FAIRCHILD Guidelines for Using Fairchilds Power56 handbook
Contents
1. process parameters Stencil Printing The parameters used for printing in this study were 5 mil thick electroformed stencil 60 steel squeegee 1 psi squeegee pressure and 25mm s print speed The solder paste vendor should supply initial set up information for your particular paste composition as speed and pressure is paste dependant The dimensioned stencil openings can be found in the appendix Solder Paste Power56 components are normally used with one of the SAC tin silver copper lead free solder paste alloys IPC 9502 PWB Assembly Soldering Process Guideline for Electronic Components is a helpful reference for surface mount guidelines Fairchild tests its components to 3 pass reflow using a modified IPC JEDEC J STD 020B reflow profile with the peak temp tested to 260 C by Fairchild instead of the 250 C of the standards committee Further information on Fairchild s lead free effort can be found at http www fairchildsemi com products lead_free tt FAIRCHILD AAA SEMICONDUCTOR im Figures 4 and 5 Printed solder of different geometries both are proven to work well Dimensioned stencil apertures can be found in the appendix Lead Termination Exposed Copper and Solder Fillet Questions have arisen with this type of package and the fact that the lead ends show exposed copper due to the singulation process in manufacturing This exposed copper is specifically permitted in JEDEC JESD22 102D 5 3 3 2 Exposed terminal b2. solder paste the solder is displaced outward If there is an overabundance of solder the solder can wick onto the leads and cause shorts between the gate source and or drain Solder beading is also a possible problem due to this Another common mistake is the use of too much heat Within approximately 5 seconds of solder reflow with the hot air gun the application of heat must be stopped Some discoloring of the PWB may result if too much heat is applied to the board X Ray Inspection When using a component like an Power56 x ray inspection may be used to verify initial process control or as an ongoing quality check Wetting to all 4 corners of the Power56 drain tab is necessary for reliability Acceptable overall voiding is 25 provided the voids are dispersed throughout the drain connection References 1 B Beair Real Time Statistical Process Control of the Screen Print Process Raytheon 2 J Belamonte et al Step 4 Printing Surface Mount Technology SMT April 2005 3 IPC IPC 7525 Stencil Design Guidelines IL May 2000 4 IPC JEDEC J Std 020B Moisture Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices July 2002 5 JEDEC JESD22 102D Solderability September 2004 6 J H Lau and Y H Pao Solder Joint Reliability of BGA CSP Flip Chip and Fine Pitch SMT Assemblies McGraw Hill NY 1997 7 D Lang and CL Wu Impact of Vias on Printed Circuit Board
3. twisting motion Take care not to destroy the plastic molding compound on the component if failure analysis is desired Remove the solder from the PWB using either a solder vacuum or solder braid making sure to clean the area of solder and flux thoroughly Ifa hot air rework station is available use this tool to place the new component Below are several methods for using Power56 in a prototyping or laboratory environment If the component is to be returned to Fairchild for a failure analysis special care must be taken not to overheat the Power56 during removal as the initial failure signature s may be lost due to this damage Prototype Mounting Using a Hot Air Gun It is possible to mount a Power56 using a hot air gun and it is the preferred prototyping method Apply paste to the drain pad of the PWB using solder paste and place the component properly oriented with tweezers Use a hot air gun recommend setting air temperature to approximately AAA FAIRCHILO serra eee SEMICONDUCTOR im 300 C directly above the part to reflow the paste Once the paste has reflowed apply heat for approximately 5 more seconds with the hot air gun and follow by soldering the leads with a soldering iron and solder wire Things to Watch For There are a couple of common errors when mounting Power56 components especially in a prototype environment If too much solder is placed on the board it can cause shorts during mounting When the part is placed into
4. vias is random sometimes all of the vias will fill sometimes none Placing solder mask over the vias to keep solder from wetting into the vias also creates voiding and is not recommended It has been proven through Finite Element Analysis and supporting laboratory experimentation that placing the vias just outside the pad will not cause an appreciable reduction in thermal performance and yield superior manufacturability Figure 3 is a proven recommendation Solder Process It has been estimated that 60 of all manufacturing defects are created at the solder deposition phase In modern surface mount electronics manufacturing this means problems at stencil printing The design of the stencil is critical for the creation of a solder joint that exhibits superior electrical and mechanical performance As all designers involved in the design of stencils knows there is not one design that will work for all applications Differences in PWB finish design solder paste and flux reflow profile and dimensional accuracies for all of the related equipment and machinery means ideally all stencils should be optimized for the specific application Because the stencil designer needs a starting point it is recommended to focus on printing a AAA FAIRCHILD AA E SEMICONDUCTOR im volume of solder paste that after reflow will be thick enough to cover the entire drain pad to a thickness matching the maximum seating plane tolerance of the component For th
5. 14 3 Original Bottom E 24 128 Predicted Bottom n 130 0 1742 Top and Bottom are the same GE Y AAA FAIRCHILD THE SEMICONDUCTOR im Profiler thermocouples attached to test PWB with high temperature tape e eee FAIRCHILD A SEMICONDUCTOR im
6. AAA FAIRCHILD ESA SEMICONDUCTOR im AN 9036 Guidelines for Using Fairchild s Power56 Dennis Lang Staff Engineer Introduction The Power56 minimizes both Printed Wiring Board PWB space and Rogsion in a convenient familiar SO 8 sized footprint with the addition of a large drain tab for improving thermal performance The Power56 offers a footprint widely used in the industry for enhanced performance SO 8 sized packages This packaging technology requires mounting techniques which are slightly different from a conventional SO 8 however those familiar with mounting packages with large planar areas will find the techniques similar This note will examine techniques for mounting the Power56 in both prototype and manufacturing environments using eutectic and lead free solder pastes Figure 1 Power56 Mounted on PWB Component Mounting The process of attaching an electronic component to the PWB is the critical process in determining performance and reliability of a MOSFET Proper stencil and PWB design is essential in getting the most out of a component especially for a device utilizing an advanced performance package like the Power56 Proper design of the process is also important for reducing defects improving throughput and profitability of the assembly line It has been proposed that the 10x rule applies to assembly defects The implication is that as you progress through the steps of the assembly from printing solder to t
7. Thermal Performance IMAPS 2004 37th International Symposium on Microelectronics November 2004 8 E Strafstrom Unraveling the Final Finishing Mystery Circuits Assembly November 2000 pp 56 62 Applicable FSIDs FDMS8460 FDMS8660AS FDMS8660S FDMS8662 FDMS8670AS FDMS8670S FDMS8672AS FDMS8672S FDMS8674 FDMS8680 FDMS8692 FDMS3500 FDMS3662 FDMS5352 FDMS8670 and FDMS3572 AAA FAIRCHILD TH SEMICONDUCTOR im APPENDIX Stencil pattern for waffle type drain pad t 0 5100 sie Ueloe A be 11700 4 1400 SME 0 5100 4 3200 03673 A eres ae e 0 6 00 14000 e Y El liso i 6 9100 AAA FAIRCHILD AA A SEMICONDUCTOR im Stencil aperture for bowtie type stencil 17 11700 t 0 5100 3 0500 4 3200 3 5100 DR na 0 9700 0 2804 Y i DS gl DI O eee FAIRCHILD BEE SEMICONDUCTOR im This is a typical Reflow profile useful as a baseline for using a SAC305 alloy no clean paste Oven zone settings are noted under the Original Top and Original Bottom rows All ovens and PWB designs will require individualized settings created with a profiler Gens Description Optimization Original 0 50 100 150 200 250 300 350 Predicted 0 56 112 165 224 250 336 392 Seconds Soak Time 190 210C Reflow Time 217C P inchimin
8. ase metal is allowable on the end toe of surface mount components A solder fillet to this exposed copper is not guaranteed Due to various storage environments the oxidation on the copper may be such that a fillet cannot be formed lt has been found in testing that a fillet does normally form when a reflow profile following the standards of the solder paste vendor is used A proper profile allows the flux is able to properly prepare the surface for solder adhesion Using Power56 in Production Standard pick and place equipment can be used with Power56 components utilizing standard methods with the stencil and solder recommendations above The manufacturing engineer should center the component on the PWB pad on the Power56 to the pad on the board for best performance on pick and place equipment Organic Surface Protectant or an immersion metal plated PWB is recommended Due to the planar nature of all QFN and MLP type packages including Power56 a Hot Air Solder Leveled PWB may cause the components to shift in reflow Rework and Prototype Component Removal If it becomes necessary to rework a Power56 package the correct way to remove the component is by hot air Use of a hot air rework station with a vacuum chuck is the preferred method A heat gun that produces enough heat to melt the solder is an acceptable alternative Heat up the component until the solder has melted and allows the Power56 to be easily removed using tweezers and a gentle
9. e Fairchild Power56 this tolerance is 0 06mm A broad assumption used in the industry is that the volume of solder paste will reduce by 50 due to reflow 1 0160 a Ol Jo Figure 3 Recommended Via Size and Placement Through testing in Fairchild s SMT Apps Lab it has been found that the stencil apertures described below and pictured in the appendix are a good starting point balancing adequate solder volume to ensure a good joint with concerns of excess solder volume and related defects such as beading Both stencil designs were found to be good places for the stencil designer to start with IPC 7525 Stencil Design Guidelines is also a good reference for all component types These stencil apertures were tested with Type 3 solder paste in eutectic tin lead and Lead Free SAC 305 alloy compositions and found to deliver good performance with appropriate reflow settings Though lead free paste is more sticky and as such care should be taken to verify the process parameters such as rate of stencil separation and prints between cleaning if a stencil originally designed for eutectic paste is used It is important to note that lead free paste solders will not deliver wetting across the pad that process engineers have come to expect from eutectic tin lead paste due to the high surface tension of tin present in high quantity in many lead free alloys The appearance of the solder joint itself is also frequently less shiny even with good
10. he end customer the cost of a defect rises tenfold per process step Board Layout When designing a board for Power56 the designer should remember that the drain is the most efficient at dissipating heat Because of this there is the largest potential for gain by focusing on A __ _1__i FAIRCHILD TW SEMICONDUCTOR im the drain heat sink and its heat path Because of the unique design of the Power56 it is possible to run copper traces from 3 sides of the die as seen below in figure 2 For best thermal performance it is recommended that the user put as much copper on the drain as possible while keeping the thermal path short by keeping the area around the drain tab open Pins 1 3 are Source and pin 4 is the Gate Pins 5 8 are part of the drain tab and make one continuous solder joint with the drain tab See the applicable data sheet for the specific pin out Figure 2 Power56 PWB footprint showing area around drain lead allowing copper pour area for heat dissipation Via Usage with Power56 Note This data was taken for the Fairchild FLMP package It is applicable to the Power56 as well Customers frequently wish to use vias in their design to improve thermal performance by using copper for heat dissipation on multiple layers of the PWB Some papers suggest placing vias in the drain pad for devices like TO 220 This is not recommended by the author This practice creates unpredictable solder joint formation as the wetting of solder into
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FAIRCHILD Guidelines for Using Fairchilds Power56 handbook