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International IOR rectifier SC105.....5. Series handbook

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1. O SC105 5 Said OO Bulletin 10503J rev C 05 01 International I amp R Rectifier SC105 5 Series SCHOTTKY DIE 105 x 125 mils a _ 0 35 0 01 c 14 0 4 NOTES 1 ALL DIMENSIONS ARE SHOWN IN MILLIMETERS MILS 2 CONTROLLING DIMENSION MILS c 3 DIMENSIONS AND TOLERANCES a 3 18 0 0 01 a vo A 125 0 0 4 D b 2 67 0 0 01 105 0 0 4 e c 3 02 0 0 01 119 0 0 4 INN d 22 51 0 0 01 L 99 0 0 4 140 15 40 6 P R LETTER DESIGNATION 40 157 A Anode Top Metal N RM C Cathode Back Metal N D Reject Ink Dot only on non conforming dies a Wafer flat alligned with SAWING side b of the die ge Recommended Blade SEMITEC 81025 QS00 Blade F N Sawing Street 0 05 0 0 005 2 0 0 2 125 492 NOT TO SCALE NOTE 10 mils die thickness is available on specific request only Contact factory for information www irf com 1 SC105 5 Series International Bulletin 10503J rev C 05 01 I amp R Rectifier Electrical Characteristics Device Tj Max VR Typ IR 25 C Typ IR 125 C Max Vr lf Package C V uA mA V Style SC105RO015x5x 125 15 n a contact factory SC105S020x5x 150 20 700 180 0 51 40A TO 220 SC105S030x5x 150 30 220 100 0 49 15A TO 220 SC105S045x5x 150 45 150 75 0 54 15A TO 247 SC105S060x5x 150 60 110 60 0 60 15A T
2. O 247 SC105H045x5x 175 45 35 10 0 62 15A TO 220 SC105H100x5x 175 100 12 7 0 86 15A TO 247 SC105H150x5x 175 150 15 10 1 0 Q 15A TO 220 Mechanical Data Device Metal Thickness Metal Thickness Front Metal Back Metal SC105xxxxA5x Bondable Al Si 30 kA Cr 1 KA Ni 2 k Ag 3k SC105xxxxS5x Solderable Ti 2kA Ni 1k Ag 35kA Cr 1kA Ni 2 k Ag 3k Recommended Storage Environment Store in original container in dessicated nitrogen with no contamination Shelf life for parts stored in above condition is 2 years If the storage is done in normal atmosphere shelf life is reduced to six months Packaging Device Description Minimum Order Quantity Die in Sale Package SC105xxxxx5B Inked Probed Unsawn Wafer Wafer in Box 1170 SC105xxxxx5R Probed Die in Tape amp Reel 8 000 C105xxxxx5P Probed Die in Waffle Pack 1170 SC105xxxxx5F Inked Probed Sawn Wafer on Film 1170 www irf com International SC105 5 Series I amp R Rectifier Bulletin 10503J rev C 05 01 Ordering Information Table Schottky Die Chip Dimension in Mils H 830 Process Process see Electrical Characteristics Table _ R OR ing Process S Standard Process Voltage code Code Va Chip surface metallization see Mechanical Data Table Wafer Diameter in inches FORBES amp Packaging see Packaging Table Wafer o
3. n Film J V NC VN y X GETEEL FRAME OD ID CUSTOMER PART No QUANTITY www irf com 3 SC105 5 Series Bulletin 10503J rev C 05 01 International IGR Rectifier Wafer in Box x EY NS DE 44 N 2 FOAM DISK dx i OUTSIDE Die in Waffle Pack poc gt _ CHIP TRAY POCKET www irf com Intemational SC105 5 Series TOR Rectifier Bulletin 10503J rev C 05 01 Tape and Reel REEL FRAME BARE DIE CARRIER TAPE Section A A International I amp R Rectifier WORLD HEADQUARTERS 233 Kansas St El Segundo California 90245 U S A Tel 310 322 3331 Fax 310 322 3332 EUROPEANHEADQUARTERS Hurst Green Oxted Surrey RH8 9BB U K Tel 44 1883 732020 Fax 44 1883 733408 IR CANADA 15 Lincoln Court Brampton Markham Ontario L6T3Z2 Tel 905 453 2200 Fax 905 475 8801 IR GERMANY Saalburgstrasse 157 61350 Bad Homburg Tel 49 6172 96590 Fax 49 6172 965933 IR ITALY Via Liguria 49 10071 Borgaro Torino Tel 39 11 4510111 Fax 39 11 4510220 IR FAR EAST K amp H Bldg 2F 30 4 Nishi IKebukuro 3 Chome To
4. shima Ku Tokyo Japan 171 Tel 81 3 3983 0086 IR SOUTHEAST ASIA 1 Kim Seng Promenade Great World City West Tower 13 11 Singapore 237994 Tel 65 838 4630 IR TAIWAN 16 FI Suite D 207 Sec 2 Tun Haw South Road Taipei 10673 Taiwan Tel 886 2 2377 9936 http www irf com Fax On Demand 44 1883 733420 Data and specifications subject to change without notice www irf com 5

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