PHILIPS TEA1532 handbook
Contents
1. 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions A Ay A2 max min max b4 b D eM UNIT 9 8 6 48 9 2 6 20 0 39 0 26 0 36 0 24 4 2 0 51 3 2 inches 0 17 0 02 0 13 Note 1 Plastic or metal protrusions of 0 25 mm 0 01 inch maximum per side are not included OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE SOT97 1 050G01 MO 001 SC 504 8 ES0 99 42 27 03 02 13 Fig 15 Package outline 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved 21 of 27 Preliminary data sheet Rev 01 28 May 2004 Philips Semiconductors TEA1 532 14 Soldering 14 1 14 2 14 2 1 14 2 2 14 3 14 3 1 9397 750 13113 GreenChip I SMPS control IC Introduction This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our Data Handbook IC26 Integrated Circuit Packages document order number 9398 652 90011 There is no soldering method that is ideal for all IC packages Wave soldering is often preferred when through hole and surface mount components are mixed on one printed circuit board Wave soldering can still be used for certain surface mount ICs but it is not2. 25 mV 2 1V 1 5V VCTRL typ typ Fig 6 The Vsense max VOltage as a function of Vetru Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 6 of 27 Philips Semiconductors TEA1 532 7 4 7 5 7 6 7 7 7 8 7 9 7 10 9397 750 13113 GreenChip II SMPS control IC Oscillator The fixed frequency of the oscillator is set by an internal current source and capacitor Cycle skipping At very low power levels a cycle skipping mode activates An internal control voltage Vsense max lower than 25 mV will inhibit switch on of the external power MOSFET until this voltage increases to a higher value see Figure 6 Demagnetization QR operation The system will be in Discontinuous Conduction Mode DCM QR operation when resistor Rpgey is applied The oscillator will not start a new primary stroke until the secondary stroke has ended Demagnetization features a cycle by cycle output short circuit protection which immediately reduces the frequency longer off time thereby reducing the power level Demagnetization recognition is suppressed during the first tsupp time This suppression may be necessary in applications where the transformer has a large leakage inductance and at low output voltages or start up Continuous Conduction Mode CCM It is also possible to operate the IC in the so called Fixed Frequ
3. Preliminary data sheet Rev 01 28 May 2004 17 of 27 Philips Semiconductors TEA1532 9397 750 13113 GreenChip II SMPS control IC 1 Vo Vstart Voc VDRIVER Vprotect When Vprotect is forced above 3 V the protection is always latched So the IC is not started at Vstart unless the Vcc voltage drops below the Veciresety level This is the same action used for Start up sequence VUVLO Normal operation external OTP compensation described in Section 7 15 Fig 12 Typical waveforms 2 External OTP 001aaa841 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 18 of 27 Philips Semiconductors TEA1 532 GreenChip II SMPS control IC an 0 power MOSFET l PROTECT 4 i s CTRL Rsense Ho Rslopecomp RCTRL coa013 1 Pin PROTECT is used in this example for external OTP and open loop or output short circuit protection Slope compensation is determined by the value of Rsiopecomp Fig 13 Flyback configuration using the continuous conduction mode 12 Test information 12 1 Quality information The General Quality Specification for Integrated Circuits SNW FQ 611 is applicable 939
4. 2 Equivalent to discharging a 200 pF capacitor through a 0 75 uH coil and a 10 Q resistor Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 12 of 27 Philips Semiconductors TEA1 532 GreenChip II SMPS control IC 9 Thermal characteristics Table 4 Thermal characteristics Symbol Parameter Conditions Typ Unit Rih a thermal resistance from in free air SO8 package 150 K W junction to ambient in free air DIP8 package 95 K W 10 Characteristics Table 5 Characteristics Tamb 25 C Voc 15 V all voltages are measured with respect to ground pin 2 currents are positive when flowing into the IC unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Start up current source pin DRAIN IDRAIN supply current drawn from Vprain gt 100 V 1 0 1 2 1 4 mA pin DRAIN Veco OV with auxiliary supply 100 300 uA Ve breakdown voltage 650 V Vm mains dependent 60 100 vV operation enabling level Supply voltage management pin Vcc Vstart start up voltage 10 3 11 117 V VuvLo lock out undervoltage 8 1 8 7 9 3 V Vhys hysteresis voltage Vstart VUvLo 2 0 2 3 2 6 V lch n high charging current Vprain gt 100 V Vcc lt 3V 1 2 1 0 8 mA lch l low charging current Vprain gt 100 V 1 2 0 75 0 45 mA 3 V lt Voc lt VuvLo lrestart restart current Vprain
5. V duty cycle Vmax maximum voltage for minimum 1 5 V duty cycle Alslopecomp At slope compensation current 1 2 1 0 8 wA us VCTRL detect Control detect level 0 56 0 63 0 70 V Protection and timing input pin PROTECT Virip trip level 2 37 2 5 2 63 V Virip latch trip level for latch 2 85 3 3 15 V Vocilatch reset voltage level on pin Vcc which Vocilatch lt 2 3V z 4 5 z V resets the latch lcharge charge current Vectra lt 0 63 V 57 50 43 uA ldischarge discharge current 100 nA Valley switch pin DRAIN AV Atvalley valley recognition voltage 43 43 V s change tvalley swon delay from valley recognition to 0 150 ns switch on Overcurrent and winding short circuit protection pin SENSE Vsense max maximum source voltage for AV At 0 1 V us 0 48 0 52 0 56 V OCP tpp propagation delay from AV At 0 5 V us 140 185 ns detecting Vsense max to switch off tleb blanking time for current and 330 400 470 ns winding short circuit protection lss soft start current Vsense lt 0 5 V 45 60 75 uA Brown out protection pin DEM Ibrown out brown out protection current A constant I brown out is drawn 2 68 60 52 uA from pin DEM ton min brown out minimum on time for enabling 1 5 2 2 5 us the brown out protection Driver pin DRIVER Isource source current Voc 9 5 V Vpriver 2 V 170 88 mA Isink sink current Voc 9 5 V VprIVER 2 V 300 mA VpRIVER 9 5V 400 700 mA Vomax maximum output voltage Vcc gt
6. V switching stops immediately For the timing function a current of typically 50 uA flows out of pin PROTECT and charges an external capacitor until the activation level of 2 5 V is reached This current source however is only activated when the converter is not in regulation which is detected by the voltage on pin CTRL Verter lt 0 63 V A small discharge current is also implemented to ensure that the capacitor is not charged for example by spikes and a MOSFET switch is added to ensure a defined start situation The voltage on pin CTRL determines whether the IC enters latched protection mode or safe restart protection mode Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 8 of 27 Philips Semiconductors TEA1 532 7 13 9397 750 13113 GreenChip II SMPS control IC e When the voltage on pin CTRL is below 0 63 V the IC is assumed to be out of regulation e g the control loop is open In this case activating pin PROTECT Vprotect gt 2 5 V will cause the converter to stop switching Once Vcc drops below VuvLo Capacitor Cycc will be recharged and the supply will restart This cycle will be repeated until the fault condition is removed safe restart mode e When the voltage on pin CTRL is above 0 63 V the IC is assumed to be in regulation In this case activating pin PROTECT Vprotect gt 2 5 V by external means will latch the IC The voltage on p
7. gt 100 V 650 550 450 uA Vuvio lt Voc lt Vstart loper supply current under normal no load on pin DRIVER 1 1 1 3 1 5 mA operation Demagnetization management pin DEM Vih DEM demagnetization comparator 50 80 110 mV threshold voltage Vih CCM continuous conduction mode 80 50 20 mV detection threshold voltage lprot dem pin protection current Vpem 50 mV 60 10 nA Velamp neg negative clamp voltage Ibem 500 uA 0 5 045 0 40 V Velamp pos positive clamp voltage Ipem 250 pA 0 5 0 7 0 9 V tsupp suppression of transformer 1 1 1 5 1 9 us ringing at start of secondary stroke Pulse width modulator ton min minimum on time tleb ns ton max maximum on time QR mode 20 25 30 us max maximum duty cycle 67 70 73 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 13 of 27 Philips Semiconductors TEA1532 Table 5 Characteristics continued GreenChip II SMPS control IC Tamb 25 C Voc 15 V all voltages are measured with respect to ground pin 2 currents are positive when flowing into the IC unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Oscillator fosc oscillator frequency fixed VotaL lt 1V 50 63 75 kHz frequency Duty cycle control pin CTRL Vmin minimum voltage for maximum 1 0
8. or output short circuit protection If this pin is not used it must be tied to ground Figure 13 shows a flyback configuration using the continuous conduction mode Pin PROTECT is used in this example for external overtemperature protection and open loop or output short circuit protection Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 15 of 27 Philips Semiconductors TEA1 532 GreenChip II SMPS control IC power MOSFET 2 7 TEA1532T 3 TEA1532P coa011 Fig 10 Flyback configuration using the discontinuous conduction mode 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 16 of 27 Philips Semiconductors TEA1532 GreenChip I SMPS control IC Vi hese tee a a A MAMAN Vo Vstart Voc VuvLo VDRIVER 25V 4 VPROTECT Start up Normal OVP Normal Output Brown out 1 sequence operation operation short circuit 001aaa840 1 In CCM the brown out protection is implemented by the maximum duty cycle in combination with pin PROTECT Fig 11 Typical waveforms 1 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved
9. source charges the capacitor to Vsense lss X Rss about 0 5 V maximum The start level and the time constant of the increasing primary current level can be adjusted externally by changing the values of Rss and Css I Vocp Mss X Rss primary max E Rense eS Rs X Cys The charging current Iss will flow as long as the voltage on pin SENSE is below approximately 0 5 V If the voltage on pin SENSE exceeds 0 5 V the soft start current source will start limiting current lss At Vetart the lss current source is completely switched off see Figure 9 Since the soft start current lss is supplied from pin DRAIN the Rss value will not affect Vcc current during start up Cy Iss one A J startup L e sense Rss 1 D Vocp Css Rsense TT mgu237 Fig 9 Soft start up 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 11 of 27 Philips Semiconductors TEA1 532 GreenChip II SMPS control IC 7 17 Driver The driver circuit to the Gate of the power MOSFET has a current sourcing capability of typically 170 mA and a current sink capability of typically 700 mA This permits fast turn on and turn off of the power MOSFET for efficient operation A low driver source current has been chosen to limit the AV At at switch on This reduces Electro Magnetic Interference EMI and also limits
10. 12 V z 11 5 12 V 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 14 of 27 Philips Semiconductors TEA1 532 GreenChip II SMPS control IC Table 5 Characteristics continued Tamb 25 C Voc 15 V all voltages are measured with respect to ground pin 2 currents are positive when flowing into the IC unless otherwise specified Symbol Parameter Conditions Min Typ Max Unit Temperature protection Tprot max maximum temperature 130 140 150 C protection level Tprot hyst hysteresis for the temperature BI 8 C protection level 1 Guaranteed by design 2 Vi detection level Set by the demagnetization resistor Rpem see Section 7 14 3 Valid for Voc gt 2 V 11 Application information 9397 750 13113 A converter with the TEA1532 consists of an input filter a transformer with a third winding auxiliary and an output stage with a feedback circuit Capacitor Cycc buffers the IC supply voltage which is powered via the high voltage rectified mains during start up and via the auxiliary winding during operation A sense resistor Rsense converts the primary current into a voltage at pin SENSE The value of Rsense defines the maximum primary peak current Figure 10 shows a flyback configuration using the discontinuous conduction mode Pin PROTECT is used in this example for external overvoltage protection and open loop
11. 7 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 19 of 27 Philips Semiconductors TEA1 532 GreenChip II SMPS control IC 13 Package outline SO8 plastic small outline package 8 leads body width 3 9 mm SOT96 1 a detail X 2 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions UNIT A2 Ag c pM E2 He 0 25 5 0 4 0 6 2 0 19 48 3 8 5 8 inches 0 0100 0 20 0 16 i 0 0075 0 19 0 15 Notes 1 Plastic or metal protrusions of 0 15 mm 0 006 inch maximum per side are not included 2 Plastic or metal protrusions of 0 25 mm 0 01 inch maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC JEITA PROJECTION SOT96 1 076E03 Ms 012 E406 ee ISSUE DATE Fig 14 Package outline Koninklijke Philips Electronics N V 2004 All rights reserved 20 of 27 9397 750 13113 Preliminary data sheet Rev 01 28 May 2004 Philips Semiconductors TEA1 532 GreenChip II SMPS control IC DIP8 plastic dual in line package 8 leads 300 mil SOT97 1 seating plane
12. 8 plastic dual in line package 8 leads 300 mil SOT97 1 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 2 of 27 Philips Semiconductors TEA1532 5 Block diagram GreenChip II SMPS control IC Voc SUPPLY START UP DRAIN MANAGEMENT URRENT SOURCE internal UVLO start supply GND Osc_Rdy Duty_Max R LOGIC 4 CTRL POWER ON RESET 5 6 V control MAXIMUM detect ON TIME PROTECTION D 0 63 V Icharge PROTECT t 300 Q t 5 6 V OVER Idischarge M Protect TEMPERATURE detect PROTECTION Fig 1 Block diagram Iprot dem VALLEY dani y DEM DRIVER SENSE gt DCM and CCM TEA1532T TEA1532P Voc lt 4 5 V coa014 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 3 of 27 Philips Semiconductors TEA1 532 GreenChip II SMPS control IC 6 Pinning information 6 1 Pinning DRAIN Voc DRAIN DRIVER GND DRIVER TEA1532T TEA1532P SENSE PROTECT SENSE DEM CTRL DEM 001aaa829 001aaa828 Fig 2 Pin confi
13. O 0 TEAS OO TEA1532 GreenChip II SMPS control IC Rev 01 28 May 2004 Preliminary data sheet PE 1 General description 2 Features The GreenChip II is the second generation of green Switched Mode Power Supply SMPS controller ICs Its high level of integration allows the design of a cost effective power supply with a very low number of external components The TEA1532 can also be used in fixed frequency Continuous Conduction Mode CCM converter designs for low voltage high current applications At low power standby levels the system operates in cycle skipping mode which minimizes the switching losses during standby The special built in green functions allow the efficiency to be optimum at all power levels This holds for quasi resonant operation at high power levels as well as fixed frequency operation with valley switching at medium power levels At low power standby levels the system operates in cycle skipping mode with valley detection The proprietary high voltage BCD800 process makes direct start up possible from the rectified universal mains voltage in an effective and green way A second low voltage BICMOS IC is used for accurate high speed protection functions and control The TEA1532 enables highly efficient and reliable supplies to be designed easily 2 1 2 2 2 3 Distinctive features E Universal mains supply operation 70 V to 276 V AC High level of integration resulting in a ve
14. atuS 20 000 eee eee 26 Definitions 2 0 0 cece eee eee 26 Disclaimers 200 e eee ee eee eee 26 Trademarks 00 e eee eee 26 Contact information 0 e0e005 26 Koninklijke Philips Electronics N V 2004 All rights are reserved Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner The information presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Date of release 28 May 2004 Document order number 9397 750 13113 Published in The Netherlands
15. cs Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 9 of 27 Philips Semiconductors TEA1 532 GreenChip I SMPS control IC primary secondary secondary stroke stroke ringing drain A valley Y secondary stroke oscillator mgu235 1 Start of new cycle at lowest drain voltage 2 Start of new cycle in a classical PWM system at high drain voltage Fig 8 Signals for valley switching 7 14 Brown out protection 9397 750 13113 During the so called brown out test the input voltage is slowly decreased Since the on time depends on Vj overlong on times at low V can damage the external power device This is prevented by stopping the converter when the input voltage drops too low When the voltage on pin DEM drops below 50 mV during the on time QR mode the maximum on time is set to 25 us The maximum on time will be reached while V is low Subsequently the IC stops switching and Vcc drops below Vyv_o Capacitor Cycc will only be recharged and the supply will restart only when voltage V is high enough Vm also see Section 7 1 In addition to this a Vi level at which the converter has to enter a safe restart can be set with a demag resistor During the primary stroke the rectified mains input voltage is measured by sensing the current drawn from pin DEM This current depends on the
16. duction Mode CCM 7 7 8 Overcurrent Protection OCP 7 7 9 Control pin protection 00 7 7 10 Adjustable slope compensation 7 7 14 Minimum and maximum on time 8 7 12 PROTECT and timing input 8 7 13 Valley switching 00 ee eee eee 9 7 14 Brown out protection 4 10 7 15 OverTemperature Protection OTP 11 7 16 Soft start up pin SENSE 11 7 17 DIVET apinta e ek eong oo hha dota eae 12 8 Limiting valueS 0 0 00 cece eee eee 12 9 Thermal characteristics 005 13 10 Characteristics 0 0eee eee eee 13 11 Application information 5 15 12 Test information 000 c eee eee 19 12 1 Quality information 200005 19 13 Package outline 0 ee ee eens 20 PHILIPS 14 14 1 14 2 14 2 1 14 2 2 14 3 14 3 1 14 3 2 14 3 3 14 4 15 16 17 18 19 20 Soldering ccc cece e cece eee eee 22 Introduction eresse srai insir eee eee 22 Through hole mount packages 22 Soldering by dipping or by solder wave 22 Manual soldering 20 000e 22 Surface mount packages 22 Reflow soldering 020 eee 22 Wave soldering 00 eee eee 23 Manual soldering 000 23 Package related soldering information 24 Revision history 20 000 e eee eee 25 Data sheet st
17. e compensation can be adjusted by changing the Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 7 of 27 Philips Semiconductors TEA1 532 7 11 7 12 9397 750 13113 GreenChip II SMPS control IC value Of Reiopecomp Slope compensation prevents modulation of the on time duty cycle while operating in FF CCM A possible drawback of sub harmonic oscillation can be output voltage ripple TEA1532 Slope compensation current Rslopecomp CTRL control P detect PD 0 63 v E 001aaa830 Fig 7 Slope compensation Minimum and maximum on time The minimum on time of the SMPS is determined by the LEB time The IC limits the on time to a maximum time which is dependent on the mode of operation QR mode When the system requires an on time of more than 25 us a fault condition is assumed e g Cycc removed the IC stops switching and enters the safe restart mode CCM The driver duty cycle is limited to 70 So the maximum on time is correlated to the oscillator time which results in an accurate limit of the minimum input voltage of the flyback converter PROTECT and timing input The PROTECT input pin 3 is a multi purpose high impedance input which can be used to switch off the IC and create a relatively long timing function As soon as the voltage on this pin rises above 2 5
18. ect device reliability Application information Applications that are described herein for any of these products are for illustrative purposes only Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification 18 Disclaimers Life support These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips Semiconductors 20 Contact information customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits standard cells and or software described or contained herein in order to improve design and or performance When the product is in full production status Production relevant changes will be communicated via a Customer Product Process Change Notification CPCN Philips Semiconductors assumes no responsibility or liability for the use of any of these products conveys no license or title under any patent copyright or mask work right to these products and makes no representations or warranties that these products are free from patent copyright or ma
19. ency Continuous Conduction Mode FF CCM This mode is activated by connecting pin DEM to ground and connecting pin DRAIN to the rectified constant V voltage see Figure 13 Overcurrent Protection OCP The current in the transformer primary is measured accurately by the internal cycle by cycle source current limit circuit using the external sense resistor Rsense The accuracy of the current limit circuit allows the transformer core to have a minimum specification for the output power required The OCP circuit limits the sense voltage to an internal level and is activated after the leading edge blanking period tiep generated by the Leading Edge Blanking LEB circuit Control pin protection If pin CTRL becomes open circuit or is disconnected a fault condition is assumed and the converter will stop operating immediately Operation recommences when the fault condition is removed Adjustable slope compensation A slope compensation function has been added at pin CTRL see Figure 7 The slope compensation function prevents sub harmonic oscillation in CCM at duty cycles over 50 The CTRL voltage is modulated by sourcing a non constant current out of pin CTRL and adding a series resistor Rsiopecomp This increases the CTRL voltage proportionally with the on time which therefore limits the OCP level Thus a longer on time results in a higher CTRL voltage however this increase in CTRL voltage will actually decrease the on time Slop
20. ering is used the following conditions must be observed for optimal results e Use a double wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave e For packages with leads on two sides and a pitch e larger than or equal to 1 27 mm the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit board smaller than 1 27 mm the footprint longitudinal axis must be parallel to the transport direction of the printed circuit board The footprint must incorporate solder thieves at the downstream end e For packages with leads on four sides the footprint must be placed at a 45 angle to the transport direction of the printed circuit board The footprint must incorporate solder thieves downstream and at the side corners During placement and before soldering the package must be fixed with a droplet of adhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C depending on solder material applied SnPb or Pb free respectively A mildly activated flux will eliminate the need for removal of corrosive residues in most applications Manual soldering Fix the component by first soldering two diagonally opposite end leads Use a low voltage 24 V or less solder
21. ger than 0 8 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 65 mm Wave soldering is suitable for SSOP and TSSOP packages with a pitch e equal to or larger than 0 65 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 5 mm Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 24 of 27 Philips Semiconductors TEA1532 15 Revision history Table 7 Revision history TEA1532_1 20040528 Preliminary data GreenChip ll SMPS control IC 9397 750 13113 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 25 of 27 Philips Semiconductors TEA1532 16 Data sheet status GreenChip I SMPS control IC Level Data sheet status Product status 3 Definition l Objective data Development This data sheet contains data from the objective specification for product development Philips Semiconductors reserves the right to change the specification in any manner without notice Il Preliminary data Qualification This data sheet contains data from the preliminary specification Supplementary data will be published at a later date Philips Semiconductors reserves the right to change the specification without notice in order to improve the design and supply
22. guration TEA1532T SOT96 1 Fig 3 Pin configuration TEA1532P SOT97 1 6 2 Pin description Table 2 Pin description Symbol Pin Description Voc 1 supply voltage GND 2 ground PROTECT 3 protection and timing input CTRL 4 control input DEM 5 input from auxiliary winding for demagnetization timing SENSE 6 programmable current sense input DRIVER 7 MOSFET Gate driver output DRAIN 8 connected to drain of external MOS switch input for start up current compensation and valley sensing 7 Functional description The TEA1532 is the controller of a compact flyback converter with the IC situated at the primary side An auxiliary winding of the transformer provides demagnetization detection and powers the IC after start up see Figure 4 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 4 of 27 Philips Semiconductors TEA1 532 GreenChip II SMPS control IC E IHE V e 2 TEA1532T 4 TEA1532P coa015 ay Fig 4 Typical configuration The TEA1532 can operate in multi modes see Figure 5 coa017 Cycle skip ed FF CCM Fig 5 Multi mode and FF CCM operation In QR mode the next converter stroke is started only after demagnetization of the transformer current zero current switching while
23. in Vcc will cycle between Vstart and VuvLo but the IC will not start switching again until the latch function is reset The latch is reset as soon as Voc drops below 4 5 V typical value The internal overtemperature protection will also trigger this latch see also Figure 1 A voltage higher than 3 V on pin PROTECT will always latch the IC This is independent of the state of the IC Valley switching Refer to Figure 8 A new cycle starts when the power switch is activated After the on time determined by the sense voltage and the internal control voltage the switch is opened and the secondary stroke starts After the secondary stroke the drain voltage shows an 1 2 XTX L X Ca where Lp is the primary self inductance of the transformer and Cg is the capacitance on the drain node oscillation with a frequency of approximately As soon as the oscillator voltage is high again and the secondary stroke has ended the circuit waits for the lowest drain voltage before starting a new primary stroke This method is called valley detection Figure 8 shows the drain voltage valley signal secondary stroke signal and the oscillator signal In an optimum design the reflected secondary voltage on the primary side will force the drain voltage to zero Thus zero voltage switching is possible preventing large capacitive switching losses P xCXV x f and allowing high frequency operation which results in small and cost effective magneti
24. ing iron applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 C When using a dedicated tool all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 23 of 27 Philips Semiconductors TEA1532 GreenChip II SMPS control IC 14 4 Package related soldering information Table 6 Suitability of IC packages for wave reflow and dipping soldering methods Mounting Package 1 Soldering method Wave Reflow 2 Dipping Through hole DBS DIP HDIP RDBS suitable 3 suitable mount SDIP SIL Through hole PMFP 4 not suitable not surface mount suitable Surface mount BGA LBGA LFBGA not suitable suitable SQFP SSOP T 5 TFBGA VFBGA DHVQFN HBCC HBGA not suitable 8l suitable HLQFP HSQFP HSOP HTQFP HTSSOP HVQFN HVSON SMS PLCC 1 SO SOJ suitable suitable LQFP QFP TQFP not recommended 7 8 suitable SSOP TSSOP VSO not recommended 1 suitable VSSOP 1 2 6 7 8 9 9397 750 13113 For more detailed information on the BGA packages refer to the LF BGA Application Note AN01026 order a copy from your Philips Semiconductors sales office All surface mount SMD packages are moisture sensitive Depending upon the moisture con
25. mains voltage according to the following formula Vaux z Nx V mains I ee DEM Roem RpEM N Where N N The latter function requires an on time of at least 2 us This on time ensures that a reliable demag current can be measured Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 10 of 27 Philips Semiconductors TEA1 532 7 15 7 16 GreenChip II SMPS control IC When pin DEM is grounded CCM the brown out protection is disabled In this case the duty cycle is limited to 0 7 so at low mains voltage the on time is limited and therefore the dissipation in the FET is limited OverTemperature Protection OTP The IC provides accurate temperature protection The IC will stop switching when the junction temperature exceeds the thermal shutdown temperature When Vcc drops to Vuvio Capacitor Cycc will be recharged to the V tart level however switching will not restart Subsequently Vcc will drop again to Vyvio etc Operation only recommences when Vcc drops below a level of about 4 5 V typically when Vmains iS disconnected for a short period Soft start up pin SENSE To prevent transformer rattle at start up or during hiccup the transformer peak current is slowly increased by the soft start function This can be achieved by inserting a resistor and a capacitor between pin SENSE pin 6 and sense resistor Rsense An internal current
26. ry low external component count E Fixed frequency Continuous Conduction Mode CCM operation capability E Quasi Resonant QR Discontinuous Conduction Mode DCM operation capability Green features Valley or zero voltage switching for minimum switching losses in QR operation E Cycle skipping mode at very low loads input power lt 300 mW at no load operation for a typical adapter application On chip start up current source Protection features E Safe restart mode for system fault conditions E Zero current switch on in QR mode E Undervoltage protection foldback during overload PHILIPS Philips Semiconductors TEA1 532 GreenChip II SMPS control IC E IC overtemperature protection latched E Low and adjustable overcurrent protection trip level E Soft re start E Mains voltage dependent operation enabling level E General purpose input for latched or safe restart protection and timing e g to be used for overvoltage protection OVP output short circuit protection or system overtemperature protection E Brown out protection 3 Applications E Printer adapters and chargers The device can also be used in all applications that demand an efficient and cost effective solution up to 250 W 4 Ordering information Table 1 Ordering information Type number Package Name Description Version TEA1532T SO8 plastic small outline package 8 leads body SOT96 1 width 3 9 mm TEA1532P DIP
27. s exist for reflowing for example convection or convection infrared heating in a conveyor type oven Throughput times preheating soldering and cooling vary between 100 and 200 seconds depending on heating method Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material The top surface temperature of the packages should preferably be kept e below 225 C SnPb process or below 245 C Pb free process for all the BGA and SSOP T packages Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 22 of 27 Philips Semiconductors TEA1 532 14 3 2 14 3 3 9397 750 13113 GreenChip II SMPS control IC for packages with a thickness gt 2 5 mm for packages with a thickness lt 2 5 mm and a volume gt 350 mm8 so called thick large packages e below 240 C SnPb process or below 260 C Pb free process for packages with a thickness lt 2 5 mm and a volume lt 350 mm so called small thin packages Moisture sensitivity precautions as indicated on packing must be respected at all times Wave soldering Conventional single wave soldering is not recommended for surface mount devices SMDs or printed circuit boards with a high component density as solder bridging and non wetting can present major problems To overcome these problems the double wave soldering method was specifically developed If wave sold
28. see Figure 1 The IC will activate the power converter as soon as the voltage on pin Voc passes the Vetart level The IC supply is taken over by the auxiliary winding as soon as the output voltage reaches its intended level and the IC supply from the mains voltage is subsequently stopped for high efficiency operation green function The moment the voltage on pin Vcc drops below Vyy_o undervoltage lock out the IC stops switching and enters a safe restart from the rectified mains voltage Inhibiting the auxiliary supply by external means causes the converter to operate in a stable well defined burst mode Supply management All internal reference voltages are derived from a temperature compensated on chip band gap circuit Current control mode Current control mode is used for its good line regulation behavior The on time is controlled by the internally inverted pin CTRL voltage which is compared with the primary current information The primary current is sensed across an external resistor The driver output is latched in the logic preventing multiple switch on The internal control voltage is inversely proportional to the external pin CTRL voltage with an offset of 1 5 V This means that a voltage range from 1 V to approximately 1 5 V on pin CTRL will result in an internal control voltage range from 0 5 V to 0 V a high external control voltage results in a low duty cycle Vsense max coa016 0 52 V Cycle skip active
29. sk work right infringement unless otherwise specified 19 Trademarks GreenChip is a trademark of Koninklijke Philips Electronics N V For additional information please visit http www semiconductors philips com For sales office addresses send an email to sales addresses www semiconductors philips com 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 26 of 27 Philips Semiconductors TEA1532 GreenChip I SMPS control IC 21 Contents 1 General description 0000eeeeue 1 2 Features 00 c ccc eee eee eee eee eee 1 2 1 Distinctive features 000 1 2 2 Green features 0 0000 cee eens 1 2 3 Protection features 0 0000ee 1 3 Applications 00 00 eee eee 2 4 Ordering information 000055 2 5 Block diagram 00 cee eee eee 3 6 Pinning information 0 000s ee eee 4 6 1 PINNING 23r pne4 densa wee aya eee 4 6 2 Pin description 0020 eee 4 7 Functional description 4 7 1 Start up mains enabling operation level and undervoltage lock out 22 6 7 2 Supply management 0 00 6 7 3 Current control mode 2 00 6 7 4 Oscillator i aa Mi dae th oped ee de 7 7 5 Cycle skipping 0 2 eee eee eee 7 7 6 Demagnetization QR operation 7 7 7 Continuous Con
30. suitable for fine pitch SMDs In these situations reflow soldering is recommended Driven by legislation and environmental forces the worldwide use of lead free solder pastes is increasing Through hole mount packages Soldering by dipping or by solder wave Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C depending on solder material applied SnPb or Pb free respectively The total contact time of successive solder waves must not exceed 5 seconds The device may be mounted up to the seating plane but the temperature of the plastic body must not exceed the specified maximum storage temperature Tstg max If the printed circuit board has been pre heated forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit Manual soldering Apply the soldering iron 24 V or less to the lead s of the package either below the seating plane or not more than 2 mm above it If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds If the bit temperature is between 300 and 400 C contact may be up to 5 seconds Surface mount packages Reflow soldering Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement Several method
31. tent the maximum temperature with respect to time and body size of the package there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them the so called popcorn effect For details refer to the Drypack information in the Data Handbook IC26 Integrated Circuit Packages Section Packing Methods For SDIP packages the longitudinal axis must be parallel to the transport direction of the printed circuit board Hot bar soldering or manual soldering is suitable for PMFP packages These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven The package body peak temperature must be kept as low as possible These packages are not suitable for wave soldering On versions with the heatsink on the bottom side the solder cannot penetrate between the printed circuit board and the heatsink On versions with the heatsink on the top side the solder might be deposited on the heatsink surface If wave soldering is considered then the package must be placed at a 45 angle to the solder wave direction The package footprint must incorporate solder thieves downstream and at the side corners Wave soldering is suitable for LQFP QFP and TQFP packages with a pitch e lar
32. the best possible product Ill Product data Production This data sheet contains data from the product specification Philips Semiconductors reserves the right to make changes at any time in order to improve the design manufacturing and supply Relevant changes will be communicated via a Customer Product Process Change Notification CPCN 1 Please consult the most recently issued data sheet before initiating or completing a design 2 The product status of the device s described in this data sheet may have changed since this data sheet was published The latest information is available on the Internet at URL http www semiconductors philips com 3 For data sheets describing multiple type numbers the highest level product status determines the data sheet status 17 Definitions Short form specification The data in a short form specification is extracted from a full data sheet with the same type number and title For detailed information see the relevant data sheet or data handbook Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System IEC 60134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may aff
33. the current spikes across Rsense 8 Limiting values 9397 750 13113 Table 3 Limiting values In accordance with the Absolute Maximum Rating System IEC 60134 All voltages are measured with respect to ground pin 2 positive currents flow into the chip pin Vcc may not be current driven The voltage ratings are valid provided other ratings are not violated current ratings are valid provided the maximum power rating is not violated Symbol Parameter Conditions Min Max Unit Voltages Voc supply voltage continuous 0 4 20 V VPROTECT voltage on pin PROTECT continuous 0 4 5 V VeTRL voltage on pin CTRL 0 4 5 V VDEM voltage on pin DEM current limited V VSENSE voltage on pin SENSE current limited 0 4 z V VDRAIN voltage on pin DRAIN 0 4 650 V Currents CTRL current on pin CTRL d lt 10 50 mA IDEM current on pin DEM 1000 250 uA ISENSE current on pin SENSE 1 10 mA IDRIVER current on pin DRIVER d lt 10 0 8 2 A IDRAIN current on pin DRAIN 5 mA General Piot total power dissipation Tamb lt 70 C SO8 package 0 5 W DIP8 package 0 75 WwW T stg storage temperature 55 150 C T junction temperature 20 145 C ESD Vesp electrostatic discharge class 1 voltage human body model pins 1 to 7 O 2000 V pin 8 DRAIN H 1500 V machine model el 200 V 1 Equivalent to discharging a 100 pF capacitor through a 1 5 KQ series resistor
34. the drain voltage has reached the lowest voltage to minimize switching losses green function The primary resonant circuit of primary inductance and drain capacitor ensures this quasi resonant operation The design can be optimized in such a way that zero voltage switching can extend over most of the universal mains range To prevent very high frequency operation at lower loads the quasi resonant operation changes smoothly in fixed frequency Pulse Width Modulation PWM control 9397 750 13113 Koninklijke Philips Electronics N V 2004 All rights reserved Preliminary data sheet Rev 01 28 May 2004 5 of 27 Philips Semiconductors TEA1 532 7 1 7 2 7 3 9397 750 13113 GreenChip ll SMPS control IC In fixed frequency continuous conduction mode the internal oscillator determines the start of the next converter stroke In both operating modes a cycle skipping mode is activated at very low power standby levels Start up mains enabling operation level and undervoltage lock out Refer to Figure 10 and Figure 11 Initially the IC is self supplying from the rectified mains voltage via pin DRAIN Supply capacitor Cycc at pin 1 is charged by the internal start up current source to a level of about 4 V or higher depending on the drain voltage Once the drain voltage exceeds the Vm mains dependent operation enabling level the start up current source will continue charging capacitor Cyce switch S1 will be opened
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PHILIPS TEA1532 handbook