philips TDA1306T Noise shaping filter DAC handbook
Contents
1. 1306 INTEGRATED CIRCUITS DATA SHEET TDA1306T Noise shaping filter DAC Product specification 1998 Jan 06 Supersedes data of September 1994 File under Integrated Circuits 01 Philips PHILIPS Semiconductors DH LI E Philips Semiconductors Product specification SR Noise shaping filter DAC TDA1306T FEATURES GENERAL DESCRIPTION General The TDA1306T is a dual CMOS digital to analog converter with up sampling filter and noise shaper The combination of oversampling up to 4fs noise shaping Double speed mode Digital volume control and continuous calibration conversion ensures that only e Soft mute function simple 1st order analog post filtering is required 12 dB attenuation The TDA1306T supports the 25 data input mode Low power dissipation fsys 256f with word lengths of up to 20 bits and the LSB fixed serial data input format 384f with word lengths of 16 18 or 20 bits Two cascaded IIR filters TDA1305T pin compatible increase the sampling rate 4 times Digital de emphasis The DACs are of the continuous calibration type and Easy application E y app icati incorporate a special data coding This ensures a high e Voltage output signal to noise ratio wide dynamic range and immunity to e Only 1st order analog post filtering required process variation and component ageing Operational amplifiers and digital filter integrated Two on board operational amplif2. signal to noise ratio input bit rate at data input no signal A weighted fs 44 1 kHz normal speed fs 44 1 kHz double speed Mbits s Tamb system clock frequency pin 12 operating ambient temperature 85 MHz C 1998 Jan 06 Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T BLOCK DIAGRAM CLKS1 CLKS2 47 8 v 12 4 TIMING SYSCLK 6 DATA 5 445 DIGITAL UP SAMPLE ie n E APPL 2 INPUT FILTER AND FEATURES BCK 17 M MODE CONTROL 416 2 15 13 TDA1306T TESTA 2 v v 11 NOISE NOISE TEST2 SHAPER SHAPER VDDD 10 EAD Vssp v v LEFT OUTPUT RIGHT OUTPUT SWITCHES SWITCHES FILTCL 19 20 FILTCR Rconv 1 RCONV2 1 nF 5 me 3 1 nF 2 DIVIDER DIVIDER 1 1 18 21 Vor Vref 22 j I REFERENCE 10 uF SOURCE mm 23 24 1 2 MKA544 Vsso VpDO VDDA VSSA Fig 1 Block diagram 1998 Jan 06 4 Philips Semiconductors Noise shaping filter DAC PINNING SYMBOL PIN DESCRIPTION VDDA 1 analog supply voltage 5 V Vssa 2 analog ground TEST1 3 test inpu
3. THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT QUALITY SPECIFICATION In accordance with UZW BO FQ 0601 1998 Jan 06 12 Philips Semiconductors Noise shaping filter DAC DC CHARACTERISTICS Vppp VppA Vppo 5 Tamb 25 C all voltages referenced to ground pins 2 9 and 23 unless otherwise specified SYMBOL PARAMETER CONDITIONS digital supply voltage pin 10 note 1 Product specification TDA1306T Vooo Vppa analog supply voltage pin 1 operational amplifier supply voltage pin 24 note 1 note 1 4 5 digital supply current analog supply current 11 28 MHz at digital silence operational amplifier supply total power dissipation HIGH level digital input voltage pins 3 to 8 and 11 to 17 no operational amplifier load resistor 11 28 MHz digital silence no operational amplifier load resistor LOW level digital input voltage pins 3 to 8 and 11 to 17 internal pull down resistor to Vssp pins and 11 input leakage current input capacitance reference voltage pin 22 with respect to Vsso current to voltage conversion resistor full scale output voltage RMS value RL gt 5 note 2 0 RES Notes output load resistance 1 265 1 All power supply pins Vpp and Vas must be connected to the same external power supply unit 2 Ri is the AC resistance of the external circuitry co
4. X 1 Y sa Y ve ca Y Yasn viva 618 8 1VW3O4 d3XI4 851 LHOIY NI JTANVS 1331 NI X Xea ze K yasiya XX va Kee X viva SLI8 9 LYNYO4 851 1H9I8 NI JTANVS 1331 NI FIdNYS yes sse za pon YX K XK Y J Y Yas sex 1 0 E 52 1H9lN 452 1431 SM m EN SEE Nm DEN NE L 2 bl Sg 9 Zi 08 61 0 2 vi 9 9 Z4 8 28 Sg LVW3O4 LNdN 1331 a1dnvs 3 TANS 1431 NI 5 jyeayaw X X YX za K 8sn 1 1 YX ___ viva 1915 V SM 2 8 2 0 8 lt z 16 1998 06 Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T LEFT wS RIGHT gt thWS tsuws MKA550 Fig 8 Timing of input signals APP2 RAB APP1 CLOCK eee es TC Re APPO DATA x MKA551 Fig 9 Microcontroller timing 1998 Jan 06 17 Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T TEST AND APPLICATION INFORMATION Filter characteristics Table 4 Digital filter specification fa 44 1 kHz BAND ATTENUATION 0 to 19 kHz lt 0 001 dB 19 to 20 kHz lt 0 03 dB 24 kHz 25 to 35 kHz 35 to 64 kHz 64 to 68 kHz 68 kHz 69 to 88 kHz Table 5 Digital filter phase distortion fs 44 1 kHz BAND PH
5. 547 Table 3 Microcontroller mode control register BIT POSITION FUNCTION Fig 4 Microcontroller timing repeat mode DESCRIPTION ACTIVE LEVEL ATSB 12 dB attenuation LOW from full scale double speed LOW mute LOW de emphasis HIGH HIGH full scale increment DO not applicable HIGH HIGH not applicable decrement reserved 1998 Jan 06 Philips Semiconductors Noise shaping filter DAC Volume control A digital level control is incorporated in the TDA1306T which performs the function of soft mute and attenuation pseudo static application mode or soft mute attenuation fade increment and decrement microcontroller application mode The volume control of both channels can be varied in small step changes determined by the value of the internal fade counter where Audio level counter x maximum level 120 Where the counter is a 7 bit binary number between 0 and 120 The time taken for mute to vary from 120 to 0 is 1 120f For example when fs 44 1 kHz the time taken is approximately 3 ms Product specification TDA1306T VOLUME CONTROL PSEUDO STATIC APPLICATION MODE In the pseudo static application mode APPL logic 0 the digital audio output level is controlled by APPO attenuation and APP2 mute so only the final volume levels full scale 12 dB attenuate and mute infinity dB can be selected The mute function has priority over the attenuat
6. Package Databook order code 9398 652 90011 Reflow soldering Reflow soldering techniques are suitable for all SO packages Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement Several techniques exist for reflowing for example thermal conduction by heated belt Dwell times vary between 50 and 300 seconds depending on heating method Typical reflow temperatures range from 215 to 250 C Preheating is necessary to dry the paste and evaporate the binding agent Preheating duration 45 minutes at 45 C 1998 Jan 06 20 Product specification TDA1306T Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed double wave a turbulent wave with high upward pressure followed by a smooth laminar wave soldering technique should be used The longitudinal axis of the package footprint must be parallel to the solder flow The package footprint must incorporate solder thieves at the downstream end During placement and before soldering the package must be fixed with a droplet of adhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured Maximum permissible solder temperature is
7. SYMBOL PARAMETER CONDITIONS MIN Twx clock cycle time 384f normal speed 192f double speed 256f normal speed fsys 128f double speed fsys LOW level pulse width fsys HIGH level pulse width Serial input data timing see Fig 8 word select input audio normal speed 25 clock input frequency fsys 38415 normal speed note 1 64 data input rate fsys 192f double speed note 1 256f normal speed 12815 double speed note 2 481 kHz fall time 20 ES PE ES bit clock LOW time 55 C m i tr tr tL tsu h t data hold time tsuws word select set up time ty Input HIGH time hold time CLOCK to DATA Notes 1 clock frequency of up to 96f is possible in the event of a rising edge of BCK occurring during SYSCLK LOW 2 A clock frequency of up 64f is possible in the event of a rising edge of BCK occurring during SYSCLK LOW 1998 Jan 06 15 Product specification Philips Semiconductors TDA1306T Noise shaping filter DAC CGGVXN NI 3 1dNVS Syeuuo jndui eyeq 7 14 S1I8 OZ LVW3OJ Q3XIJ 851 1331 NI X 8S1Y Y sa va ca
8. 260 C and maximum duration of package immersion in solder is 10 seconds if cooled to less than 150 C within 6 seconds Typical dwell time is 4 seconds at 250 C A mildly activated flux will eliminate the need for removal of corrosive residues in most applications Repairing soldered joints Fix the component by first soldering two diagonally opposite end leads Use only a low voltage soldering iron less than 24 V applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 When using a dedicated tool all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development Preliminary specification This data sheet contains preliminary data supplementary data may be published later Product specification This data sheet contains final product specifications Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposur
9. band noise density DAC and operational amplifiers In this noise shaping filter DAC a special data code and bidirectional current sources are used in order to achieve true low noise performance The special data code guarantees that only small values of current flow to the output during small signal passages while larger positive or negative values are generated using the bidirectional current sources The noise shaping filter DAC uses the continuous calibration conversion technique The operational amplifiers and the internal conversion resistors Rconvi and Rconv convert the DAC current to an output voltage available at and Vor Connecting an external capacitor between FILTCL and VoL FILTCR and Vor respectively provides the required 1st order post filtering Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 134 SYMBOL PARAMETER CONDITIONS MIN 65 0 supply voltage note 1 maximum crystal temperature storage temperature 4 85 C note 2 2000 2000 V note 3 200 operating ambient temperature electrostatic handling Notes 1 All Vpp and Vss connections must be made to the same power supply 2 Equivalent to discharging a 100 pF capacitor via a 1 5 series resistor 3 Equivalent to discharging a 200 pF capacitor via a 2 5 mH series inductor
10. the volume control feature operates as follows Mute ON by sending the MUSB command the microcontroller has to store the previous volume setting Mute OFF by sending succeeding INCR commands until the previous volume is reached Attenuation ON by sending succeeding DECR commands until a relative downstep of 12 dB is reached The microcontroller has to store the previous volume Attenuation OFF by sending the succeeding INCR commands until the previous volume is reached Volume UP by sending succeeding INCR commands Volume DOWN by sending succeeding DECR commands De emphasis A digital de emphasis is implemented in the TDA1306T By selecting the DEEM bit at register D4 microcontroller application mode or activating the APP3 pin pseudo static application mode de emphasis can be applied by means of an IIR filter De emphasis is synchronized to prevent operation in the middle of a word 1998 Jan 06 11 Product specification TDA1306T Double speed mode The double speed mode is controlled by the DSMB bit at register D6 microcontroller application mode or by activating the APP1 pin pseudo static application mode When the control bit is active LOW the device operates in the double speed mode Oversampling filter and noise shaper The digital filter is a four times oversampling filter It consists of two sections which each increase the sample rate by 2 The noise shaper operates on 4f and reduces the in
11. 06T CMOS DAC incorporates an up sampling filter a noise shaper continuous calibrated current sources and operational amplifiers System clock and data input format The TDA1306T accommodates slave mode only Consequently in all applications the system devices must provide the system clock The system frequency is selectable at pins CLKS1 and CLKS2 see Table 1 Table 1 Data input format and system clock DATA INPUT FORMAT Product specification TDA1306T The TDA1306T supports the following data input modes S bus with data word length of up to 20 bits fsys 2564 LSB fixed serial format with data word length of 16 18 or 20 bits 3841 As this format idles on the MSB it is necessary to know how many bits are being transmitted The input formats are illustrated in Fig 9 Left and right data channel words are time multiplexed SYSTEM CLOCK NORMAL SPEED DOUBLE SPEED 125 256 128 3841 0 0 LSB fixed 16 bits 1 LSB fixed 18 bits LSB fixed 20 bits 4 Oo 10o 3841 3841 1921 Device operation When the APPL pin is held HIGH and is held LOW pins APPO APP1 and APP2 form a microcontroller interface When the APPL pin is held LOW pins APPO APP1 APP2 and APP3 form a pseudo static application TDA1305T pin compatible PSEUDO STATIC APPLICATION MODE APPL LOGIC 0 In this mode the device operation is controlled by pseudo static applicatio
12. 415 Malaysia No 76 Jalan Universiti 46200 PETALING JAYA SELANGOR Tel 60 3 750 5214 Fax 60 3 757 4880 Mexico 5900 Gateway East Suite 200 EL PASO TEXAS 79905 Tel 9 5 800 234 7381 Middle East see Italy For all other countries apply to Philips Semiconductors International Marketing amp Sales Communications Building BE p P O Box 218 5600 MD EINDHOVEN The Netherlands Fax 31 40 27 24825 Philips Electronics N V 1998 a worldwide company Netherlands Postbus 90050 5600 PB EINDHOVEN Bldg VB Tel 31 40 27 82785 Fax 31 40 27 88399 New Zealand 2 Wagener Place C P O Box 1041 AUCKLAND Tel 64 9 849 4160 Fax 64 9 849 7811 Norway Box 1 Manglerud 0612 OSLO Tel 47 22 74 8000 Fax 47 22 74 8341 Philippines Philips Semiconductors Philippines Inc 106 Valero St Salcedo Village Box 2108 MCC MAKATI Metro MANILA Tel 63 2 816 6380 Fax 63 2 817 3474 Poland UI Lukiska 10 PL 04 123 WARSZAWA Tel 48 22 612 2831 Fax 48 22 612 2327 Portugal see Spain Romania see Italy Russia Philips Russia Ul Usatcheva 35A 119048 MOSCOW Tel 7 095 755 6918 Fax 7 095 755 6919 Singapore Lorong 1 Toa Payoh SINGAPORE 1231 Tel 65 350 2538 Fax 65 251 6500 Slovakia see Austria Slovenia see Italy South Africa S A PHILIPS Pty Ltd 195 215 Main Road Martindale 2092 JOHANNESBURG P O Box 7430 Johannesburg 2000 Tel 27 11 470 5911 Fax 27 11 470 5494 S
13. ASE DISTORTION 0 to 16 kHz t1 1998 Jan 06 18 Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T PACKAGE OUTLINE 5024 plastic small outline package 24 leads body width 7 5 mm SOT137 1 detail X 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions UNIT A1 A2 EU 15 6 7 6 15 2 74 0 61 0 30 0 60 0 29 inches Note 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION JEDEC EIAJ PROJECTION SOT137 1 075E05 MS 013AD 97 05 22 ISSUE DATE 1998 Jan 06 19 Philips Semiconductors Noise shaping filter DAC SOLDERING Introduction There is no soldering method that is ideal for all IC packages Wave soldering is often preferred when through hole and surface mounted components are mixed on one printed circuit board However wave soldering is not always suitable for surface mounted ICs or for printed circuits with high population densities In these situations reflow soldering is often used This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our
14. LER WRITE OPERATION SEQUENCE The microcontroller write operation follows the following sequence e APP2 is held LOW by the microcontroller Microcontroller data is clocked into the internal shift register on the LOW to HIGH transition on pin APP1 Data D7 to DO is latched into the appropriate control register on the LOW to HIGH transition of pin APP2 APP1 HIGH If more data is clocked into the TDA1306T before the LOW to HIGH transition on pin APP2 then only the last 8 bits are used If less data is clocked into the TDA1306T unpredictable operation will result If the LOW to HIGH transition of pin APP2 occurs when APP1 LOW the command will be disregarded APP1 CLOCK APPO DATA 07 X D6 X D5 X D4 X D2 X DO MKA546 Fig 3 Microcontroller timing 1998 Jan 06 Philips Semiconductors Noise shaping filter DAC MICROCONTROLLER WRITE OPERATION SEQUENCE REPEAT MODE The same command can be repeated several times e g for fade function by applying APP2 pulses as shown in Fig 4 It should be noted that APP1 must stay HIGH Product specification TDA1306T between 2 pulses A minimum pause of 22 us is necessary between any two step up or step down commands APP2 RAB APP1 CLOCK APPO DATA D7 X De X D5 X D4 X 02 X D1 X DO
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16. e to limiting values for extended periods may affect device reliability Application information Where application information is given it is advisory and does not form part of the specification LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale 1998 Jan 06 21 Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T NOTES 1998 Jan 06 22 Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T NOTES 1998 Jan 06 23 Philips Semiconductors Argentina see South America Australia 34 Waterloo Road NORTH RYDE NSW 2113 Tel 61 2 9805 4455 Fax 61 2 9805 4466 Austria Computerstr 6 A 1101 WIEN P O Box 213 Tel 43 160 1010 Fax 43 160 101 1210 Belarus Hotel Minsk Business Center Bld 3 r 1211 Volodarski Str 6 220050 MINSK Tel 375 172 200 733 Fax 375 172 200 773 Belgium see The Netherlands Brazil see South America Bulgaria Philips Bulgaria Ltd Energoproject 15th floor 51 James Bourchier Blvd 1407 SOFIA Tel 359 2 689 211 Fax 359 2 689 102 Canada PHILIPS SEMICONDUCTORS COMP
17. iers convert the e Selectable system clock fsys 2561 3844 digital to analog current to an output voltage I2S bus 256fs or 16 18 or 20 bits LSB fixed serial input format fsys 3844 Single rail supply High performance e Superior signal to noise ratio e Wide dynamic range No zero crossing distortion e Inherently monotonic e Continuous calibration digital to analog conversion combined with noise shaping technique ORDERING INFORMATION PACKAGE TYPE NUMBER DESCRIPTION VERSION TDA1306T plastic small outline package 24 leads body width 7 5 mm SOT137 1 1998 Jan 06 2 Philips Semiconductors Noise shaping filter DAC QUICK REFERENCE DATA All power supply pins Vpp and Vss must be connected to the same external SYMBOL Supply Vooo PARAMETER digital supply voltage CONDITIONS Product specification TDA1306T Vppa analog supply voltage operational amplifier supply voltage Ippo digital supply current analog supply current operational amplifier supply current Vppp 5 at code 00000H Vppa 5 at code 00000H Vppo 5 at code 00000H Analog signals full scale output voltage RMS value 5 V 0 935 THD N S total harmonic distortion plus noise to signal ratio at 0 dB signal level f 1 kHz at 60 dB signal level fi 1 kHz dB
18. ion function Accordingly if MUSB is LOW the state of ATSB has no effect An example of volume control in this application mode is illustrated in Fig 5 ATSB MUSB VALUE full scale 12 dB Mute level 1998 Jan 06 Fig 5 Volume control pseudo static application mode 548 Philips Semiconductors Noise shaping filter DAC VOLUME CONTROL MICROCONTROLLER APPLICATION MODE In the microcontroller application mode APPL logic 1 APP3 logic 0 the audio output level is controlled by volume control bits ATSB MUSB FS INCR and DECR Mute is activated by sending the MUSB command to the mode control register via the microcontroller interface The audio output level will be reduced to zero in a maximum of 120 steps depending on the current position of the fade counter and taking a maximum of 3 ms Mute attenuation and full scale are synchronized to prevent operation in the middle of a word The counter is preset to 120 by the full scale command The counter is preset to 30 by the attenuate command when its value is more then 30 If the value of the counter is less than 30 dB the ATSB command has no effect The counter is preset to logic by the mute command MUSB Attenuation 12 dB is activated by sending the ATSB command to the fade control register D7 Attenuation and mute are ca
19. n pins where APPO attenuation mode control APP1 double speed mode control APP2 mute mode control de emphasis mode control In the pseudo static application mode the TDA1306T is pin compatible with the TDA1305T slave mode The correspondence between TDA1306T pin number TDA1306T pin name TDA1305T pin mnemonic and a description of the effects is given in Table 2 1998 Jan 06 Philips Semiconductors Noise shaping filter DAC Table 2 Pseudo static application mode Product specification TDA1306T PIN TDA1305T MNEMONIC GIN NOMBER FUNCTION DESCRIPTION APPO 17 ATSB 12 dB attenuation from full scale activated only if MUSB logic 1 full scale only if MUSB logic 1 double speed mode normal speed mode samples decrease to mute level level according to ATSB de emphasis OFF 44 1 kHz MICROCONTROLLER APPLICATION MODE APPL LOGIC 1 AND APP3 Loaic 0 In this mode the device operation is controlled by a set of flags in an 8 bit mode control register The 8 bit mode control register is written by a microcontroller interface where APPL logic 1 Data APP1 Clock APP2 RAB APPS logic 0 The correspondence between serial to parallel conversion mode control flags and a summary of the effect of the control flags is given in Table 3 Figures 3 and 4 illustrate the mode set timing APP2 RAB de emphasis ON 44 1 kHz MICROCONTROL
20. ncelled by sending the full scale command to the fade control register Register D3 Product specification TDA1306T To control the fade counter in a continuous way the INCREMENT and DECREMENT commands are available fade control Registers D1 and D2 They will increment and decrement the counter by 1 for each register write operation When issuing more than 1 step up or step down command in sequence the write repeat mode may be used see microcontroller application mode An example of volume control in this application mode is illustrated in Fig 6 FS INCR 1 DECR 1 VALUE full scale 12 dB Mute level 1 INCR and DECR in repeat mode 549 Fig 6 Volume control microcontroller application mode 1998 Jan 06 10 Philips Semiconductors Noise shaping filter DAC There are two recommended application situations within the microcontroller mode e The customer wants to use the microcontroller interface without the volume setting facility In this event the operation is as follows Mute ON by sending the MUSB command Mute OFF by sending the FS command Attenuation ON by sending the ATSB command Attenuation OFF by sending the FS command It is possible to switch from Attenuation ON to Mute ON but not vice versa Incorporating
21. nformation presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Printed in The Netherlands 547027 1200 02 pp24 Philips Semiconductors Date of release 1998 Jan 06 Document order number 9397 750 03168 4 make things better S PHILIPS
22. nnected to the audio outputs of the application circuit 1998 Jan 06 13 Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T AC CHARACTERISTICS ANALOG Vppp VppA Vppo 5 Tamb 25 C all voltages referenced to ground pins 2 9 and 23 unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN DACs SVRR supply voltage ripple fripple 1 kHz rejection Vppa and Vppo 100 mV AGy unbalance between the maximum volume 2 DAC voltage outputs pins 18 and 21 crosstalk between the 2 DAC one output digital silence voltage outputs the other maximum volume pins 18 and 21 THD N S_ total harmonic distortion at 0 dB signal level plus noise to signal ratio fi 1 kHz at 60 dB signal level fi 1 kHz signal to noise ratio no signal A weighted Operational amplifiers G open loop voltage gain PSRR power supply rejection ratio fipple 3 kHz Vripple 100 mV p p A weighted THD N S total harmonic distortion gt 5 fi 1 kHz plus noise to signal ratio Vo 2 8 V fua unity gain frequency open loop 7 AC output impedance RL gt 5kQ 1998 Jan 06 14 Philips Semiconductors Product specification Noise shaping filter DAC TDA1306T AC CHARACTERISTICS DIGITAL Vppp Vpoa Vppo 4 5 to 5 5 V all voltages referenced to ground pins 2 9 and 23 Tamb 40 to 85 C unless otherwise specified
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24. t 1 pin should be connected to ground BCK 4 bit clock input WS 5 word select input DATA 6 data input CLKS1 7 clock and format selection 1 input CLKS2 8 clock and format selection 2 input TEST2 Vssp 9 digital ground Vppp 10 digital supply voltage 5 V 11 test input 2 pin should be connected to ground SYSCLK 12 system clock input 256 or 3841 APP3 13 application mode 3 input APPL 14 application mode selection input APP2 15 application mode 2 input APP1 16 application mode 1 input APPO 17 application mode 0 input VoL left channel output FILTCL 19 capacitor for left channel 1st order filter function should be connected between pins 19 and 18 FILTCR 20 capacitor for right channel 1st order filter function should be connected between pins 20 and 21 Vor right channel output Viet internal reference voltage for output channels 0 5Vppo typ Vsso Vppo 23 operational amplifier ground 24 operational amplifier supply voltage 1998 Jan 06 ws DATA CLKS1 CLKS2 550 VDDD TEST2 SYSCLK Product specification TDA1306T AR TDA1306T Hea ARE RR ES BB BLE B K e H Fl PLE HA H MKA545 Fig 2 Pin configuration VDDO Vsso Vref VOR FILTCR FILTCL VoL APPO APP 1 APP2 APPL APP3 Philips Semiconductors Noise shaping filter DAC FUNCTIONAL DESCRIPTION The TDA13
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philips TDA1306T Noise shaping filter DAC handbook