ST TEA2025 handbook
Contents
1. Figure 9 Output Power vs Supply Voltage THD 10 f 1KHz Po W 3 5 Figure 10 THD versus Output Power f 1KHz Vs 6V 4 11 TEA2025 3 APPLICATION INFORMATION 3 1 Input Capacitor Input capacitor is PNP type allowing source to be referenced to ground In this way no input coupling capacitor is required However a series capacitor 0 22 uF to the input side can be useful in case of noise due to variable resistor contact 3 2 Bootstrap The bootstrap connection allows to increase the output swing The suggested value for the bootstrap capacitors 100uF avoids a reduction of the output signal also at low frequencies and low supply voltages 3 3 Voltage Gain Adjust 3 3 1 STEREO MODE The voltage gain is determined by on chip resistors R1 and R2 together with the external RfC1 series con nected between pin 6 11 and ground The frequency response is given approximated Vout _ R1 VN Rf R2 1 JWC1 With Rf 0 C1 100 uF the gain results 46 dB with pole at f 32 Hz THE purpose of Rf is to reduce the gain It is recommended to not reduce it under 36 dB 3 3 2 BRIDGE MODE Figure 11 T H8STED2825B 11 The bridge configuration is realized very easily thanks to an internal voltage divider which provides at pin 1 the CH 1 output signal after reduction It is enough to connect pin 6 inverting input of CH 2 with a capacitor to pin 1 and to connect to ground2. the pin 7 The total gain of the bridge is given by Vout _ R1 R3 R1 VN Rf R2 R4no I R4 JWC1 JWC1 and with the suggested values C1 C2 100 uF Rf 0 means Gv 52 dB with first pole at f 32 Hz y C 5 11 TEA2025 Figure 12 HBSTER2E255 12 3 4 Output Capacitors The low cut off frequency due to output capacitor depending on the load is given by F with Cour 470mF RI 4 ohm it means F 80 Hz A 3 5 Pop Noise Most amplifiers similar to TEA 2025B need external resistors between DC outputs and ground in order to optimize the pop on off performance and crossover distortion Figure 13 OUT MBSTEAZO2Z5 8 16 The TEA 2025B solution allows to save components because of such resistors 800 ohm are included into the chip 3 6 Stability A good layout is recommended in order to avoid oscillations Generally the designer must pay attention on the following points Short wires of components and short connections No ground loops Bypass of supply voltage with capacitors as nearest as possible to the supply The low val ue poliester capacitors must have good temperature and frequency characteristics No sockets the heatsink can have a smaller factor of safety compared with that of a conventional circuit There is no device damage in the case of excessive junction temperature all that happens is that PO and IT 1572 TEA20
3. 0 min 8 max ddd 0 10 0 004 1 D dimension does not include mold flash protusions or gate burrs Mold flash protusions or gate burrs shall not exceed 0 15mm per side OUTLINE AND MECHANICAL DATA S 4 c WY gt NS 0 25 mm GAGE PLANE H k M 0016022 D 8 11 1572 TEA2025 Figure 15 DIP16 Mechanical Data amp Package Dimensions OUTLINE AND MAX MECHANICAL DATA 0 020 1 65 0 030 20 DIP16 lt 9 11 TEA2025 6 REVISION HISTORY Table 7 Revision History Date Revision Description of Changes September 2003 2 Updates not recorded 30 Apr 2010 3 Updated title and added environmental compliance statement for package 10 11 7 TEA2025 Please Read Carefully Information in this document is provided solely in connection with ST products STMicroelectronics NV and its subsidiaries ST reserve the right to make changes corrections modifications or improvements to this document and the products and services described herein at any time without notice All ST products are sold pursuant to ST s terms and conditions of sale Purchasers are solely responsible for the choice selection and use of the ST products and services described her
4. 25 therefore Ptot and Id are reduced 4 APPLICATION SUGGESTION The recommended values of the components are those shown on stereo application circuit of Fig 6 dif ferent values can be used the following table can help the designer Table 6 COMPONENT DE PURPOSE LARGER THAN SMALLER THAN C1 C2 0 22uF INPUT DC DECOUPLING IN CASE OF SLIDER CONTACT NOISE OF VARIABLE RESISTOR C3 100uF RIPPLE REJECTON DEGRADATION OF SVR INCREASE OF AT LOW FREQUENCY AND LOW VOLTAGE C4 C5 100uF BOOTSTRAP C6 C7 470uF OUTPUT DC INCREASE OF LOW DECOUPLING FREQUENCY CUTOFF C8 C9 0 15uF FREQUENCY STABILITY DANGEROF OSCILLATIONS C10 C11 100uF INVERTING INPUT DC INCREASE OFLOW DECOUPLING FREQUENCYCUTOFF 5 PACKAGE MECHANICAL DATA In order to meet environmental requirements ST offers these devices in different grades of ECOPACK packages depending on their level of environmental compliance ECOPACK specifications grade defi nitions and product status are available at www st com ECOPACK is an ST trademark 7 11 TEA2025 Figure 14 SO20 Mechanical Data amp Package Dimensions mm inch DIM MIN TYP MAX MIN TYP MAX A 2 35 2 65 0 093 0 104 1 0 10 0 30 0 004 0 012 0 33 0 51 0 013 0 200 C 0 23 0 32 0 009 0 013 12 60 13 00 0 496 0 512 E 7 40 7 60 0 291 0 299 e 1 27 0 050 H 10 0 10 65 0 394 0 419 h 0 25 0 75 0 010 0 030 L 0 40 1 27 0 016 0 050 k
5. Ky TEA2025 STEREO AUDIO AMPLIFIER 1 FEATURES Figure 1 Package DUAL OR BRIDGE CONNECTION MODES FEW EXTERNAL COMPONENTS SUPPLY VOLTAGE DOWN TO 3V PowerDIP16 020 HIGH CHANNEL SEPARATION a VERY LOW SWITCH ON OFF NOISE Table 1 Order Codes MAX GAIN OF 45dB WITH ADJUST Part Number Package EXTERNAL RESISTOR TEA2025B PowerDIP 124242 SOFT CLIPPING TEA2025D SO20 124444 THERMAL PROTECTION TEA2025D013TR SO16 in Tape amp Reel 3V lt lt 15V a P 2 1W Vcc 6V RL 40 2 DESCRIPTION P 2 2 3W Vcc RL 40 The TEA2025B D is a monolithic integrated circuit in 12 2 2 Powerdip and 12 4 4 SO intended for use as dual or bridge power audio amplifier porta ble radio cassette players a P 2 0 1W Vcc RL 40 Figure 2 Block Diagram GND Sub IN 1 FEED GND GND BOOT 1 OUT 1 Q D94AU120 FEED GND GND 2 OUT2 Rev 3 April 2010 1 11 TEA2025 Table 2 Absolute Maximum Ratings Symbol Parameter Value Unit Vs Supply Voltage 15 V lo Ouput Peak Current 1 5 A TJ Junction Temperature 150 C Figure 3 PIN CONNECTION POWERDIP12 2 2 BRIDGE Vs OUT 2 OUT 1 BOOT 2 BOOT 1 GND GND GND GND FEEDBACK FEEDBACK IN 2 IN 1 SVR GND sub Figure 4 PIN CONNECTION SO12 4 4 BRIDGE 1 Vcc OUT2 2 OUT 1 BOOT2 3 BOOT 1 GND 4 GND GND 5 GND GND 6 GND GND 7 GND FEEDBACK 8 FEEDBACK IN 2 9 1 SVR 1 GND
6. OTIVE APPLICATIONS AT USER S OWN RISK Resale of ST products with provisions different from the statements and or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever any liability of ST ST and the ST logo are trademarks or registered trademarks of ST in various countries Information in this document supersedes and replaces all information previously supplied The ST logo is a registered trademark of STMicroelectronics All other names are the property of their respective owners 2010 STMicroelectronics All rights reserved STMicroelectronics group of companies Australia Belgium Brazil Canada China Czech Republic Finland France Germany Hong Kong India Israel Italy Japan Malaysia Malta Morocco Philippines Singapore Spain Sweden Switzerland United Kingdom United States of America www st com 11 11
7. Sub D94AU119 Table 3 Thermal Data Symbol Description SO 12 4 4 PDIP 12 2 2 2 Unit Rihj case Thermal Resistance Junction case Max 15 15 C W Thermal Resistance Junction ambient Max 65 60 C W Note 1 The Rit jamp is measured with 454 cm copper area heatsink 2 The Rihj amb is measured on devices bonded on a 10 x 5 x 0 15cm glass epoxy substrate with a 35um thick copper surface of 5 cm 2 11 1572 TEA2025 Table 4 Electrical Characteristcs Tab 25 C Vcc Stereo unless otherwise specified Symbol Parameter Test Conditions Min Typ Max Unit Vs Supply Voltage 3 12 V lo Quiescent Current Vo Quiescent Output Voltage Av Voltage Gain Stereo Bridge AAv Voltage Gain Difference Rj Input Impedance Po Output Power d 10 Stereo 8 per channel 9V 40 6V 40 6V 80 6 160 ev 320 3V 40 320 12V 80 Bridge 80 6V 40 ev 80 160 320 Distortion Vs 9V RL 40 Stereo Bridge SVR Supply Voltage Rejection f 100Hz V n 0 5V Rg 0 EN IN Input Noise Voltage Rae 0 Re 1040 CT Cross Talk f 1KHz Rg 10KQ Table 5 wer ECC ee pepe 3 11 TEA2025 Figure 5 Bridge Application Powerdip 1N 3 C6 A BuF DUT 4 8 25 IRL uF IN 2 CT 42 IT 2 8 25 lev RL 40 Figure 8 Output Voltage vs Supply Voltage
8. ein and ST assumes no liability whatsoever relating to the choice selection or use of the ST products and services described herein No license express or implied by estoppel or otherwise to any intellectual property rights is granted under this document If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein UNLESS OTHERWISE SET FORTH IN ST S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY FITNESS FOR A PARTICULAR PURPOSE AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE ST PRODUCTS ARE NOT RECOMMENDED AUTHORIZED OR WARRANTED FOR USE IN MILITARY AIR CRAFT SPACE LIFE SAVING OR LIFE SUSTAINING APPLICATIONS NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY DEATH OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ST PRODUCTS WHICH ARE NOT SPECIFIED AS AUTOMOTIVE GRADE MAY ONLY BE USED IN AUTOM
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ST TEA2025 handbook