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National Semiconductor LM20EP Enhanced Plastic 2.4V 10 A SC70 micro SMD Temperature Sensor handbook

1. oe 5 DIMENSIONS ARE IN MILLIMETERS DIMENSIONS IN FOR REFERENCE ONLY _ 0 5 LAND PATTERN RECOMMENDATION x3 TOP SIDE COATING a H BUMP BUMP A1 CORNER 0 265 0 215 SILICON AROGE TLA04XXX Rev C 4 Bump micro SMD Ball Grid Array Package Large Bump NS Package Number TLA04ZZA The following dimensions apply to the TLA04ZZA package shown above X1 X2 963um 30um X3 600um 75um LIFE SUPPORT POLICY NATIONAL S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION As used herein JOSUaS n dw GINS 0191W 029S WoL A Z 9NSLId pesueyU dIOZNT 1 Life support devices or systems are devices or 2 A critical component is any component of a life systems which a are intended for surgical implant support device or system whose failure to perform into the body or b support or sustain life and can be reasonably expected to cause the failure of whose failure to perform when properly used in the life support device or system or to affect its accordance with instructions for use provided in the safety or effectiveness labeling can be reasonably expected to result in a significant injury to the user BANNED SUBSTANCE COMPLIANCE National Semiconductor certifies that the products and packing materials meet the provisions of the Customer P
2. Note 12 Non Linearity is defined as the deviation of the calculated output voltage versus temperature curve from the best fit straight line over the temperature range specified Note 13 Regulation is measured at constant junction temperature using pulse testing with a low duty cycle Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance Note 14 Negative currents are flowing into the LM20EP Positive currents are flowing out of the LM20EP Using this convention the LM20EP can at most sink 1 UA and source 16 pA Note 15 Load regulation or output impedance specifications apply over the supply voltage range of 2 4V to 5 5V Note 16 Line regulation is calculated by subtracting the output voltage at the highest supply input voltage from the output voltage at the lowest supply input voltage Typical Performance Characteristic Temperature Error vs Temperature 8 6 S Grade MAX Limit C Grade MAX Limit glk ae Median 5 lee ee B grade MIN Limit s _ ala de T 6 LS Grade MIN Limit C Grade MIN Limit TEMPERATURE ERROR C 75 50 25 0 25 50 75 100 125 150 TEMPERATURE 0C 20099925 PCB Layouts Used for Thermal Measurements No kgr 1 9 mm 20099930 tata b Layout used for measurements with small heat hink a Layout used for no heat sink measurements FIGURE 1 PCB Lyouts used for thermal measurements www national com 4
3. Celsius Centigrade Temperature Sensor 55 C to 130 C Operating from a Single Li lon Battery Cell V 2 4V to 5 5V 20099902 Vo 3 88x10 xT 1 15x10 xT 1 8639 1 8639 wo T 1481 96 Jase x 108 DE 3 88 x 10 where T is temperature and Vo is the measured output voltage of the LM20EP Output Voltage vs Temperature OUTPUT VOLTAGE V 75 50 25 0 25 50 75 100 125 150 TEMPERATURE C 20099924 Temperature T Typical Vo 303 mV 675 mV 919 mV 1515 mV Connection Diagrams SC70 5 4 Vr 3 Vo LM20 2_ GND GND 1_ NC 20099901 Note GND pin 2 may be grounded or left floating For optimum thermal conductivity to the pc board ground plane pin 2 should be grounded NC pin 1 should be left floating or grounded Other signal traces should not be connected to this pin Top View See NS Package Number MAA05A www national com 2205 mV 2318 mV 2485 mV micro SMD 20099932 Note Pin numbers are referenced to the package marking text orientation Reference JEDEC Registration MO 211 variation BA The actual physical placement of package marking will vary slightly from part to part The package marking will designate the date code and will vary considerably Package marking does not correlate to device type in any way Top View See NS Package Number BPAO4DDC and TLA04ZZA Absolute Maximum Ratings note 4 If Military Aerospace specified devices ar
4. LM20EP Transfer Function The LM20EP s transfer function can be described in different ways with varying levels of precision A simple linear transfer function with good accuracy near 25 C is Vo 11 69 mV C x T 1 8663 V Over the full operating temperature range of 55 C to 130 C best accuracy can be obtained by using the para bolic transfer function Vo 3 88x10 xT 1 15x10 xT 1 8639 solving for T 1 8639 Vo 1481 96 J221 3 88 x 10 A linear transfer function can be used over a limited tempera ture range by calculating a slope and offset that give best results over that range A linear transfer function can be calculated from the parabolic transfer function of the LM20EP The slope of the linear transfer function can be calculated using the following equation m 7 76 x 10x T 0 0115 Temperature Range Linear Equation where T is the middle of the temperature range of interest and m is in V C For example for the temperature range of Tmin 30 tO Twax 100 C T 35 C and m 11 77 mV C The offset of the linear transfer function can be calculated using the following equation b Vop T max Vop T mM X Tenet T 2 where Vop Tmax is the calculated output voltage at Tmax using the parabolic transfer function for Vo e Vop T is the calculated output voltage at T using the parabolic transfer function for Vo Using this procedure the best fit linear transfer functi
5. kept especially true if the circuit may operate at cold temperatures where condensation can occur Printed circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM20EP or its connections The thermal resistance junction to ambient 03a is the pa rameter used to calculate the rise of a device junction tem perature due to its power dissipation For the LM20EP the equation used to calculate the rise in the die temperature is as follows Ty Ta O54 V IQ V gt Vo IL where lo is the quiescent current and is the load current on the output Since the LM20EP s junction temperature is the actual temperature being measured care should be taken to minimize the load current that the LM20EP is required to drive The tables shown in Figure 3 summarize the rise in die temperature of the LM20EP without any loading and the thermal resistance for different conditions www national com oNsejd posueyug q30ciN1 LM20EP Enhanced Plastic Mou nting Continued SC70 5 small heat sink coin Te coin C W C C W C See Figure 1 for PCB epe samples micro SMD micro SMD no heat sink small heat fin Oya Ty Ta Ja Ty Ta C W C C W C SC70 5 no heat sink SC70 5 SC70 5 no heat sink small heat sink esin eo cemo eo C W C C W C 312 017 015 micro SMD micro SMD no heat sink small heat fin O50 Ty T
6. 0 O0 LM20BIM7EPQ 0 0 b May 2004 National Semiconductor LM20EP Enhanced Plastic 2 4V 10uA SC70 micro SMD Temperature Sensor General Description Features The LM20EP is a precision analog output CMOS integrated Rated for full 55 C to 130 C range circuit temperature sensor that operates over a 55 C to 1m Available in an SC70 and a micro SMD package 130 C temperature range The power supply operating 1m Predictable curvature error range is 2 4 V to 5 5 V The transfer function of LM20EP iS Suitable for remote applications predominately linear yet has a slight predictable parabolic curvature The accuracy of the LM20EP when specified to a e parabolic transfer function is 1 5 C at an ambient tempera Key Specifications ture 7 30 C The eee ee linearly and m Accuracy at 30 C 1 5 to 4 C max reaches a maximum of 2 5 at the temperature range m Accuracy at 130 C amp 55 C 2 5 to 5 C max extremes The temperature range is affected by the power supply voltage At a power supply voltage of 2 7Vto5 5V Power Supply Voltage Range 2 4V to 5 5V the temperature range extremes are 130 C and 55 C m Current Drain 10 pA max Decreasing the power supply voltage to 2 4 V changes the m Nonlinearity 0 4 typ negative extreme to 30 C while the positive remains at 130 C m Output Impedance 160 Q max The LM20EP s quiescent current is less than 10 pA There Load Regulation fore self
7. a Ja Ty a Ta C W C C W C FIGURE 3 Temperature Rise of LM20EP Due to Self Heating and Thermal Resistance 03a Capacitive Loads The LM20EP handles capacitive loading well Without any precautions the LM20EP can drive any capacitive load less than 300 pF as shown in Figure 4 Over the specified tem perature range the LM20EP has a maximum output imped ance of 160 Q In an extremely noisy environment it may be necessary to add some filtering to minimize noise pickup It is recommended that 0 1 uF be added from V to GND to bypass the power supply voltage as shown in Figure 5 Ina noisy environment it may even be necessary to add a ca pacitor from the output to ground with a series resistor as shown in Figure 5 A 1 uF output capacitor with the 160 Q maximum output impedance and a 200 Q series resistor will form a 442 Hz lowpass filter Since the thermal time constant ae I l l l 0 1 uF BYPASS L OPTIONAL T l l I I L 20099916 0 1 uF BYPASS L of the LM20EP is much slower the overall response time of the LM20EP will not be significantly affected HEAVY CAPACITIVE LOAD WIRING ETC TO A HIGH IMPEDANCE LOAD 20099915 FIGURE 4 LM20EP No Decoupling Required for Capacitive Loads Less than 300 pF OPTIONAL I l l l l ea 20099933 FIGURE 5 LM20EP with Filter for Noisy Environment and Capacitive Loading greater than 300 pF Either placement of resistor as shown above is just as e
8. e required In please contact the National Semiconductor Sales Office Distributors for availability and specifications Vapor Phase 60 seconds 215 C frared 15 seconds 220 C Operating Ratingsvnote 4 Supply Voltage 6 5V to 0 2V Output Voltage V 0 6 V to Specified Temperature Range Twin lt Ta lt Tmax 0 6 V LM20BEP LM20CEP with Output Current 10 mA 2 4 V lt Vi lt 2 V 30 C lt Ta lt 130 C Input Current at any pin Note 5 5 mA LM20BEP LM20CEP with s 2 7 V lt V lt 5 5 V 55 C lt Ta lt 130 C Storage Temperature 65 C to 150 C LM20SEP with lt V lt 30 C lt lt i Maximum Junction Temperature ciel oe a eee Timax 150 C LM20SEP with lt V s 40 C lt lt i ESD Susceptibility Note 6 af ey a 40 C lt Ta lt 125 C Human Body Model 2500 V Supply vaag Range V 2 4 V to 5 5 V Machine Model 250 V Thermal Resistance 0 Note 8 l Lead T t SC 70 415 C W ao eee micro SMD 340 C W SC 70 Package Note 7 Electrical Characteristics Unless otherwise noted these specifications apply for V 2 7 Voc Boldface limits apply for Ta Ty Tmn to Tmax all other limits T T 25 C Unless otherwise noted Parameter Conditions Typical Units Temperature to Voltage Error T 25 C to 380 C 15 ee Vo 3 88x10 8xT 1 15x10 2xT 1 8639V Note 11 Output Voltage at 0 C Variance from Curve Non Linearity Note 12 Sensor Gain Tempe
9. ffective www national com LM20EP micro SMD Light Sensitivity Exposing the LM20EP micro SMD package to bright sunlight may cause the output reading of the LM20EP to drop by 1 5V In a normal office environment of fluorescent lighting the output voltage is minimally affected less than a millivolt Applications Circuits V R3 R4 LM4040 LM7211 drop In either case it is recommended that the LM20EP micro SMD be placed inside an enclosure of some type that minimizes its light exposure Most chassis provide more than ample protection The LM20EP does not sustain permanent damage from light exposure Removing the light source will cause LM20EP s output voltage to recover to the proper value VTEMP FIGURE 6 Centigrade Thermostat SHUTDOWN D Any logic device output FIGURE 7 Conserving Power Dissipation with Shutdown V 5 0V LM4040BIM3 4 1 Vr4 Vr2 High overtemp alarm Paci Vout v 44 R2 R1 R2 R3 v 4A R2 T2 R2 RIIIR3 20099918 20099919 CS DO CLK 20099928 Most CMOS ADCs found in ASICs have a sampled data comparator input structure that is notorious for causing grief to analog output devices such as the LM20EP and many op amps The cause of this grief is the requirement of instantaneous charge of the input sampling capacitor in the ADC This requirement is easily accommodated by the addition of a capacitor Since not all ADCs have identical input stages the charge req
10. heating is less than 0 02 C in still air Shutdown O pA lt l lt 16 pA 2 5 mV max capability for the LM20EP is intrinsic because its inherent low power consumption allows it to be powered directly from i the output of many logic gates or does not necessitate Applications shutdown at all Battery Management ENHANCED PLASTIC Selected Military Applications e Extended Temperature Performance of 55 C to 130 C Selected Avionics Applications e Baseline Control Single Fab amp Assembly Site e Process Change Notification PCN e Qualification amp Reliability Data e Solder PbSn Lead Finish is standard e Enhanced Diminishing Manufacturing Sources DMS Support Ordering Information VID PART NUMBER NS PACKAGE NUMBER Note 3 V62 04728 01 MAAO5A Notes 1 2 TBD TBD JOSUaS aiNyesodwial GINS 0191W 029S WoL Ar z ONSeld pesueyU dIOZNT Note 1 For the following Enhanced Plastic version check for availability LM20SIBPEP LM20SIBPXEP LM20BIM7EP LM20BIM7XEP LM20CIM7XEP LM20SITLEP LM20SITLXEP Parts listed with an X are provided in Tape amp Reel and parts without an X are in Rails Note 2 FOR ADDITIONAL ORDERING AND PRODUCT INFORMATION PLEASE VISIT THE ENHANCED PLASTIC WEB SITE AT www national com mil Note 3 Refer to package details under Physical Dimensions 2004 National Semiconductor Corporation DS200999 www national com LM20EP Enhanced Plastic Typical Application Full Range
11. on for many popular temperature ranges was calculated in Figure 2 As shown in Figure 2 the error that is introduced by the linear transfer function increases with wider temperature ranges Maximum Deviation of Linear Equation TO Vo from Parabolic Equation C FIGURE 2 First order equations optimized for different temperature ranges Mounting insulated and dry to avoid leakage and corrosion This is The LM20EP can be applied easily in the same way as other integrated circuit temperature sensors It can be glued or cemented to a surface The temperature that the LM20EP is sensing will be within about 0 02 C of the surface tempera ture to which the LM20EP s leads are attached to This presumes that the ambient air temperature is almost the same as the surface temperature if the air temperature were much higher or lower than the surface temperature the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature To ensure good thermal conductivity the backside of the LM20EP die is directly attached to the pin 2 GND pin The tempertures of the lands and traces to the other leads of the LM20EP will also affect the temperature that is being sensed Alternatively the LM20EP can be mounted inside a sealed end metal tube and can then be dipped into a bath or screwed into a threaded hole in a tank As with any IC the LM20EP and accompanying wiring and circuits must be
12. perating Ratings indicate conditions for which the device is functional but do not guarantee specific performance limits For guaranteed specifications and test conditions see the Electrical Characteristics The guaranteed specifications apply only for the test conditions listed Some performance characteristics may degrade when the device is not operated under the listed test conditions Note 5 When the input voltage VI at any pin exceeds power supplies V lt GND or V gt V the current at that pin should be limited to 5 mA Note 6 The human body model is a 100 pF capacitor discharged through a 1 5 kQ resistor into each pin The machine model is a 200 pF capacitor discharged directly into each pin Note 7 See AN 450 Surface Mounting Methods and Their Effect on Product Reliability or the section titled Surface Mount found in any post 1986 National Semiconductor Linear Data Book for other methods of soldering surface mount devices Note 8 The junction to ambient thermal resistance Oja is specified without a heat sink in still air using the printed circuit board layout shown in Figure 1 Note 9 Typicals are at Tj T 25 C and represent most likely parametric norm Note 10 Limits are guaranteed to National s AOQL Average Outgoing Quality Level Note 11 Accuracy is defined as the error between the measured and calculated output voltage at the specified conditions of voltage current and temperature expressed in C
13. rature Sensitivity or Average Slope to equation Vo 11 77 mV CxT 1 860V Output Impedance Load Regulation Note 13 Line Regulation Quiescent Current Change of Quiescent Current 2 4 V lt V lt 5 5V Co T Temperature Coefficient of Note 9 mawe OY mease o meno mesce mewe ooo moe ooo aa Ooo mewe o mese ooo Oooo eS ooo o 80 C T 100 C O pA lt l lt 16 pA Notes 14 15 O pA lt I lt 16 pA a Notes 14 15 mavec ssovev essy 11 77 S Limit Limits Limits Limits Note 10 Note 10 Note 10 3 D Ces sso Ces sso ee ee ee ee ee r 3 3 33 Raa Raed Ream bod 3 3 3 x olololololololololo 5 E jad jad x x ae a x xo 3 D x oO lt mvV C min mvV C max max Q mV max MVN ma mv max pA max o o o mm w wo w amw UA a a a T www national com dNSEiq peoueyuy dIOZNT LM20EP Enhanced Plastic Electrical Characteristics Continued Unless otherwise noted these specifications apply for V 2 7 Voc Boldface limits apply for Ta T Tmn tO Tmax all other limits T T 25 C Unless otherwise noted Parameter Conditions Typical LM20BEP LM20CEP LM20SEP Units Note 9 Limits Limits Limits Limit Note 10 Note 10 Note 10 Note 4 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur O
14. roducts Stewardship Specification CSP 9 111C2 and the Banned Substances and Materials of Interest Specification CSP 9 111S2 and contain no Banned Substances as defined in CSP 9 111S2 National Semiconductor National Semiconductor National Semiconductor National Semiconductor Americas Customer Europe Customer Support Center Asia Pacific Customer Japan Customer Support Center Support Center Fax 49 0 180 530 85 86 Support Center Fax 81 3 5639 7507 Email new feedback nsc com Email europe support nsc com Email ap support nsc com Email jon feedback nsc com Tel 1 800 272 9959 Deutsch Tel 49 0 69 9508 6208 Tel 81 3 5639 7560 English Tel 44 0 870 24 0 2171 www national com Fran ais Tel 33 0 1 41 91 8790 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications
15. uirements will vary necessitating a different value of compensating capacitor This ADC is shown as an example only If a digital output temperature is required please refer to devices such as the LM74 FIGURE 8 Suggested Connection to a Sampling Analog to Digital Converter Input Stage www national com oNsejd pooueyus q30ciN1 LM20EP Enhanced Plastic Physical Dimensions inches millimeters unless otherwise noted SYMM le ee aces I i iT ee eee J Lae 0 15 0 30 I LAND PATTERN RECOMMENDATION kr 3 RO 025 MIN TYP GAGE PLANE RO 025 MIN TYP 0 8 1 1 0 9 0 2 LC 0 5 TYP f a 0 40 05 TYP 0 1 0 2 SEATING PLANE 0 515 TYP DIMENSIONS ARE IN MILLIMETERS MAAO5A Rev C 5 Lead SC70 Molded Package NS Package Number MAA05A PKG SYMM I PKG SYMM G 4 0 5 O DIMENSIONS ARE IN MILLIMETERS Qe DIMENSIONS IN FOR REFERENCE ONLY 0 17 4X iii LAND PATTERN RECOMMENDATION X3 B X2 0 125 a TOP SIDE COATING 0 050 E BUMP X1 BUMP A1 CORNER 0 18 SILICON 0 15 f 4X ie 0 11 m BPA04XXX Rev E 4 Bump micro SMD Ball Grid Array Package Small Bump NS Package Number BPA04DDC The following dimensions apply to the BPA04DDC package shown above X1 X2 853um 30um X3 900um 50um www national com 8 Physical Dimensions inches millimeters unless otherwise noted Continued PKG iy 0 275 J 4X Do 250 PKG SYMM

National Semiconductor LM20EP Enhanced Plastic 2.4V 10 A SC70 micro SMD Temperature Sensor handbook

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