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ST BAT 47 BAT 48 handbook

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1. in Italy All rights reserved STMicroelectronics GROUP OF COMPANIES Australia Brazil China Finland France Germany Hong Kong India Italy Japan Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom U S A http www st com 3 5 5
2. OO BAT 47 00 BAT 47 ky BAT 48 SMALL SIGNAL SCHOTTKY DIODE DESCRIPTION General purpose metal to silicon diodes featuring very low turn on voltage and fast switching ala S These devices have integrated protection against excessivevoltage such as electrostaticdischarges ABSOLUTE RATINGS limiting values Symbol BAT47 _BAT48 Unit Repetitive Peak Reverse Voltage Forward Continuous Current Ta 25 C R ll aad 5 lt 0 5 Surge non Repetitive Forward Current A Tstg Storage and Junction Temperature Range 65 to 150 SG Ti 65 to 125 sg Maximum Temperature for Soldering during 10s at 4mm from Case THERMAL RESISTANCE Juneton ambient On infinite heatsink with 4mm lead length August 1999 Ed 1A 1 5 BAT 47 BAT 48 ELECTRICAL CHARACTERISTICS STATIC CHARACTERISTICS Symbol Test Conditions IR 104A BAT47 IR 25uA BAT48 j 25 C Ir 0 1mMA All Types i 25 IF 10mA i 25 IF 30mA BAT47 j 25 C IF 300mA j 25 C IF 50mA BAT48 j 25 C IF 500mA j 25 C Va 1 5V All Types j 25 C Va 10V BAT47 e j 25 C Va 10V BAT48 j 60 C j 25 C Va 40V j 60 C Test Conditions C Tj 25 C Vr OV f 1MHz Tj 25 C VR 1V IF 10mA VR 1V in IMA RL 1002 5 n Pulse test tp lt 300us 5 lt 2 2 5 Ko n J BAT 47 BAT 48 Figure 1 Forward current versus forward Figure 2 Forward current versus forward voltage at differ
3. ent temperatures typical voltage typical values values 0 2 P4 0 8 6 8 i 1 2 Figure 3 Reverse current versus junction Figure 4 Reverse current versus continuous temperature reverse voltage typical values a H iua i F a 3 5 BAT 47 BAT 48 4 5 Figure 5 Capacitance C versus reverse 4 BAT 47 BAT 48 PACKAGE MECHANICAL DATA DO 35 Glass DIMENSIONS Millimeters inches Min Max Min Max B 1 53 200 0 060 0 079 ec tr 0 500 D 0 458 osse 0 018 0 022 Cooling method by convection and conduction Marking clear ring at cathode end Weight 0 015g Information furnished is believed to be accurate and reliable However STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics Specifications mentioned in this publication are subject to change without notice This publication supersedes and replaces all information previously supplied STMicroelectronics products are not authorizedfor use as critical components in life support devices or systems withoutexpress written approval of STMicroelectronics The ST logo is a registered trademark of STMicroelectronics 1999 STMicroelectronics Printed

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