 120 secs Package Type e Die OC to 50 C 90 60 180 secs X Die e Package 0 C to 70 C 120 80 24 neut E Thin Small Outline Package TSOP oud Five T90 300 900 s
4. Tg or Topa d gt lt gt lt gt UU M ea Note If SEs are recorded then Sp will have output Figure 12 5 Global Erase Operation with or without Sound Effects 10 www DataSheet4U com ISD1700 SERIES Winbond Device returns to Power Down state Figure 12 6 Reset Operation T i set Sc2 T Tru Tin Figure 12 7 Playback Operation with ramp up and ramp down effect at AUD output Publication Release Date September 27 2006 Te Revision 1 3 S www DataSheet4U com ISD1700 SERIES AT g Winbond SEHD Electronics Corp 7 2 SPI OPERATION TRISTATE Figure 12 8 SPI Operation The value shown is based upon 8 kHz sampling frequency Delay increases proportionally for slower sampling frequency www DataSheet4U com a dos ISD1700 SERIES Winbond Electronics Corp 8 ABSOLUTE MAXIMUM RATINGS ABSOLUTE MAXIMUM RATINGS DIE CONDITIONS VALUES Junction temperature 150 Storage temperature range 65 C to 150 C Voltage Applied to any pads Vss 0 3V to Vcc 0 3V Power supply voltage to ground potential 0 3V to 7 0V ABSOLUTE MAXIMUM RATINGS PACKAGED PARTS CONDITIONS VALUES Junction temperature 150 C Storage temperature range 65 C to 150 C Voltage Applied to any pins Vss 0 3V to Vcc 0 3V Voltage applie
5. address locations for multiple messages This unique feature provides sophisticated messaging flexibility in a simple push button environment The devices include an on chip oscillator with external resistor control microphone preamplifier with Automatic Gain Control AGC an auxiliary analog input anti aliasing filter Multi Level Storage MLS array smoothing filter volume control Pulse Width Modulation PWM Class D speaker driver and current voltage output The ISD1700 devices also support an optional vAlert voiceAlert feature that can be used as a new message indicator With vAlert the device flashes an external LED to indicate that a new message is present Besides four special sound effects are reserved for audio confirmation of operations such as Start Record Stop Record Erase Forward Global Erase and etc Recordings are stored into on chip Flash memory providing zero power message storage This unique single chip solution is made possible through Winbond s patented Multi Level Storage MLS technology Audio data are stored directly in solid state memory without digital compression providing superior quality voice and music reproduction Voice signals can be fed into the chip through two independent paths a differential microphone input and a single ended analog input For outputs the ISD1700 provides a Pulse Width Modulation PWM Class D speaker driver and a separate analog output simultaneous
6. D O Sb1720 0 0 PRELIMINARY EM inbond ISD1700 Series Multi Message Single Chip Voice Record amp Playback Devices Publication Release Date September 27 2006 Revision 1 3 8 www DataSheet4U com ISD1700 SERIES Winbond TABLE OF CONTENTS 1 GENERAL DESCRIPTION n cnn a rn naar nnne nnn en rennen nnn nnn sn nete 3 2 FEATURES retro A dr e a ne ee e SE 4 3 BLOCK DIAGRAM scent rete ied ubere ss dd tette Ded ue bd itte baud od etse edlen A ala adus 5 4 PINOUT CONFIGURATION oa eerie tone tenete ce e nies ieee at der eae e a e tea dd 6 5 JPINL DESOCRIPTION otia t Ro Ro tpe eei aai A pene ed eee bh GDA e aen aaa 7 6 MODES OF OPERATIONS treat arara rns n nnn interrete nnn nennt nnne ns 8 6 1 Standalone Push Button Mode ssssssssseeee eene enne nnn nnne nennen 8 6 2 SPI Mode iii da tido 8 7 TIMING DIAGRAMS ide ir db daa 8 G1 Standalone Operalion retenta en e NUR RR ERN dd a ata aa 8 22 SPI Operation eti te ade ERR ida diana GASTAR 12 8 ABSOLUTE MAXIMUM RATINGS Siiran EEEa nennen nnn enter aaa nens 13 8 1 Operating Conditions rr nennen nennen ner rn nennen nennen enne 13 9 ELECTRICAL CHARACTERISTICS sprecio ennistada enne nnne nennen nettes 14 9 1 DC Parameters erica 14 9 2 AG Parameters iii diia 15 10 TYPICAL APPLICATION CIRCUITS er nennen nennen nnne nennen 16 10 1 Good Audio Design Practices 2 1 iret credis e
7. Data is latched into the device on the Ru ee TC edge of SCLK SCLK Ss pz Serial Clock ClockoftheSPlinteface Clock Clock of the SPI interface Slave Select Selects as a slave device and enables the SPI interface ATEO T a a C Anan 9 2 Analn Auxliary analog input to the device for recording or feec hrough mice 10 3 Ms Nor invertng input of the differential microphone signal C me 1 4 mc inverting input of the diferential microphone signal s 13 6 SP The negative Class D PWM speaker output pe 15 e SP The postive Class D PWM speaker output C Vem 18 9 Ground Ground path for postive PWM speaker arve AUD AUX Auxiliary Output Either an AUD current or AUX vola output Automatic Gain Control AGC The AGC adjusts the gain of the mircophone preamplifier circuitry a te Volume This control has 8 levels of volume adjustment Rosc 20 Oscillator Resistor A resistor determines the sample frequency of the device which sets the duration Na 21 14 Analog Power Supply Power supply for analog circuitry FT 22 15 Feed through Enable the feed through path for Analn signal to the outputs PLAY 23 16 Playback Plays the recorded message individually or plays messages sequential in a looping mode REG 24 17 Record When active starts recording message EAN Erase When active can erase individual message or do global erase MT Forward Advances to the next message fro
8. SIGN PRACTICES To ensure the highest quality of voice reproduction it is important to follow good audio design practices in layout and power supply decoupling See recommendations from below links or other Application Notes in our websites Design Considerations for ISD1700 Family AN CC1002 Design Considerations for ISD1700 Family pdf Good Audio Design Practices http www winbond usa com products isd products chipcorder applicationinfo apin11 pdf Single Chip Board Layout Diagrams http www winbond usa com products isd products chipcorder applicationinfo apin12 pdf 18 www DataSheet4U com ISD1700 SERIES g Winbond Electronics Corp 11 PACKAGING 11 1 28 LEAD 8X13 4MM PLASTIC THIN SMALL OUTLINE PACKAGE TSOP TYPE 1 IQC Hp D F e s E b li 0 a MN RL L AM CY Li Dimension in Inches Nom Max in Max 0 047 1 20 0 006 0 15 0 041 1 05 0 011 0 27 0 008 0 21 Publication Release Date September 27 2006 19 Revision 1 3 S www DataSheet4U com ISD1700 SERIES Winbond Electronics Corp 11 2 28 LEAD 300 MiL PLASTIC SMALL OUTLINE INTEGRATED CIRCUIT SOIC 28 27 26 25 24 23 22 21 20 19 18 17 16 15 Max 18 06 2 64 7 59 0 29 0 48 10 41 1 02 Note Lead coplanarity to be within 0 004 inches 20
9. d to any pin Input current limited to 20 mA Vas 1 0V to Vcc 1 0V Power supply voltage to ground potential 0 3V to 7 0V M Stresses above those listed may cause permanent damage to the device Exposure to the absolute maximum ratings may affect device reliability Functional operation is not implied at these conditions 8 1 OPERATING CONDITIONS OPERATING CONDITIONS DIE Supply voltage Vc Ground voltage Vss Hu input voltage Vc Vss 0 3 V to Vac 403 V OPERATING CONDITIONS PACKAGED PARTS CONDITIONS VALUES Operating temperature range Case temperature 40 C to 85 C Supply voltage Vo 2 4V to 5 5V Ground voltage Vss Input voltage Vpp OV to 5 5V Voltage applied to any pins Vss 0 3V to Voo 0 3V 1 l Vee Veca Vcco Voce 2 a Vss Vssa Vssp Vssp1 Vssp2 Publication Release Date September 27 2006 213 Revision 1 3 S www DataSheet4U com ISD1700 SERIES Minbond Electronics Corp 9 ELECTRICAL CHARACTERISTICS 9 1 DC PARAMETERS PARAMETER SYMBOL MN ve MAX UNTS CONDITIONS SupyVotag Vm 24 58 V o mputLow Voltage v Vss03 Joe V mputHignVotage v 0 7xV5p vo v Output Low Voltage Vo Vss03 O9 Va ma Output High Voltage Vow 07 Ve V kwe 16mAT Record Curent lesus 29 mA Voo 55V No load Playback Current oo semsa 20 mA Sampling freq 12 kHz E
10. e aad ene ias e d X ELT eR ee Ls quado 18 JM e Ucllcpe e aaa inal aie eet Adee Rao ae SU NU eet 19 11 1 28 Lead 8x13 4mm Plastic Thin Small Outline Package TSOP Type 1 IQC 19 11 2 28 Lead 300 Mil Plastic Small Outline Integrated Circuit SOIC 20 11 3 28 Lead 600 Mil Plastic Dual Inline Package PDIP sse 21 11 4 Die INTOMAION ica at 21 12 ORDERING INFORMATION eren e a UEa a a a nnn nnne nns 22 19 VERSION HISTORY secos gedacht e Roe eese dan Cr ee aede o edu aea deae RE Tae aa 23 De www DataSheet4U com ISD1700 SERIES 1 GENERAL DESCRIPTION The Winbond ISD1700 ChipCorder Series is a high quality fully integrated single chip multi message voice record and playback device ideally suited to a variety of electronic systems The message duration is user selectable in ranges from 26 seconds to 120 seconds depending on the specific device The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an external resistor giving the user greater flexibility in duration versus recording quality for each application Operating voltage spans a range from 2 4 V to 5 5 V to ensure that the ISD1700 devices are optimized for a wide range of battery or line powered applications The ISD1700 is designed for operation in either standalone or microcontroller SPI mode The device incorporates a proprietary message management system that allows the chip to self manage
11. ecs S Small Outline Integrated Circuit Lead Free 180 120 360 secs SOIC Package 210 140 420 secs P Plastic Dual Inline Package PDIP 240 160 480 secs When ordering ISD1700 devices please refer to the above ordering scheme Conatct the local Winbond Sales Representatives for any questions and the availability For the latest product information please contact the Winbond Sales Rep or access Winbond s worldwide web site at http www winbond usa com ye www DataSheet4U com g Winbond Electronics Corp 13 VERSION HISTORY ISD1700 SERIES VERSION DATE DESCRIPTION 1 3 S Sep 2006 Initial version 223 Publication Release Date September 27 2006 Revision 1 3 S www DataSheet4U com ISD1700 SERIES Winbond Winbond products are not designed intended authorized or warranted for use as components in systems or equipment intended for surgical implantation atomic energy control instruments airplane or spaceship instruments transportation instruments traffic signal instruments combustion control instruments or for other applications intended to support or sustain life Furthermore Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury death or severe property or environmental damage could occur Winbond customers using or selling these products for use in such applica
12. haracterization data shows that sampling frequency resolution is 5 percent across temperature and voltage ranges Bl Characterization data shows that duration resolution is 5 percent across temperature and voltage ranges PI Vec 2 4 V 5 5V Pl K 1024 1M15K FS 15 5K Fs 4KFs 4KFs E Publication Release Date September 27 2006 E fo Revision 1 3 8 www DataSheet4U com ISD1700 SERIES Winbond 10 TYPICAL APPLICATION CIRCUITS The following typical applications examples on ISD1700 Series are for references only They make no representation or warranty that such applications shall be suitable for the use specified Each design has to be optimized in its own system for the best performance on voice quality current consumption functionalities and etc The below notes apply to the following applications examples These capacitors may be needed in order to optimize for the best voice quality which is also dependent upon the layout of the PCB Depending on system requirements they can be 10 uF 4 7 uF or other values Please refer to the applications notes or consult Winbond for layout advice It is important to have a separate path for each ground and power back to the related terminals to minimize the noise Also the power supplies should be decoupled as close to the device as possible kk Example 1 Recording using microphone input via push button controls
13. ly The PWM can directly drive a standard 80 speaker or typical buzzer while the separate analog output can be configured as a single ended current or voltage output to drive an external amplifier While in Standalone mode the ISD1700 devices automatically enter into power down mode for power conservation after an operation is completed In the SPI mode the user has full control via the serial interface in operating the device This includes random access to any location inside the memory array by specifying the start address and end address of operations SPI mode also allows access to the Analog Path Configuration APC register This register allows flexible configuration of audio paths inputs outputs and mixing The APC default configuration for standalone mode can also be modified by storing the APC data into a non volatile register NVCFG that is loaded at initialization Utilizing the capabilities of ISD1700 Series designers have the control and flexibility to implement voice functionality into the high end products Notice The specifications are subject to change without notice Please contact Winbond Sales Offices or Representatives to verify current or future specifications Also refer to the website for any related application notes Publication Release Date September 27 2006 235 Revision 1 3 S www DataSheet4U com ISD1700 SERIES a Winbond GH eH Nd Electronics Corp 2 FEATURES Integrated message management sy
14. m the current location An open drain output Can review ready or interrupt status Digital Ground Ground path for digital circuitry Publication Release Date September 27 2006 STs Revision 1 3 8 www DataSheet4U com ISD1700 SERIES Winbond 6 MODES OF OPERATIONS The ISD1700 Series can operate in either Standalone Push Button or microcontroller SPI mode 6 1 STANDALONE PUSH BUTTON MODE One can utilize the REC PLAY FT FWD ERASE VOL or RESET control to initiate a desired operation As completed the device automatically enters into the power down state 6 2 SPIMODE In SPI mode control of the device is achieved through the 4 wire serial interface via SPI commands For technical details please refer to the design guide 7 TIMING DIAGRAMS The following estimated timing diagrams are not in proper scale 7 1 BASIC OPERATION Figure 12 1 Record Operation with No Sound Effect www DataSheet4U com ISD1700 SERIES g Winbond Electronics Corp Tso Tso2 Tru Tim Oo Figure 12 2 Start and Stop Playback Operation Figure 12 3 Single Erase Operation with No Sound Effect Publication Release Date September 27 2006 9 Revision 1 3 8 www DataSheet4U com ISD1700 SERIES d Winbond Electronics Corp Figure 12 4 Forward Operation with No Sound Effect Mes Teror let gore 3x T gy or Tops Tora
15. ny integrated circuit contained in this publication are for illustration only and Winbond makes no representation or warranty that such applications shall be suitable for the use specified The 100 year retention and 100K record cycle projections are based upon accelerated reliability tests as published in the Winbond Reliability Report and are neither warranted nor guaranteed by Winbond This product incorporates SuperFlash This datasheet and any future addendum to this datasheet is are the complete and controlling ISD ChipCorder product specifications In the event any inconsistencies exist between the information in this and other product documentation or in the event that other product documentation contains information in addition to the information in this the information contained herein supersedes and governs such other information in its entirety This datasheet is subject to change without notice Copyright 2005 Winbond Electronics Corporation All rights reserved ChipCorder and ISD are trademarks of Winbond Electronics Corporation SuperFlash is the trademark of Silicon Storage Technology Inc All other trademarks are properties of their respective owners Winbond Electronics Corp Headquarters No 4 Creation Rd III Science Based Industrial Park Hsinchu Taiwan TEL 886 3 5770066 FAX 886 3 5665577 http www winbond com tw Taipei Office 9F No 480 Pueiguang Rd Neihu District Taipei 114 Tai
16. rase Curent hose 20 ma Standby Curent lo os 1 MA Wop 58V 125008 mpuleskageCumet ie WA Force Von nput Current Low leo 3 40 pa Force Vss others at Voc Preamp Input Impedance Ruwc Rwc 7 kQ PowerupAGC Analn Input Impedance Rann 42 kQ j Whnenacive MIC Differential Input Vin 15 300 mV PeaktoPeak Analn Input Voltage Vo 1 V Peakto Peak Gain from MIC to SP Amsp 40 Vin 15 300 mV AGC 4 7 UF Vcc 2 4V 5 5V Speaker Output Load Rex 8 OQ Across both Speaker pins AUX Output Load Rw 5 ko When active Speaker Output Power peo mW Vo 55V Wen sis mw Vea tte me E ew vev Ah Rax 49 mW Vo 24V 50 Speaker Output Voltage Vouri Vop V Rspk 80 Speaker Typical buzzer AUX Output Swing Yom J V AUX Output DC Level Vos 12 V Whenacive AUD o j 30 Von 74 5 V Rexr 390 0 Volume Output Aval O to 28 8 steps of 4dB each reference to output Total Harmonic Distortion VI RS O ei 15 mV p p 1 kHz sine wave Cmessage weighted Notes Conditions Vcc 4 5V 8 kHz sampling frequency and T4 25 C unless otherwise stated B LED output during Record operation Vcca Veco and Vecp are connected together Vssa Vssp1 Vsspz and Vssp are connected together REC PLAY FT FWD ERASE VOL and RESET must be at Veco B Balanced input
17. signal applied between MIC and MIC as shown in the applications example Single ended MIC or MIC input is recommended no more than 150 mV p p BI 14 www DataSheet4U com ISD1700 SERIES Winbond Electronics Corp 9 2 AC PARAMETERS CHARACTERISTIC svweo min TYP Max UNITS CONDITIONS Samping Frequency t 4 n e uration fa saora se TT Risngtme m o me FalingTime m 9 nsec DebuxeTme Ta M me Ramp Uptime Tw GF msec Ramp Down Time To MF _ msec Initial Scan Time after Ts DRN 8 Fs msec DRN device row power is applied Initial Scan Time from PD Tsc DRN 16 Fs msec After a PB operation state is run Y L L ec 4 5 NE p LED Flash Time for SET ns SSKFs LED Flash Time for SE2 Tiss 7 5KIFs LED Flash Time for SES Tis LED Flash Time for SE4 Tias SET Recorded Duration Tse ISE2 Recorded Duration Tse SES Recorded Duration Tee SEA Recorded Duration Tse EraseTime re rOMRNES sec WRcmessagerow Global Erase Time Te ams se RESET Puse Tem 1 asec MES Settle Time reas zm me MT Settle Time after Reset Teo oms msec 7 LED Eror Time Te 27 SKF me MT LED Cycle frequency To 1 4 te Pending upon Fe Notes Typical values Vcc 4 5 V Fs 8 kHz and Ta 25 C unless otherwise stated Bl C
18. stems for single chip push button applications REC level trigger for recording PLAY edge trigger for individual message or level trigger for looping playback sequentially ERASE edge triggered erase for first or last message or level triggered erase for all messages FWD edge trigger to advance to the next message or fast message scan during the playback VOL 8 levels output volume control RDY INT ready or busy status indication o RESET return to the default state o Automatic power down after each operation cycle OOo 00 0 0 e Selectable sampling frequency controlled by an external oscillator resistor Sampling Frequency 12 kHz 8 kHz 6 4 kHz 5 3 kHz 4 kHz Rosc 60 KQ 80 ko 100 ko 120 ko 160 ko e Selectable message duration o A wide range selection from 30 secs to 240 secs at 8 kHz sampling frequency Message and operation indicators o Four customizable Sound Effects SEs for audible indication o Optional vAlert voiceAlert to indicate the presence of new messages o LED stay on during recording blink during playback forward and erase operations 12kHz BkHz 64kHz_ 37 secs 50secs 62secs 75secs 112 secs 150 secs 187 secs 225 secs 262 secs 300 secs 53kHz 4 kHz Dual operating modes o Standalone mode Integrated message management techniques Automatic power down after each operation cycle o SPI mode Fully user selectable and controllable op
19. tions do so at their own risk and agree to fully indemnify Winbond for any damages resulting from such improper use or sales The contents of this document are provided only as a guide for the applications of Winbond products Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice No license whether express or implied to any intellectual property or other right of Winbond or others is granted by this publication Except as set forth in Winbond s Standard Terms and Conditions of Sale Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability fitness for a particular purpose or infringement of any Intellectual property The contents of this document are provided AS IS and Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability fitness for a particular purpose or infringement of any Intellectual property In no event shall Winbond be liable for any damages whatsoever including without limitation damages for loss of profits business interruption loss of information arising out of the use of or inability to use the contents of this documents even if Winbond has been advised of the possibility of such damages Application examples and alternative uses of a
20. tions via APC register and various SPI commands Two individual input channels o MIC MIC differential microphone inputs with AGC Automatic Gain Control o Analn single ended auxiliary analog input for recording or feed through Dual output channels o Differential PWM Class D speaker outputs directly drives an 8 O speaker or a typical buzzer o Configurable AUD current or AUX voltage single ended output drives external aduio amplifier e ChipCorder standard features High quality natural voice and audio reproduction 2 4V to 5 5V operating voltage 100 year message retention typical 100 000 record cycles typical O o OO www DataSheet4U com ISD1700 SERIES Winbond Temperature options o Commercial 0 C to 50 C die 0 C to 70 C packaged units o Industrial 40 C to 85 C packaged units Packaging types available in die PDIP SOIC and TSOP e Package option Lead free packaged units 3 BLOCK DIAGRAM Sampling Clock Internal Clock EM Anti Aliasing Nonvolatile Filter Multi Level Storage Smoothing Volume Array D Filter Control AG Amp Automatic e Gain Control Timing Power Conditioning Device Control SPI Interface illiid 4 Ld d Veca Vssa Vece Vsse1 Vaso Vsso Veco REC PLAY ERASE FWD FT RESET VOL INT RDY LED SS SCLK MOSI MISO
21. wan TEL 886 2 81777168 FAX 886 2 87153579 Winbond Electronics Corporation America 2727 North First Street San Jose CA 95134 U S A TEL 1 408 9436666 FAX 1 408 5441797 http www winbond usa com Winbond Electronics Corporation Japan 7F Daini ueno BLDG 3 7 18 Shinyokohama Kohokuku Yokohama 222 0033 TEL 81 45 4781881 FAX 81 45 4781800 Please note that all data and specifications are subject to change without notice All the trademarks of products and companies mentioned in this datasheet belong to their respective owners 24 Winbond Electronics Shanghai Ltd 27F 299 Yan An W Rd Shanghai 200336 China TEL 86 21 62365999 FAX 86 21 62356998 Winbond Electronics H K Ltd Unit 9 15 22F Millennium City No 378 Kwun Tong Rd Kowloon Hong Kong TEL 852 27513100 FAX 852 27552064 www DataSheet4U com
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Winbond ISD1700A Series handbook