PHILIPS TEA152x family STARplug handbook
Contents
1. Philips Semiconductors Product specification STARplug M TEA152x family PINNING PIN SYMBOL DESCRIPTION TEA152xP TEA152xT TEA152xAJM 1 1 supply voltage 2 3 4 5 9 and 10 ground frequency setting 2 3 7 4 regulation input 5 signal ground connected to exposed die pad must be connected to pin 2 6 7 source of internal MOS switch AUX 5 input for voltage from auxiliary winding for timing demagnetization SOURCE 6 11 n c 7 12 and 13 DRAIN 8 14 Voc U DRAIN not connected drain of internal MOS switch input for start up current and valley sensing GND n c Voc TEA152xP RC SOURCE SNB REG AUX ds MGT420 REG SGND TEA152xAJM Fig 2 Pin configuration of TEA152xP AUX SOURCE DRAIN MGT422 n c Fig 4 Pin configuration of TEA152xAJM TEA152xT SOURCE GND GND AUX MGT421 Fig 3 Pin configuration of TEA152xT 2000 Sep 08 5 Philips Semiconductors STARplug M FUNCTIONAL DESCRIPTION The TEA152x family is the heart of a compact flyback converter with the IC placed at the primary side The auxiliary winding of the transformer can be used for indirect feedback to control the isolated output This additional winding also powers the IC A more accurate control of the output voltage and or current can be implemented with an additional secondary sensing circuit and optocoupler feedback The TEA152x family uses2. 10 VCcC stop Voc stop voltage under voltage 7 5 8 0 lock out Pulse width modulator minimum duty factor maximum duty factor f 100 kHz demagnetization recognition voltage level tsuppr suppression of transformer ringing at start of secondary stroke RC oscillator VRC min minimum voltage of RC oscillator setting VRC max maximum voltage of RC oscillator setting iRC ch RC charging time fosc frequency range of oscillator 10 100 200 kHz 2000 Sep 08 10 Philips Semiconductors Product specification STARplug M TEA152x family SYMBOL PARAMETER CONDITIONS Duty factor regulator pin REG VREG input voltage voltage gain of error amplifier dB VREG clamp clamping voltage at pin REG IREG 6 mA 7 5 V Valley switching not implemented in TEA152xAJM versions fvalley ringing frequency for valley N x Vo 100 V 550 800 kHz switching ta valley swon delay from valley recognition to 150 5 switch on Current and short circuit winding protection Vsource ma maximum source voltage dV dt 0 1 V us 0 50 83 ta propagation delay from detecting VsRctmax to dV dt 0 5 5 160 18 switch off short circuit winding protection dV dt 0 5 V us 0 75 voltage blanking time for current and short circuit winding protection Output stage FET IL drain drain leakage current Varain 650 V t 2 V BR drain drain bre
3. 2000 Sep 08 17 Philips Semiconductors Product specification STARplug M TEA152x family DATA SHEET STATUS PRODUCT 1 DATA SHEET STATUS STATUS DEFINITIONS Objective specification Development This data sheet contains the design target or goal specifications for product development Specification may change in any manner without notice Preliminary specification Qualification This data sheet contains preliminary data and supplementary data will be published at a later date Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product Product specification Production This data sheet contains final specifications Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product Note 1 Please consult the most recently issued data sheet before initiating or completing a design DEFINITIONS Short form specification The data in a short form specification is extracted from a full data sheet with the same type number and title For detailed information see the relevant data sheet or data handbook Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System IEC 60134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and o
4. A dedicated circuit for valley switching is built in not implemented in TEA152xAJM versions which makes a very efficient slim line electronic powerplug concept possible In its most basic version of application the TEA152x family acts as a voltage source Here no additional secondary electronics are required A combined voltage and current Source can be realized with minimum costs for external components Implementation of the TEA152x family renders an efficient and low cost power supply system Table 1 Available type numbers DIP8 S014 DBS9P TEA1520P TEA1520T TEA1521T Rps on 48 Q 24 Q TEA1521P 120 TEA1522P EA1522T TEA1522AJM 6 5 Q TEA1523P TEA1523T TEA1523AJM 3 40 TEA1524P TEA1524AJM APPLICATIONS Typical application areas for the STARplug are e Chargers e Adapters e STB Set Top Box e DVD CD R TV monitor standby supplies PC peripherals Microcontroller supplies in home applications and small portable equipment etc Philips Semiconductors Product specification STARplug M TEA152x family QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS Varain max maximum voltage at the DRAIN T lt 0 C pin Rps on drain source on state resistance Tj 25 C Isource 0 06 A of TEA1520 T 100 C Igource 0 06 A drain source on state resistance T 25 C lsource 0 125 A of TEA1 521 Tj 100 C Isource 0 125 A drain source on sta
5. Notes 1 Human body model equivalent to discharging a 100 pF capacitor through a 1 5 kQ series resistor All pins are 2500 V maximum except pin DRAIN which is 1000 V maximum 2 Machine model equivalent to discharging a 200 pF capacitor through a 0 75 uH coil and a 10 series resistor 2000 Sep 08 9 Philips Semiconductors Product specification STARplug M TEA152x family THERMAL CHARACTERISTICS SYMBOL PARAMETER CONDITIONS VALUE UNIT Rih a thermal resistance from junction to ambient note 1 TEA152xP in free air 100 K W TEA152xT in free air 91 K W TEA152xAJM in free air 65 K W Note 1 Thermal resistance Ria can be lower when the GND pins are connected to sufficient copper area on the printed circuit board See the TEA152x application notes for details QUALITY SPECIFICATION In accordance with SNW FQ 61 1 part E CHARACTERISTICS Tamb 25 C no overtemperature all voltages are measured with respect to ground currents are positive when flowing into the IC unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Supply lcC operate Supply current normal operation 1 3 1 9 Iccistartup Start up supply current start up 180 400 ldrain supply current drawn from DRAIN auxiliary supply Vgrain gt 60 V 1 5 2 pin with auxiliary supply Vgrain gt 60 V 30 125 IcC ch Vcc pin charging current Varain gt 60 V Vocistart Voc start voltage 9 5
6. these products are free from patent copyright or mask work right infringement unless otherwise specified Philips Semiconductors Product specification STARplug M TEA152x family NOTES 2000 Sep 08 19 Philips Semiconductors Argentina see South America Australia 3 Figtree Drive HOMEBUSH NSW 2140 Tel 61 2 9704 8141 Fax 61 2 9704 8139 Austria Computerstr 6 A 1101 WIEN P O Box 213 Tel 43 1 60 101 1248 Fax 43 1 60 101 1210 Belarus Hotel Minsk Business Center Bld 3 r 1211 Volodarski Str 6 220050 MINSK Tel 375 172 20 0733 Fax 375 172 20 0773 Belgium see The Netherlands Brazil see South America Bulgaria Philips Bulgaria Ltd Energoproject 15th floor 51 James Bourchier Blvd 1407 SOFIA Tel 359 2 68 9211 Fax 359 2 68 9102 Canada PHILIPS SEMICONDUCTORS COMPONENTS Tel 1 800 234 7381 Fax 1 800 943 0087 China Hong Kong 501 Hong Kong Industrial Technology Centre 72 Tat Chee Avenue Kowloon Tong HONG KONG Tel 852 2319 7888 Fax 852 2319 7700 Colombia see South America Czech Republic see Austria Denmark Sydhavnsgade 23 1780 COPENHAGEN V Tel 45 33 29 3333 Fax 45 33 29 3905 Finland Sinikalliontie 3 FIN 02630 ESPOO Tel 358 9 615 800 Fax 358 9 6158 0920 France 51 Rue Carnot BP317 92156 SURESNES Cedex Tel 33 1 4099 6161 Fax 33 1 4099 6427 Germany HammerbrookstraBe 69 D 20097 HAMBURG Tel 49 40 2353 60 Fax 49 40 2353 6300 Hungar
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9. AN VERSION IEC JEDEC EIAJ PROJECTION SOT108 1 076E06 MS 012 x P on ISSUE DATE 2000 Sep 08 14 Philips Semiconductors Product specification STARplug M TEA152x family DBS9P plastic DIL bent SIL power package 9 leads lead length 12 11 mm exposed die pad SOT523 1 non concave x DIMENSIONS mm are the original dimensions UNIT A bp c D D4O Dp EM Ep k 27 0 80 0 58 13 2 6 2 147 3 0 12 4 mm 55 065 0 48 12 8 58 1351143 99 2 54 1 27 5 08 56 110 Notes 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included 2 Plastic surface within circle area D4 may protrude 0 04 mm maximum REFERENCES EUROPEAN PROJECTION OUTLINE VERSION IEC JEDEC EIAJ SOT523 1 E Q 00 07 03 ISSUE DATE 2000 Sep 08 15 Philips Semiconductors STARplug M SOLDERING Introduction This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our Data Handbook 16026 Integrated Circuit Packages document order number 9398 652 90011 There is no soldering method that is ideal for all IC packages Wave soldering is often pr
10. INTEGRATED CIRCUITS DATA SHEET TEA152x family STARplug Product specification 2000 Sep 08 File under Integrated Circuits 1 Philips PHILIPS Semiconductors DH LI L Philips Semiconductors Product specification STARplug TEA152x family FEATURES Designed for general purpose supplies up to 50 W Integrated power switch TEA1520 48 0 650 V TEA1521 24 0 650 V TEA1522 12 0 650 V TEA1523 6 5 0 650 V TEA1524 3 4 0 650 V Operates from universal AC mains supplies 80 to 276 V Adjustable frequency for flexible design RC oscillator for load insensitive regulation loop constant Valley switching for minimum switch on loss not implemented in TEA152xAJM versions Frequency reduction at low power output makes low standby power possible 100 mW Adjustable overcurrent protection Under voltage protection Temperature protection Short circuit winding protection Simple application with both primary and secondary opto feedback Available in 8 pin DIP 14 pin SO and 9 pin DBS packages GENERAL DESCRIPTION The TEA152x family is a Switched Mode Power Supply SMPS controller IC that operates directly from the rectified universal mains It is implemented in the high voltage EZ HV SOI process combined with a low voltage BICMOS process The device includes a high voltage power switch and a circuit for start up directly from the rectified mains voltage 2000 Sep 08
11. akdown voltage Ti gt 0 C 25 C lsource 0 06 A 100 C lsource 0 06 A 25 C Isource 0 125 A 100 C lsource 0 125 A drain source on state resistance i 25 C lsource 0 25 A drain source on state resistance T of TEA1S22 Tj 100 C Isource 0 25 A of TEA1520 drain source on state resistance of TEA1521 ODIO O O drain source on state resistance of TEA1523 25 C Isource 0 5A 100 C Isource 0 5 A i 25 C lsource 1 0 A 100 C lsource 1 0 A drain fall time Vi 300 V no external capacitor at drain O O drain source on state resistance of TEA1524 e oa 2 o Temperature protection Tprot max maximum temperature threshold Tprot hys hysteresis temperature 2000 Sep 08 11 Philips Semiconductors Product specification STARplug M TEA152x family APPLICATION INFORMATION LF D5 bx t PEN d zw ol Vo lt CFI CF2 Di 4 mains 1 3 R1 R2 D2 L 1 E C6 Ycap RRC R SOURCE l R4 C 4 0 AUX RAUX BE 5 C R3 e 4 4 2 MGT425 Fig 7 Primary sensed application configuration for TEA152xP Further application information can be found in the TEA152x application notes 2000 Sep 08 12 Philips S
12. eferred when through hole and surface mount components are mixed on one printed circuit board However wave soldering is not always suitable for surface mount ICs or for printed circuit boards with high population densities In these situations reflow soldering is often used Through hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C solder at this temperature must not be in contact with the joints for more than 5 seconds The total contact time of successive solder waves must not exceed 5 seconds The device may be mounted up to the seating plane but the temperature of the plastic body must not exceed the specified maximum storage temperature Tstgmax If the printed circuit board has been pre heated forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit MANUAL SOLDERING Apply the soldering iron 24 V or less to the lead s of the package either below the seating plane or not more than 2 mm above it If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds If the bit temperature is between 300 and 400 C contact may be up to 5 seconds Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing s
13. emiconductors Product specification STARplug M TEA152x family PACKAGE OUTLINES DIP8 plastic dual in line package 8 leads 300 mil SOT97 1 lt seating plane 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions A A max in max by b2 p g UNIT 9 8 6 48 9 2 6 20 0 39 0 26 0 36 0 24 4 2 3 2 inches 0 17 0 13 Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC EIAJ PROJECTION SOT97 1 050G01 MO 001 SC 504 8 Ey 9 m 2 ISSUE DATE 2000 Sep 08 13 Philips Semiconductors Product specification STARplug M TEA152x family SO14 plastic small outline package 14 leads body width 3 9 mm SOT108 1 detail X 2 5 Scale DIMENSIONS inch dimensions are derived from the original mm dimensions UNIT Ai Ao A3 c D eM HE 0 25 8 75 4 0 6 2 0 19 8 55 3 8 5 8 0 0100 0 35 0 16 inches 0 0075 0 34 0 15 Note 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included OUTLINE REFERENCES EUROPE
14. he circuit waits for a low drain voltage before starting a new primary stroke Figure 5 shows the drain voltage together with the valley signal the signal indicating the secondary stroke and the RC voltage The primary stroke starts some time before the actual valley at low ringing frequencies and some time after the actual valley at high ringing frequencies Figure 6 shows a typical curve for a reflected output voltage N x Vo of 80 V This voltage is the output voltage Vs see Fig 7 transferred to the primary side of the transformer with the factor N determined by the turns ratio of the transformer Figure 6 shows that the system switches exactly at minimum drain voltage for ringing frequencies of 480 kHz thus reducing the switch on losses to a minimum At 200 kHz the next primary stroke is started at 33 before the valley The switch on losses are still reduced significantly Demagnetization The system operates in discontinuous conduction mode all the time As long as the secondary stroke has not ended the oscillator will not start a new primary stroke During the first tsuppr seconds demagnetization recognition is suppressed This suppression may be necessary in applications where the transformer has a large leakage inductance and at low output voltages Philips Semiconductors Product specification STARplug M TEA152x family primary secondary secondary stroke stroke ringing drain secondary stroke RC oscil
15. lator regulation level MGT423 A Start of new cycle with valley switching B Start of new cycle in a classical PWM system Fig 5 Signals for valley switching MGT424 20 0 200 400 600 800 f kHz Fig 6 Typical phase of drain ringing at switch on at N x Vo 80 V 2000 Sep 08 7 Philips Semiconductors STARplug M Minimum and maximum duty factor The minimum duty factor of the switched mode power supply is 0 The maximum duty factor is set to 7596 typical value at 100 kHz oscillation frequency Overcurrent protection The cycle by cycle peak drain current limit circuit uses the external source resistor to measure the current The circuit is activated after the leading edge blanking time tiep The protection circuit limits the source voltage to Vsnc max and thus limits the primary peak current Short circuit winding protection The short circuit winding protection circuit is also activated after the leading edge blanking time If the source voltage exceeds the short circuit winding protection voltage Vswp the IC stops switching Only a Power on reset will restart normal operation The short circuit winding protection also protects in case of a secondary diode short circuit Overtemperature protection An accurate temperature protection is provided in the device When the junction temperature exceeds the thermal sh
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17. on four sides the footprint must be placed at a 45 angle to the transport direction of the printed circuit board The footprint must incorporate solder thieves downstream and at the side corners During placement and before soldering the package must be fixed with a droplet of adhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured Typical dwell time is 4 seconds at 250 C A mildly activated flux will eliminate the need for removal of corrosive residues in most applications MANUAL SOLDERING Fix the component by first soldering two diagonally opposite end leads Use a low voltage 24 V or less soldering iron applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 C When using a dedicated tool all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Philips Semiconductors Product specification STARplug M TEA152x family Suitability of IC packages for wave reflow and dipping soldering methods SOLDERING METHOD MOUNTING PACKAGE WAVE REFLOW DIPPING Through hole mount DBS DIP HDIP SDIP SIL suitable z suitable Surface mount BGA LFBGA SQFP TFBGA not suitable suitable HBCC HLQFP HSQFP HSOP HTQFP not suitable 3 suitable HTSSOP SMS PLCC 4 SO SOJ suitable suitable LQFP QFP TQFP not recommended 4 5
18. peration of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Applications that are described herein for any of these products are for illustrative purposes only Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification 2000 Sep 08 DISCLAIMERS Life support applications These products are not designed for use in life support appliances devices or Systems where malfunction of these products can reasonably be expected to result in personal injury Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application Right to make changes Philips Semiconductors reserves the right to make changes without notice in the products including circuits standard cells and or software described or contained herein in order to improve design and or performance Philips Semiconductors assumes no responsibility or liability for the use of any of these products conveys no licence or title under any patent copyright or mask work right to these products and makes no representations or warranties that
19. suitable SSOP TSSOP VSO not recommended suitable E Notes 1 All surface mount SMD packages are moisture sensitive Depending upon the moisture content the maximum temperature with respect to time and body size of the package there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them the so called popcorn effect For details refer to the Drypack information in the Data Handbook IC26 Integrated Circuit Packages Section Packing Methods 2 For SDIP packages the longitudinal axis must be parallel to the transport direction of the printed circuit board 3 These packages are not suitable for wave soldering as a solder joint between the printed circuit board and heatsink at bottom version can not be achieved and as solder may stick to the heatsink on top version 4 f wave soldering is considered then the package must be placed at a 45 angle to the solder wave direction The package footprint must incorporate solder thieves downstream and at the side corners 5 Wave soldering is only suitable for LQFP QFP and TQFP packages with a pitch e equal to or larger than 0 8 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 65 mm 6 Wave soldering is only suitable for SSOP and TSSOP packages with a pitch e equal to or larger than 0 65 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 5 mm
20. te resistance T 25 C Isource 0 25 A of TEA1522 Tj 100 C Isource 0 25 A Oo drain source on state resistance Tj 25 C lsource 70 5 A drain source on state resistance T 25 C Isource 1 0 A fosc frequency range of oscillator ldrain supply current drawn from DRAIN no auxiliary supply pin ambient temperature ORDERING INFORMATION o PACKAGE NUMBER NAME DESCRIPTION VERSION TEA152xP DIP8 plastic dual in line package 8 leads 300 mil SOT97 1 TEA152xT SO14 plastic small outline package 14 leads body width 3 9 mm SOT108 1 TEA152xAJM DBS9P plastic DIL bent SIL power package 9 leads lead length SOT523 1 12 11 mm exposed die pad 2000 Sep 08 3 Philips Semiconductors Product specification STARplug M TEA152x family BLOCK DIAGRAM 7 DRAIN TEA152x GND fie stop RC OSCILLATOR THERMAL SOURCE low freq SHUTDOWN PROTECTION LOGIC POWER UP 1 RESET overcurrent REG AUX short circuit winding MGT419 The valley switching circuit is not implemented in the TEA152xAJM versions The pinning shown in this diagram is the pinning of the DIP8 package For the pinning of the other packages see the relevant pinning tables and pin configurations Fig 1 Block diagram 2000 Sep 08 4
21. tencilling or pressure syringe dispensing before package placement Several methods exist for reflowing for example infrared convection heating in a conveyor type oven Throughput times preheating soldering and cooling vary between 100 and 200 seconds depending on heating method 2000 Sep 08 Product specification TEA152x family Typical reflow peak temperatures range from 215 to 250 C The top surface temperature of the packages should preferable be kept below 230 C WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices SMDs or printed circuit boards with a high component density as solder bridging and non wetting can present major problems To overcome these problems the double wave soldering method was specifically developed If wave soldering is used the following conditions must be observed for optimal results Use a double wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave For packages with leads on two sides and a pitch e larger than or equal to 1 27 mm the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit board smaller than 1 27 mm the footprint longitudinal axis must be parallel to the transport direction of the printed circuit board The footprint must incorporate solder thieves at the downstream end For packages with leads
22. um duty factor of 5096 under normal operating conditions and a minimized dead time The magnitude of the ripple in the output voltage is determined by the frequency and duty factor of the converter the output current level and the value and ESR of the output capacitor Input characteristics of complete powerplug INPUT VOLTAGE The input voltage range comprises the universal AC mains 80 to 276 V Philips Semiconductors Product specification STARplug M TEA152x family LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 60134 all voltages are measured with respect to ground positive currents flow into the device pins Vcc and RC are not allowed to be current driven pins REG and AUX are not allowed to be voltage driven SYMBOL PARAMETER CONDITIONS m n MAX UNIT Voltages Voc low supply voltage continuous 0 4 Vsource source of the DMOS power transistor voltage 0 4 Currents laux auxiliary winding input current source source current of TEA1520 TEA1521 TEA1522 TEA1523 TEA1524 ldrain drain current of TEA1520 TEA1521 TEA1522 TEA1523 TEA1524 Prot total power dissipation TEA152xP TEA152xT TEA152xAJM Tamb gt 45 C without heatsink Tag Storage temperate 489 6 Tamb ambient temperature 20 85 C n par 8 Vesd electrostatic discharge voltage human body model note 1 2500 V pes D
23. utdown temperature the IC stops switching During thermal protection the IC current is lowered to the start up current The IC continues normal operation as Soon as the overtemperature situation has disappeared Overvoltage protection Overvoltage protection can be achieved in the application by pulling pin REG above its normal operation level The current primary stroke is terminated immediately and no new primary stroke is started until the voltage on pin REG drops to its normal operation level Pin REG has an internal clamp The current feed into this pin must be limited 2000 Sep 08 Product specification TEA152x family Output characteristics of complete powerplug OUTPUT POWER A wide range of output power levels can be handled by choosing the Rps on and package of the TEA152x family Power levels up to 50 W can be realised ACCURACY The accuracy of the complete converter functioning as a voltage source with primary sensing is approximately 896 mainly dependent on the transformer coupling The accuracy with secondary sensing is defined by the accuracy of the external components For safety requirements in case of optocoupler feedback loss the primary sensing remains active when an overvoltage circuit is connected EFFICIENCY An efficiency of 75 at maximum output power can be achieved for a complete converter designed for universal mains RIPPLE A minimum ripple is obtained in a system designed for a maxim
24. uty factor to the regulation voltage at low duty factor is almost equal to the sensitivity at high duty factors This results in a more constant gain over the duty factor range compared to PWM systems with a linear sawtooth oscillator Stable operation at low duty factors is easily realized For high efficiency the frequency is reduced as soon as the duty factor drops below a certain value This is accomplished by increasing the oscillator charge time 2000 Sep 08 Product specification TEA152x family Duty factor control The duty factor is controlled by the internal regulation voltage and the oscillator signal on pin RC The internal regulation voltage is equal to the external regulation voltage minus 2 5 V multiplied by the gain of the error amplifier typical 20 dB 10 x Valley switching not implemented in TEA152xAJM versions A new cycle is started when the primary switch is switched on see Fig 5 After a certain time determined by the oscillator voltage RC and the internal regulation level the Switch is turned off and the secondary stroke starts The internal regulation level is determined by the voltage on pin REG After the secondary stroke the drain voltage shows an oscillation with a frequency of approximately 1 2xmx Lp x Cp where Lp is the primary self inductance and Cy is the parasitic capacitance on the drain node As soon as the oscillator voltage is high again and the secondary stroke has ended t
25. voltage mode control The frequency is determined by the maximum transformer demagnetizing time and the time of the oscillator In the first case the converter operates in the Self Oscillating Power Supply SOPS mode In the latter case it operates at a constant frequency which can be adjusted with external components Rgc and CRc This mode is called Pulse Width Modulation PWM Furthermore a primary stroke is started only in a valley of the secondary ringing This valley switching principle minimizes capacitive Switch on losses Start up and under voltage lock out Initially the IC is self supplying from the rectified mains voltage The IC starts switching as soon as the voltage on pin Vcc passes the Vcc star level The supply is taken over by the auxiliary winding of the transformer as soon as Vcc is high enough and the supply from the line is stopped for high efficiency operation When for some reason the auxiliary supply is not sufficient the high voltage supply also supplies the IC As soon as the voltage on pin Vcc drops below the Vcctkstop level the IC stops switching and restarts from the rectified mains voltage Oscillator The frequency of the oscillator is set by the external resistor and capacitor on pin RC The external capacitor is charged rapidly to the Vgc max level and starting from a new primary stroke it discharges to the Vnc min level Because the discharge is exponential the relative sensitivity of the d
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PHILIPS TEA152x family STARplug handbook