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MMSD4148T1 Switching Diode Manual

1. L 50 Q OUTPUT 50 Q INPUT PULSE SAMPLING GENERATOR OSCILLOSCOPE iR REC 1mA OUTPUT PULSE Ip lp 10 mA measured at iR REC 1mA INPUT SIGNAL Notes 1 A 2 0 KQ variable resistor adjusted for a Forward Current Ip of 10 mA 2 Input pulse is adjusted so IR peak is equal to 10 mA 3 ty t p rr Figure 1 Recovery Time Equivalent Test Circuit 100 10 Ta 150 C io Ta 125 C b Z 10 T amp I e E a TA 85 C TA 40 C a Ta 85 C C3 Lu s g Z 1 0 Ta 55 C x 0 01 aL Ta 25 C L Ta 25 C 0 1 0 001 0 2 0 4 0 6 0 8 1 0 1 2 0 10 20 30 40 50 Ve FORWARD VOLTAGE VOLTS Vp REVERSE VOLTAGE VOLTS Figure 2 Forward Voltage Figure 3 Leakage Current 0 68 T uj 0 64 e E e amp 0 60 o W l Q a a 056 o 0 52 0 2 4 6 8 Vg REVERSE VOLTAGE VOLTS Figure 4 Capacitance http onsemi com 2 8 Fe www dzsc Download from www ICminer com Electronic Library Service MMSD4148T1 INFORMATION FOR USING THE SOD 123 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT
2. 0 0 MMSDAIASTY DO 1 D MMSD4148T1 Switching Diode The switching diode has the following features SOD 123 Surface Mount Package High Breakdown Voltage ON Semiconductor Fast Speed Switching Time Available in 8 mm Tape and Reel ntponsemi com 1 o o 2 CATHODE ANODE MAXIMUM RATINGS Lm 00 ss e x PLASTIC SOD 123 CASE 425 THERMAL CHARACTERISTICS Characteristic Symbol Total Device Dissipation FR 5 Board 1 mW TA 25 C Derate above 25 C 1 8 mW C Thermal Resistance Junction to Ambient Total Device Dissipation 300 mW Alumina Substrate 2 T4 25 C ORDERING INFORMATION Derate above 25 C 2 4 mWw C Thermal Resistance Junction to Ambient Resistance Junction to Ambient Device Package Shipping Junction and ELLE Ty Tstg 55to Temperature Range 150 ELECTRICAL CHARACTERISTICS T4 25 C unless otherwise noted OFF CHARACTERISTICS Reverse Breakdown Voltage lag 100 Adc Veg 1 Reverse Voltage Leakage Current Vp 20 Vdc a Lm Vn 75 Vdc 5 0 uAdc DEVICE MARKING 5l MMSD4148T1 SOD 123 3000 Tape amp Reel Forward Voltage n 10 mAdc o ve 1000 1 FR 5 1 0x 0 75 x 0 062 in 2 Alumina 0 4 x 0 3 x 0 024 in 99 5 alumina stries LLC 2000 1 Publication Order Number MMSD4148T1 D www dzsc Download from www ICminer com Electronic Library Service MMSD4148T1 820 Q 10V
3. FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package With the correct pad geometry the packages will self align when subjected to a solder reflow process SOD 123 1 22 0 048 2 36 0 093 4 19 eu lt 0 165 zii inches SOD 123 POWER DISSIPATION The power dissipation of the SOD 123 is a function of the pad size This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation Power dissipation for a surface mount device is determined by Tj max the maximum rated junction temperature of the die Resa the thermal resistance from the device junction to ambient and the operating temperature TA Using the values provided on the data sheet for the SOD 123 package Pp can be calculated as follows The values for the equation are found in the maximum ratings table on the data sheet Substituting these values into the equation for an ambient temperature TA of 25 C one can calculate the power dissipation of the device which in this case is 225 milliwatts 150 C 25 C 556 C W The 556 C W for the SOD 123 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 225 milliwatts There are other alternatives to a
4. chieving higher power dissipation from the SOD 123 package Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad Using a board material such as Thermal Clad an aluminum core board the power dissipation can be doubled using the same footprint Pp 225 milliwatts SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device When the entire device is heated to a high temperature failure to complete soldering within a short time could result in device failure Therefore the following items should always be observed in order to minimize the thermal stress to which the devices are subjected e Always preheat the device e The delta temperature between the preheat and soldering should be 100 C or less When preheating and soldering the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet When using infrared heating with the reflow soldering method the difference shall be a maximum of 10 C www dzsc 3 e The soldering temperature and time shall not exceed 260 C for more than 10 seconds When shifting from preheating to soldering the maximum temperature gradient shall be 5 C or less After soldering has been completed the device should be allowed to cool naturally for at least three minutes Gradual cooling should be used as the use of forced cooling will inc
5. ctor P O Box 5163 Denver Colorado 80217 USA Phone 303 675 2175 or 800 344 3860 Toll Free USA Canada Fax 303 675 2176 or 800 344 3867 Toll Free USA Canada Email ONlit hibbertco com N American Technical Support 800 282 9855 Toll Free USA Canada EUROPE LDC for ON Semiconductor European Support German Phone 1 303 308 7140 M F 2 30pm to 5 00pm Munich Time Email ONlit german hibbertco com French Phone 1 303 308 7141 M F 2 30pm to 5 00pm Toulouse Time Email ONlit french hibbertco com English Phone 1 303 308 7142 M F 1 30pm to 5 00pm UK Time Email ONlit hibbertco com www dzsc ASIA PACIFIC LDC for ON Semiconductor Asia Support Phone 303 675 2121 Tue Fri 9 00am to 1 00pm Hong Kong Time Toll Free from Hong Kong 800 4422 3781 Email ONlit asia hibbertco com JAPAN ON Semiconductor Japan Customer Focus Center 4 32 1 Nishi Gotanda Shinagawa ku Tokyo Japan 141 8549 Phone 81 3 5487 8345 Email r14153 onsemi com Fax Response Line 303 675 2167 800 344 3810 Toll Free USA Canada ON Semiconductor Website http onsemi com For additional information please contact your local Sales Representative MMSD4148T1 D Download from www ICminer com Electronic Library Service
6. ion special consequential or incidental damages Typical parameters which may be provided in SCILLC data sheets and or specifications can and do vary in different applications and actual performance may vary over time All operating parameters including Typicals must be validated for each customer application by customer s technical experts SCILLC does not convey any license under its patent rights nor the rights of others SCILLC products are not designed intended or authorized for use as components in systems intended for surgical implant into the body or other applications intended to support or sustain life or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application Buyer shall indemnify and hold SCILLC andits officers employees subsidiaries affiliates and distributors harmless against all claims costs damages and expenses and reasonable attorney fees arising out of directly or indirectly any claim of personal injury or death associated with such unintended or unauthorized use even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part SCILLC is an Equal Opportunity Affirmative Action Employer PUBLICATION ORDERING INFORMATION North America Literature Fulfillment Literature Distribution Center for ON Semicondu
7. rease the temperature gradient and result in latent failure due to mechanical stress Mechanical stress or shock should not be applied during cooling Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device http onsemi com Download from www ICminer com Electronic Library Service MMSD4148T1 PACKAGE DIMENSIONS SOD 123 PLASTIC PACKAGE CASE 425 04 ISSUE C C NOTES 1 DIMENSIONING AND TOLERANCING PER ANSI H Y14 5M 1982 2 CONTROLLING DIMENSION INCH INCHES MILLIMETERS piM MIN MAX MIN MAX A 0055 0 071 140 1 80 B 0100 0112 255 2 85 C 0037 0 053 0 95 135 B D 0 020 0 028 0 50 070 E 0 004 025 H 0 000 0 004 0 00 0 10 J oos 015 K 0140 0 152 355 385 E STYLE 1 1 PIN 1 CATHODE J 2 ANODE Thermal Clad is a registered trademark of the Bergquist Company ON Semiconductor and D are trademarks of Semiconductor Components Industries LLC SCILLC SCILLC reserves the right to make changes withoutfurther notice to any products herein SCILLC makes no warranty representation or guarantee regarding the suitability of its products for any particular purpose nor does SCILLC assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability including without limitat

MMSD4148T1 Switching Diode Manual

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