Philips TJA1040 High speed CAN transceiver handbook
Contents
1. CPCN Notes 1 Please consult the most recently issued data sheet before initiating or completing a design 2 The product status of the device s described in this data sheet may have changed since this data sheet was published The latest information is available on the Internet at URL http www semiconductors philips com 3 For data sheets describing multiple type numbers the highest level product status determines the data sheet status DEFINITIONS Short form specification The data in a short form specification is extracted from a full data sheet with the same type number and title For detailed information see the relevant data sheet or data handbook Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System IEC 60134 Stress above one or more of the limiting values may Cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Applications that are described herein for any of these products are for illustrative purposes only Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification 20032. receiver and the wake up filter and after tgus the state of the CAN bus is reflected on pin RXD The supply current on Vcc is reduced to a minimum in such a way that ElectroMagnetic Immunity EMI is guaranteed and a wake up event on the bus lines will be recognized In this mode the bus lines are terminated to ground to reduce the supply current Icc to a minimum A diode is added in series with the high side driver of RXD to prevent a reverse current from RXD to Vcc in the unpowered state In normal mode this diode is bypassed This diode is not bypassed in standby mode to reduce current consumption Split circuit Pin SPLIT provides a DC stabilized voltage of 0 5V c It is turned on only in normal mode In standby mode pin SPLIT is floating The Vspuir circuit can be used to stabilize the recessive common mode voltage by connecting pin SPLIT 2003 Oct 14 Product specification TJA1040 to the centre tap of the split termination see Fig 4 In case of a recessive bus voltage lt 0 5Vcc due to the presence of an unsupplied transceiver in the network with a significant leakage current from the bus lines to ground the split circuit will stabilize this recessive voltage to 0 5Vcc Soa start of transmission does not cause a step in the common mode signal which would lead to poor ElectroMagnetic Emission EME behaviour Wake up In the standby mode the bus lines are monitored via a low power differential comparator Once th
3. Philips Semiconductors Product specification High speed CAN transceiver TJA1040 PACKAGE OUTLINE SO8 plastic small outline package 8 leads body width 3 9 mm SOT96 1 ii z A3 A pin 1 index rr 1 A Hg Lp a LL detail X 2 5 1 ii scale DIMENSIONS inch dimensions are derived from the original mm dimensions UNIT A A2 A3 c DO EQ HE 0 25 5 0 4 0 6 2 0 19 4 8 3 8 5 8 IA 0 0100 0 20 0 16 nenes i 0 0075 0 19 0 15 Notes 1 Plastic or metal protrusions of 0 15 mm 0 006 inch maximum per side are not included 2 Plastic or metal protrusions of 0 25 mm 0 01 inch maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC JEITA PROJECTION SOT96 1 076E03 MS 012 E3 03 02 18 ISSUE DATE 2003 Oct 14 12 Philips Semiconductors High speed CAN transceiver SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our Data Handbook IC 26 Integrated Circuit Packages document order number 9398 652 90011 There is no soldering method that is ideal for all surface mount IC packages Wave soldering
4. TXD STB and RXD will become floating to prevent reverse supplying conditions via these pins Philips Semiconductors Product specification High speed CAN transceiver TJA1040 LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 60134 SYMBOL PARAMETER CONDITIONS Voc supply voltage no time limit operating range V VIxD DC voltage on pin TXD V DC voltage on pin RXD Vcc 0 3 V VsTB DC voltage on pins STB 0 3 Vcc 0 3 V VCANH DC voltage on pin CANH 0 lt Voc lt 5 25 V no time limit 27 40 V VCANL DC voltage on pin CANL 0 lt Voc lt 5 25 V no time limit VsPLIT DC voltage on pin SPLIT 0 lt Vcc lt 5 25 V no time limit transient voltages on pins CANH according to ISO 7637 see Fig 5 CANL and SPLIT electrostatic discharge voltage Human Body Model HBM note 1 pins CANH and CANL and SPLIT all other pins Machine Model MM note 2 virtual junction temperature note 3 Tstg storage temperature Notes 1 Equivalent to discharging a 100 pF capacitor via a 1 5 kQ series resistor 2 Equivalent to discharging a 200 pF capacitor via a 0 75 uH series inductor and a 10 Q series resistor 3 Junction temperature in accordance with IEC 60747 1 An alternative definition of Ty is Tyj Tamb P x Rth vj amb where Rin vj amb is a fixed value to be used for the calculating of Ty The rating for Ty limits the allowable combinations of power dissipat
5. can still be used for certain surface mount ICs but it is not suitable for fine pitch SMDs In these situations reflow soldering is recommended Reflow soldering Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement Driven by legislation and environmental forces the worldwide use of lead free solder pastes is increasing Several methods exist for reflowing for example convection or convection infrared heating in a conveyor type oven Throughput times preheating soldering and cooling vary between 100 and 200 seconds depending on heating method Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material The top surface temperature of the packages should preferably be kept e below 220 C SnPb process or below 245 C Pb free process for all BGA and SSOP T packages for packages with a thickness gt 2 5 mm for packages with a thickness lt 2 5 mm anda volume gt 350 mms so called thick large packages e below 235 C SnPb process or below 260 C Pb free process for packages with a thickness lt 2 5 mm and a volume lt 350 mm so called small thin packages Moisture sensitivity precautions as indicated on packing must be respected at all times Wave soldering Conventional single wave sold
6. release 2003 Oct 14 Document order number 9397 750 11837 Lott make things betta i eee S5 PHILIPS
7. 0 O TJA1040 OO INTEGRATED CIRCUITS DATA SHEET TJA1040 High speed CAN transceiver Product specification 2003 Oct 14 Supersedes data of 2003 Feb 19 Philips PHILIPS Semiconductors DH LI Philips Semiconductors Product specification High speed CAN transceiver TJA1040 FEATURES Fully compatible with the ISO 11898 standard High speed up to 1 MBaud Very low current standby mode with remote wake up capability via the bus Very low ElectroMagnetic Emission EME Differential receiver with high common mode range for ElectroMagnetic Immunity EMI Transceiver in unpowered state disengages from the bus zero load Input levels compatible with 3 3 V and 5 V devices Voltage source for stabilizing the recessive bus level if split termination is used further improvement of EME At least 110 nodes can be connected Transmit Data TXD dominant time out function Bus pins protected against transients in automotive environments Bus pins and pin SPLIT short circuit proof to battery and ground Thermally protected QUICK REFERENCE DATA GENERAL DESCRIPTION The TJA1040 is the interface between the Controller Area Network CAN protocol controller and the physical bus It is primarily intended for high speed applications up to 1 MBaud in passenger cars The device provides differential transmit capability to the bus and differential receive capability to the CAN controller The TJA1040 is the next s
8. 1 Fig 1 Block diagram PINNING SYMBOL DESCRIPTION transmit data input ground supply TXD SIB supply voltage GND CANH receive data output reads out data Voc CANL from the bus lines RXD SPLIT common mode stabilization output 5 MGU160 CANL 6 LOW level CAN bus line CANH 7 HIGH level CAN bus line Fig 2 Pin configuration STB 8 standby mode control input 2003 Oct 14 3 Philips Semiconductors High speed CAN transceiver FUNCTIONAL DESCRIPTION Operating modes The TJA1040 provides two modes of operation which are selectable via pin STB See Table 1 for a description of the modes of operation Table 1 Operating modes pn PINRXD O MODE STB LOW HIGH normal LOW bus dominant bus recessive standby HIGH wake up request no wake up detected request detected NORMAL MODE In this mode the transceiver is able to transmit and receive data via the bus lines CANH and CANL See Fig 1 for the block diagram The differential receiver converts the analog data on the bus lines into digital data which is output to pin RXD via the multiplexer MUX The slope of the output signals on the bus lines is fixed and optimized in a way that lowest ElectroMagnetic Emission EME is guaranteed STANDBY MODE In this mode the transmitter and receiver are switched off and the low power differential receiver will monitor the bus lines A HIGH level on pin STB activates this low power
9. Oct 14 DISCLAIMERS Life support applications These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits standard cells and or software described or contained herein in order to improve design and or performance When the product is in full production status Production relevant changes will be communicated via a Customer Product Process Change Notification CPCN Philips Semiconductors assumes no responsibility or liability for the use of any of these products conveys no licence or title under any patent copyright or mask work right to these products and makes no representations or warranties that these products are free from patent copyright or mask work right infringement unless otherwise specified Philips Semiconductors Product specification High speed CAN transceiver TJA1040 Bare die All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety 90 days from the date of Philips del
10. V LIT normal mode 500 uA lt lo lt 500 uA leakage current standby mode 22 V lt VsPLIT lt 35 V Bus lines pins CANH and CANL dominant output voltage V xp 0 V pin CANH pin CANL Vo dom m matching of dominant output voltage Vcc VoANH VCANL Votait bus differential bus output voltage Vrxp 0 V dominant VeAnH VCANL 45 Q lt R _ lt 652 Vtxp Vcc recessive no load 2003 Oct 14 6 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 SYMBOL PARAMETER CONDITIONS Voireces recessive output voltage normal mode Vrxo Vcc no load standby mode no load lose short circuit output current Vixp 0V lo reces recessive output current 27 V lt Vcoan lt 32 V Vait th differential receiver threshold 12 V lt Vcan lt 12 V voltage 12 V lt Vcann lt 12 V normal mode see Fig 6 standby mode differential receiver hysteresis normal mode voltage 12 V lt Voant lt 12 V 12 V lt VCANH lt 12V input leakage current Vec 0V VoAnH VeANL 9 V common mode input standby or normal mode resistance Ri cm m common mode input VoaNnH VCANL resistance matching differential input resistance standby or normal mode Ci cm common mode input Vtxp Vcc not tested capacitance Ci i dif differential input capacitance Vrxp Vcc not tested Timing characteristics see Fig 8 t
11. a TXD BUSon delay TXD to bus active normal mode delay TXD to bus inactive e BUSon RXD delay bus active to RXD TXD RXD Propagation delay TXD to RXD Vstg 0 V tdom TXD TXD dominant time out Vixp 0 V iBus dominant time for wake up via standby mode bus ta stb norm delay standby mode to normal normal mode mode Thermal shutdown shutdown junction temperature Note 1 All parameters are guaranteed over the virtual junction temperature range by design but only 100 tested at 125 C ambient temperature for dies on wafer level and in addition to this 100 tested at 25 C ambient temperature for cased products unless specified otherwise For bare dies all parameters are only guaranteed with the backside of the die connected to ground 2003 Oct 14 7 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 APPLICATION AND TEST INFORMATION MICROCONTROLLER MGU164 More application information is available in a separate application note Fig 3 Typical application for 5 V microcontroller Voc TJA1040 a CANH DSS R 60 Q VSPLIT 0 5vcc SPLIT in normal mode otherwise floating a R 600 L 7 CANL ____ MGU162 GND 77 Fig 4 Stabilization circuitry and application 2003 Oct 14 8 Philips Semiconductors Product specification High speed CAN transcei
12. e low power differential comparator has detected a dominant bus level for more than tgus pin RXD will become LOW Over temperature detection The output drivers are protected against over temperature conditions If the virtual junction temperature exceeds the shutdown junction temperature Tisa the output drivers will be disabled until the virtual junction temperature becomes lower than Tjgq and TXD becomes recessive again By including the TXD condition the occurrence of output driver oscillation due to temperature drifts is avoided TXD dominant time out function A TXD dominant time out timer circuit prevents the bus lines from being driven to a permanent dominant state blocking all network communication if pin TXD is forced permanently LOW by a hardware and or software application failure The timer is triggered by a negative edge on pin TXD If the duration of the LOW level on pin TXD exceeds the internal timer value tgom the transmitter is disabled driving the bus lines into a recessive state The timer is reset by a positive edge on pin TXD The TXD dominant time out time tyom defines the minimum possible bit rate of 40 kBaud Fail safe features Pin TXD provides a pull up towards Vcc in order to force a recessive level in case pin TXD is unsupplied Pin STB provides a pull up towards Vcc in order to force the transceiver into standby mode in case pin STB is unsupplied In the event that the Vcc is lost pins
13. ering is not recommended for surface mount devices SMDs or printed circuit boards with a high component density as solder bridging and non wetting can present major problems 2003 Oct 14 13 Product specification TJA1040 To overcome these problems the double wave soldering method was specifically developed If wave soldering is used the following conditions must be observed for optimal results e Use a double wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave For packages with leads on two sides and a pitch e larger than or equal to 1 27 mm the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit board smaller than 1 27 mm the footprint longitudinal axis must be parallel to the transport direction of the printed circuit board The footprint must incorporate solder thieves at the downstream end For packages with leads on four sides the footprint must be placed at a 45 angle to the transport direction of the printed circuit board The footprint must incorporate solder thieves downstream and at the side corners During placement and before soldering the package must be fixed with a droplet of adhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured Typical dwell time of the leads in the wave ra
14. ion P and ambient temperature Tamb THERMAL CHARACTERISTICS In accordance with IEC 60747 1 SYMBOL PARAMETER CONDITIONS VALUE UNIT Rintvi a thermal resistance from virtual junction in free air 145 K W to ambient in SO8 package Rinvj s thermal resistance from virtual junction in free air 50 K W to substrate of bare die QUALITY SPECIFICATION Quality specification in accordance with AEC Q100 2003 Oct 14 5 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 CHARACTERISTICS Voc 4 75 to 5 25 V Ty 40 to 150 C and R 60 Q unless specified otherwise all voltages are defined with respect to ground positive currents flow into the IC note 1 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Supply pin Vcc supply current standby mode normal mode recessive Vtxp Vcc dominant Vtxp 0 V Transmit data input pin TXD HIGH level input voltage LOW level input voltage 0 3 0 8 HIGH level input current Vtxp Vcc LOW level input current normal mode Vrxp 0V 100 200 input capacitance not tested iale mode control input pin STB HIGH level input voltage ViH Vu LOW level input voltage HIGH level input current Vs Vcc LOW level input current Vstp 0 V Receive data output pin RXD HIGH level output voltage standby mode IRxD 100 uA HIGH level output current normal mode VRxD Voc 0 4 V VRxD 0 4
15. it is definitely not suitable for packages with a pitch e equal to or smaller than 0 5 mm Hot bar or manual soldering is suitable for PMFP packages REVISION HISTORY DATE CPCN DESCRIPTION 20031014 200307014 Product specification 9397 750 11837 Modification e Change Vingir 0 5 V in standby mode into Vgijth 0 4 V e Add Chapter REVISION HISTORY 20030219 Product specification 9397 750 10887 2003 Oct 14 14 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS 2 3 Development DEFINITION Objective data This data sheet contains data from the objective specification for product development Philips Semiconductors reserves the right to change the specification in any manner without notice Preliminary data Qualification This data sheet contains data from the preliminary specification Supplementary data will be published at a later date Philips Semiconductors reserves the right to change the specification without notice in order to improve the design and supply the best possible product This data sheet contains data from the product specification Philips Semiconductors reserves the right to make changes at any time in order to improve the design manufacturing and supply Relevant changes will be communicated via a Customer Product Process Change Notification Product data Production
16. ivery If there are data sheet limits not guaranteed these will be separately indicated in the data sheet There are no post packing tests performed on individual die or wafer Philips Semiconductors has no control of third party procedures in the sawing handling packing or assembly of the die Accordingly Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing handling packing or assembly of the die It is the responsibility of the customer to test and qualify their application in which the die is used 2003 Oct 14 16 Philips Semiconductors a worldwide company Contact information For additional information please visit http www semiconductors philips com Fax 31 40 27 24825 For sales offices addresses send e mail to sales addresses www semiconductors philips com Koninklijke Philips Electronics N V 2003 SCA75 All rights are reserved Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner The information presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Printed in The Netherlands R16 06 pp17 Date of
17. nges from 3 to 4 seconds at 250 C or 265 C depending on solder material applied SnPb or Pb free respectively A mildly activated flux will eliminate the need for removal of corrosive residues in most applications Manual soldering Fix the component by first soldering two diagonally opposite end leads Use a low voltage 24 V or less soldering iron applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 C When using a dedicated tool all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Philips Semiconductors Product specification High speed CAN transceiver TJA1040 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE REFLOW BGA LBGA LFBGA SQFP SSOP T TFBGA VFBGA not suitable suitable DHVQFN HBCC HBGA HLQFP HSQFP HSOP HTQFP not suitable suitable HTSSOP HVQEN HVSON SMS PLCC SO SOJ suitable suitable LQFP QFP TQFP not recommended 5 6 suitable SSOP TSSOP VSO VSSOP not recommended suitable PMFP 8 not suitable not suitable Notes 1 For more detailed information on the BGA packages refer to the LF BGA Application Note ANO1 026 order a copy from your Philips Semiconductors sales office All surface mount SMD packages are moisture sensitive Depending upon the moisture content the maximum temperature with respect
18. tep up from the TJA1050 high speed CAN transceiver Being pin compatible and offering the same excellent EMC performance the TJA1040 also features e An ideal passive behaviour when supply voltage is off e Avery low current standby mode with remote wake up capability via the bus This makes the TJA1040 an excellent choice in nodes which can be in power down or standby mode in partially powered networks CONDITIONS SYMBOL PARAMETER Voc supply voltage operating range loc supply current standby mode VCANH DC voltage on pin CANH 0 lt Voc lt 5 25 V no time limit VCANL DC voltage on pin CANL 0 lt Voc lt 5 25 V no time limit VsPLIT DC voltage on pin SPLIT 0 lt Vcc lt 5 25 V no time limit electrostatic discharge voltage Human Body Model HBM pins CANH CANL and SPLIT all other pins PD TXD RXD virtual junction temperature ORDERING INFORMATION TYPE propagation delay TXD to RXD Vstg 0 V PACKAGE NUMBER DESCRIPTION VERSION TJA1040T TJA1040U plastic small outline package 8 leads body width 3 9 mm SOT96 1 bare die die dimensions 1840 x 1440 x 380 um 2003 Oct 14 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 BLOCK DIAGRAM XD TIME OUT amp TEMPERATURE SLOPE PROTECTION STE WAKE UP DRIVER MODE CONTROL WAKE UP RAD FILTER TJA1040 GND MGU16
19. to time and body size of the package there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them the so called popcorn effect For details refer to the Drypack information in the Data Handbook IC26 Integrated Circuit Packages Section Packing Methods These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven The package body peak temperature must be kept as low as possible These packages are not suitable for wave soldering On versions with the heatsink on the bottom side the solder cannot penetrate between the printed circuit board and the heatsink On versions with the heatsink on the top side the solder might be deposited on the heatsink surface If wave soldering is considered then the package must be placed at a 45 angle to the solder wave direction The package footprint must incorporate solder thieves downstream and at the side corners Wave soldering is suitable for LQFP TQFP and QFP packages with a pitch e larger than 0 8 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 65 mm Wave soldering is suitable for SSOP TSSOP VSO and VSSOP packages with a pitch e equal to or larger than 0 65 mm
20. ver TJA1040 TRANSIENT GENERATOR MGW336 The waveforms of the applied transients will be in accordance with ISO 7637 part 1 test pulses 1 2 3a 3b 5 6 and 7 Fig 5 Test circuit for automotive transients MGS378 VRXD HIGH LOW hysteresis 0 5 0 9 Fig 6 Hysteresis of the receiver 2003 Oct 14 9 Philips Semiconductors Product specification High speed CAN transceiver TJA1040 T 100 pF MGW335 Fig 7 Test circuit for timing characteristics oy I III HIGH TXD e ju CANH CANL dominant BUS on 0 9V Vidif bus nar recessive BUS off HIGH RXD 0 3vee NCC LOW ta TXD BUSon gt a gt lt tq TXD BUSoff ta BUSon RXD gt a gt ta BUSoff RXD gt a tPD TXD RXD tPD TXD RXD MGS377 1 Vitaintbus VeanH VCANL Fig 8 Timing diagram 2003 Oct 14 10 Philips Semiconductors High speed CAN transceiver BONDING PAD LOCATIONS COORDINATES SYMBOL 648 5 ee 1214 25 114 5 a e SPLIT 5 1516 5 1275 CANH 7 530 25 1273 75 Note 1 Allx y coordinates represent the position of the centre of each pad in um with respect to the left hand bottom corner of the top aluminium layer see Fig 9 2003 Oct 14 11 Product specification TJA1040 TJA1040U MBL584 The backside of the bare die must be connected to ground Fig 9 Bonding pad locations
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