Philips TJA1020 LIN transceiver handbook
Contents
1. DATA SHEET STATUS Objective data PRODUCT STATUS Development Product specification TJA1020 DEFINITIONS This data sheet contains data from the objective specification for product development Philips Semiconductors reserves the right to change the specification in any manner without notice Preliminary data Qualification This data sheet contains data from the preliminary specification Supplementary data will be published at a later date Philips Semiconductors reserves the right to change the specification without notice in order to improve the design and supply the best possible product Product data Notes Production This data sheet contains data from the product specification Philips Semiconductors reserves the right to make changes at any time in order to improve the design manufacturing and supply Changes will be communicated according to the Customer Product Process Change Notification CPCN procedure SNW SQ 650A 1 Please consult the most recently issued data sheet before initiating or completing a design 2 The product status of the device s described in this data sheet may have changed since this data sheet was published The latest information is available on the Internet at URL http www semiconductors philips com 2002 Jul 17 21 Philips Semiconductors LIN transceiver DEFINITIONS Short form specification The data in a short form specification is extracted2. PARAMETER CONDITIONS Product specification TJA1020 lose Vini short circuit output current receiver threshold voltage Vin VRAT 12 V Vrp 0 Vit lt tdom VUN VRAT 27 V Vixp 0 V t lt tdom VRAT 7 3 to 27 V 0 6VBar Ventr rx Vihr hys receiver centre voltage receiver threshold hysteresis voltage Vear 7 3 to 27 V VRAT 7 3 to 27 V 0 525V pat 0 175V pat Thermal shutdown Tiad shutdown junction temperature AC characteristics Ata TxD BUSon off TXD propagation delay failure normal slope mode C 10 nF R 500 Q see Fig 5 tPropTxDom si tPropTxRec Ata TxD BUSon off TXD propagation delay failure low slope mode C 10 nF R 500 Q see Fig 5 tPropTxDom tPropTxRec Ata BUSon off RXD RXD propagation delay failure normal slope mode and low slope mode C 0 RL voltage on LIN externally forced LIN slope time lt 500 ns Crxp 20 pF Rrxp 2 4 kQ see Fig 5 tPropRxDom ie tPropRxRec ttslope dom fall time LIN 100 to 0 normal slope mode C 10 nF R 500 Q Vegar 12 V transition from recessive to dominant note 4 see Fig 5 tr slope rec Atslope norm 2002 Jul 17 rise time LIN 0 to 100 normal slope symmetry normal slope mode C 10 nF R 500 Q Vegar 12 V transition from dominant to recessive note 5 see Fig 5 nor
3. UNIT A A2 Ag c DO E2 He 0 25 5 0 4 0 6 2 0 19 4 8 3 8 i 5 8 Ep 0 0100 0 20 0 16 mens 0 0075 0 19 0 15 Notes 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included 2 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC EIAJ PROJECTION SOT96 1 076E03 MS 012 E ca ISSUE DATE 2002 Jul 17 18 Philips Semiconductors LIN transceiver SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our Data Handbook IC26 Integrated Circuit Packages document order number 9398 652 90011 There is no soldering method that is ideal for all surface mount IC packages Wave soldering can still be used for certain surface mount ICs but it is not suitable for fine pitch SMDs In these situations reflow soldering is recommended Reflow soldering Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement Several methods exist for reflowing for example convection or convection infrared heating in a conveyor type oven Thr
4. RRXD CRXD gt a YHF4 RL CL MGT992 Fig 8 Test circuit for AC characteristics 2002 Jul 17 15 Philips Semiconductors Product specification TJA1020 LIN transceiver 10 10 kQ All INH BAT J NWAKE RXD TJA1020 TXD 500 Q 2 TRANSIENT 5V NSLP GENERATOR GND MGT993 The waveforms of the applied transients on pin 6 LIN and pin 7 BAT are according to SO7637 part 1 test pulses 1 2 3a 3b 4 5 6 and 7 Fig 9 Test circuit for automotive transients 2002 Jul 17 16 Philips Semiconductors Product specification LIN transceiver TJA1020 BONDING PAD LOCATIONS C 1 8 C 2 O y US L X E e A 5A 5B 5C Bae 0 6 MGW322 Fig 10 Bonding pad locations Table 2 Bonding pad locations dimensions in um All x and y co ordinates are referenced to the bottom left hand corner of the die CO ORDINATES SYMBOL 2002 Jul 17 17 Philips Semiconductors Product specification LIN transceiver TJA1020 PACKAGE OUTLINE SO8 plastic small outline package 8 leads body width 3 9 mm SOT96 1 pin 1 index c detail X 2 5 A pri scale DIMENSIONS inch dimensions are derived from the original mm dimensions
5. 2002 Jul 17 Philips Semiconductors Product specification LIN transceiver TJA1020 BLOCK DIAGRAM BAT NWAKE CONTROL NSLP TXD TJA1020T BUS RXD TIMER FILTER 4 MGU241 Fig 1 Block diagram PINNING SYMBOL DESCRIPTION RXD receive data output open drain active LOW after a wake up event NSLP sleep control input active LOW controls inhibit output resets RXD wake up source flag on TXD and wake up request on RXD INH NSLP BAT local wake up input active LOW NWAKE LIN negative edge triggered TxD transmit data input active LOW output after a local wake up event GND MGU242 ground LIN bus line input output battery supply INH B battery related inhibit output for con trolling an external voltage regulator Fig 2 Pinning diagram active HIGH after a wake up event 2002 Jul 17 3 Philips Semiconductors Product specification LIN transceiver TJA1020 FUNCTIONAL DESCRIPTION The TJA1020 is the interface between the LIN master slave protocol controller and the physical bus in a Local Interconnect Network LIN The LIN transceiver is optimized for the maximum specified LIN transmission speed of 20 Kbaud providing optimum EMC performance due to wave shaping of the LIN output Operating modes The TJA1020 provides two mod
6. from a full data sheet with the same type number and title For detailed information see the relevant data sheet or data handbook Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System IEC 60134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Applications that are described herein for any of these products are for illustrative purposes only Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification DISCLAIMERS Life support applications These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application 2002 Jul 17 22 Product specification TJA1020 Right to make changes Philips Semiconductors reserves the righ
7. output current local wake up request HIGH level input voltage Vixp 0 V standby mode Vnwake 0 V VUN VRAT Vtxp 0 4 V MIN TYP MAX UNIT 5 0 5 uA LOW level input voltage RNSLP NSLP hysteresis voltage NSLP pull down resistor VnsLp 5 V 7 V 0 8 V 0 5 V liL LOW level input current Pin RXD open drain LOW level output current Vns p 0 V normal slope mode VLIN 0V VRxD 0 4 V 125 350 800 kO 5 0 5 uA HIGH level leakage current HIGH level input voltage normal slope mode VUN VRAT Vrxp 5 V LOW level input voltage Pin INH NWAKE pull up current HIGH level leakage current Vnwake 0 V Vnwake 27 V VRAT 27 V Rew INH switch on resistance between pins BAT and INH standby low slope or normal slope mode liun 15 mA Vo reces HIGH level leakage current LIN recessive output voltage sleep mode VINU 27 V VBAT 27V Vrp 5 V Iun 0 mA Vo dom LIN dominant output voltage Vrp 0 V Vegar 8 to 27 V VixD 0 V VBAT 7 3V RSLAVE HIGH level leakage current LIN pull up current slave termination resistance to pin BAT VUN VRAT sleep mode Viin 0 V Vnsrp 0 V standby low slope or normal slope mode VUN 0 V VRAT 12 V 0 6 1 2 V 1 1 uA 20 30 47 kQ 2002 Jul 17 11 Philips Semiconductors LIN transceiver SYMBOL
8. pull down or strong pull down indicates the wake up source weak pull down for a remote wake up request and strong pull down for a local wake up request Philips Semiconductors LIN transceiver Setting pin NSLP HIGH during standby mode results in the following events An immediate reset of the wake up source flag thus releasing the possible strong pull down at pin TXD before the actual mode change after tgotonorm is performed A change into normal slope mode if the HIGH level on pin NSLP has been maintained for a certain time period tgotonorm and pin TXD is HIGH A change into low slope mode if the HIGH level on pin NSLP has been maintained for a certain time period tgotonorm and pin TXD is pulled LOW by the application In the event of a short circuit to ground or an open wire on pin TXD the LIN output remains recessive fail safe A reset of the wake up request signal on pin RXD if the HIGH level on pin NSLP has been maintained for a certain time period tgotonorm Normal slope mode In the normal slope mode the transceiver is able to transmit and receive data via the LIN bus line The receiver detects the data stream at the LIN bus input pin and transfers it via pin RXD to the microcontroller see Fig 1 HIGH at a recessive level and LOW at a dominant level on the bus The receiver has a supply voltage related threshold with hysteresis and an integrated filter to suppress bus line noise The transmit data stream of
9. the protocol controller at the TXD input is converted by the transmitter into a bus signal with controlled slew rate and wave shaping to minimize EME The LIN bus output pin is pulled HIGH via an internal slave termination resistor For a master application an external resistor in series with a diode should be connected between pin INH or BAT on one side and pin LIN on the other side The normal slope mode is entered by a HIGH level on pin TXD and a HIGH level on pin NSLP maintained for a certain time period tgotonorm coming from the sleep or standby mode The TJA1020 switches to sleep mode in case of a LOW level on pin NSLP maintained during a certain time period tgotosleep Low slope mode The only difference between the normal slope mode and the low slope mode is the transmitter behaviour 2002 Jul 17 Product specification TJA1020 In the low slope mode the transmitter output stage drives the LIN bus line with lengthened rise and fall slopes This will further reduce the already outstanding EME in the normal slope mode The low slope mode is perfectly suited for applications where transmission speed is not critical The mode selection is done by the LIN transceiver after a positive edge on pin NSLP maintained for a certain time period tgotonorm If pin TXD is LOW at that time the low slope mode is entered otherwise the normal mode is entered The transition to the low slope mode will be executed during an open pin
10. NSLP Filters at the inputs of the receiver LIN of pin NWAKE and of pin NSLP are preventing unwanted wake up events due to automotive transients or EMI All wake up events have to be maintained for a certain time period tgus tNwWAKE and tgotonorm The sleep mode is initiated by a falling edge on the pin NSLP driven by the microcontroller After a filter time continuously driven sleep command pin NSLP LOW pin INH becomes floating In sleep mode the internal slave termination between pins LIN and BAT is disabled to minimize the power dissipation in case pin LIN is short circuited to ground Only a weak pull up between pins LIN and BAT is present 2002 Jul 17 The sleep mode can be activated independently from the actual level on pin LIN or NWAKE So it is guaranteed that the lowest power consumption is achievable even in case of a continuous dominant level on pin LIN or a continuous LOW on pin NWAKE Standby mode The standby mode is entered automatically whenever a local or remote wake up occurs while the TJA1020 is in its sleep mode These wake up events activate pin INH and enable the slave termination resistor at the pin LIN As a result of the HIGH condition on pin INH the voltage regulator and the microcontroller can be activated The standby mode is signalled by a LOW level on pin RXD which can be used as an interrupt for the microcontroller In the standby mode pin NSLP is still LOW the condition of pin TXD weak
11. O U HA1020T DO INTEGRATED CIRCUITS DATA SHEET TJA1020 LIN transcelver Product specification 2002 Jul 17 Supersedes data of 2001 Dec 17 Philips PHILIPS Semiconductors PH l LI L Philips Semiconductors Product specification LIN transceiver TJA1020 FEATURES General e Baud rate up to 20 Kbaud e Very low ElectroMagnetic Emission EME High ElectroMagnetic Immunity EMI Low slope mode for an even further reduction of EME Passive behaviour in unpowered state Input levels compatible with 3 3 and 5 V devices Integrated termination resistor for Local Interconnect Network LIN slave applications Wake up source recognition local or remote Low power management e Very low current consumption in sleep mode with local and remote wake up Protections e Transmit data TXD dominant time out function e Bus terminal and battery pin protected against transients in the automotive environment ISO7637 e Bus terminal short circuit proof to battery and ground e Thermally protected QUICK REFERENCE DATA GENERAL DESCRIPTION The TJA1020 is the interface between the LIN master slave protocol controller and the physical bus in a Local Interconnect Network LIN It is primarily intended for in vehicle sub networks using baud rates from 2 4 up to 20 Kbaud The transmit data stream of the protocol controller at the TXD input is converted by the LIN transceiver into a bus signal with controlled slew ra
12. Philips Semiconductors Product specification LIN transceiver TJA1020 CHARACTERISTICS Vegart 5 to 27 V Ty 40 to 150 C RuLIN BAT 500 Q all voltages are defined with respect to ground positive currents flow into the IC typical values are given at Vgar 12 V unless otherwise specified notes 1 and 2 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT supply current on sleep mode pin BAT Vin Vear Vnwake VRAT Vp 0 V Vystp 0 V standby mode bus recessive VINU VRAT VUN VRAT Vnwake VRAT Vp 0 V Vystp 0 V standby mode bus dominant Vgar 12 V VinH 12 V Vun 0 V Vnwake 12 V Vixp 0 V Vns p 0 V note 3 low slope mode bus recessive VINU VBAT VUN VRAT Vnwake VRAT Vixp 5 V Vyer 5 V normal slope mode bus recessive VINU VRAT VUN VRAT Vnwake VRAT Vixp 5 V Vyer 5 V low slope mode bus dominant VRAT 12 V VH 12 V Vnwake 12 V Vixp 0 V Vns p 5 V note 3 normal slope mode bus dominant Vgar 12 V VinH 12 V Vnwake 12 V Vixp 0 V Vys 5 V note 3 Pin TXD HIGH level input voltage ai A LOW level input voltage ini 8 Vhys TXD hysteresis voltage t Rtxp TXD pull down resistor Vixp B V 125 800 kQ 2002 Jul 17 10 Philips Semiconductors LIN transceiver SYMBOL PARAMETER CONDITIONS Product specification TJA1020 Ii Pin NSLP LOW level input current LOW level
13. TXD fail safe a short circuit from pin TXD to ground fail safe or an intended LOW level of pin TXD programmed by the microcontroller The transmitter is enabled after a LOW to HIGH transition on pin TXD In the event of a short circuit to ground on pin TXD the transmitter will be disabled Wake up There are three ways to wake up a TJA1020 which is in sleep mode 1 Remote wake up via a dominant bus state 2 Local wake up via a negative edge at pin NWAKE 3 Mode change pin NSLP is HIGH from sleep mode to normal slope low slope mode Remote and local wake up A falling edge at pin NWAKE followed by a LOW level maintained for a certain time period tywake results in a local wake up The pin NWAKE provides an internal pull up towards pin BAT If during power up pin NWAKE is LOW for a certain period of time tnwake this will also result in a local wake up A falling edge at pin LIN followed by a LOW level maintained for a certain time period tgus and a rising edge at pin LIN respectively see Fig 4 results in a remote wake up After a local or remote wake up pin INH is activated it goes HIGH and the internal slave termination resistor is switched on The wake up request is indicated by a LOW active wake up request signal on pin RXD to interrupt the microcontroller Philips Semiconductors LIN transceiver Wake up via mode transition It is also possible to set pin INH HIGH with a mode transition towards norma
14. act information For additional information please visit http www semiconductors philips com Fax 31 40 27 24825 For sales offices addresses send e mail to sales addresses www semiconductors philips com Koninklijke Philips Electronics N V 2002 SCA74 All rights are reserved Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner The information presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Printed in The Netherlands 04 pp24 Date of release 2002 Jul 17 Document order number 9397 750 10028 Lett make things better i eee Z PHILIPS
15. ation TJA1020 Fail safe features Pin TXD provides a pull down to GND in order to force a predefined level on input pin TXD in case the pin TXD is unsupplied Pin NSLP provides a pull down to GND in order to force the transceiver into sleep mode in case the pin NSLP is unsupplied Pin RXD is set floating in case of lost power supply on pin BAT The current of the transmitter output stage is limited in order to protect the transmitter against short circuit to pins BAT or GND A loss of power pins BAT and GND has no impact to the bus line and the microcontroller There are no reverse currents from the bus The LIN transceiver can be disconnected from the power supply without influencing the LIN bus The output driver at pin LIN is protected against overtemperature conditions If the junction temperature exceeds the shutdown junction temperature Tjsq the thermal protection circuit disables the output driver The driver is enabled again if the junction temperature has been decreased below Tjgq and a recessive level is present at pin TXD Philips Semiconductors Product specification LIN transceiver TJA1020 LIN recessive VBAT 0 6VBAT VLIN 0 4VBAT LIN dominant ground sleep mode standby mode 4 MBL371 Fig 4 Wake up behaviour 2002 Jul 17 8 Philips Semiconductors LIN transceiver LIMITING VALUES Product specification TJA1020 In accordance with the Absolute Maxim
16. er a copy from your Philips Semiconductors sales office 2 All surface mount SMD packages are moisture sensitive Depending upon the moisture content the maximum temperature with respect to time and body size of the package there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them the so called popcorn effect For details refer to the Drypack information in the Data Handbook IC26 Integrated Circuit Packages Section Packing Methods 3 These packages are not suitable for wave soldering On versions with the heatsink on the bottom side the solder cannot penetrate between the printed circuit board and the heatsink On versions with the heatsink on the top side the solder might be deposited on the heatsink surface 4 If wave soldering is considered then the package must be placed at a 45 angle to the solder wave direction The package footprint must incorporate solder thieves downstream and at the side corners 5 Wave soldering is suitable for LQFP TQFP and QFP packages with a pitch e larger than 0 8 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 65 mm 6 Wave soldering is suitable for SSOP and TSSOP packages with a pitch e equal to or larger than 0 65 mm it is definitely not suitable for packages with a pitch e equal to or smaller than 0 5 mm 2002 Jul 17 20 Philips Semiconductors LIN transceiver DATA SHEET STATUS
17. es of normal operation one intermediate mode and one very low power mode Figure 3 shows the state diagram t gt t NORMAL STANDBY NSLP 1 after 0 gt 1 gotonorm VASTI nest and TXD 1 SLOPE MODE INH HIGH gt INH HIGH TERM 30 ko TERM 30 kQ RXD LOW RXD LINDATA Nae OFF Nixon NWAKE 0 after 1 gt 0 gt NWAKE or LIN 0 after 1 gt 0 gt tpus and NSLP 0 NSLP 0 after 1 gt 0 gt lgotosleep NSLP 1 after 0 gt 1 gt tgotonorm and no y and TXD 1 wake up event UNSLP 1 after 0 gt 1 gt tgotonorm and TXD 0 T LOW t NSLP 0 after 1 gt 0 gt 0 gotosleep SLOPE MODE and no wake up event INH HIGH gt TERM 30 kQ RXD LINDATA INH FLOATING TERM HIGH OHMIC RXD FLOATING tNSLP 1 after 0 gt 1 gt tgotonorm and TXD 0 switching on BAT MGU243 trx transmitter TERM slave termination resistor connected between pins LIN and BAT Fig 3 State diagram 2002 Jul 17 4 Philips Semiconductors LIN transceiver Table 1 Operating modes TXD OUTPUT RXD Product specification TJA1020 weak pull down floating LOW note 3 Standby weak pull down if remote wake up strong pull down if local wake up note 2 INH TRANSMITTER REMARKS floating off no wake up request detected wake up request detected in this mode the microcontroller ca
18. is for cased products 100 tested at 25 C ambient temperature unless otherwise specified 2 For bare die all parameters are only guaranteed if the backside of the bare die is connected to ground 3 If Veat is higher than 12 V the battery current increases due to the internal LIN termination resistor The minimum value of this resistor is 20 kQ The maximum current increase is therefore Ipatiincrease 20 KO RI ein T tr slope dom O55 see Fig 6 Cyrin 60 tvLin 9 1 5 tr slope rec T cT o see Fig 6 2002 Jul 17 13 Philips Semiconductors Product specification LIN transceiver TJA1020 TIMING DIAGRAMS TXD tPropTxDom a gt tpropTxRec a VLIN gt tPropRxDom a tPropRxRec RXD MGW323 Fig 5 Timing diagram for AC characteristics bus loaded VLIN 0 ts Ad gt tslope Dom ae tslope Rec MGU433 Fig 6 Definition of slope timing 2002 Jul 17 14 Philips Semiconductors LIN transceiver APPLICATION INFORMATION ECU Product specification TJA1020 LIN BUS LINE only for master node VDD RX0 MICROCONTROLLER TXO Px x More information is available in a separate application note 1 Cmaster 1 NF Csiave 220 pF Fig 7 Typical application of the TJA1020 MGU244 BAT NWAKE NSLP TJA1020 TXD RXD
19. l slope low slope mode via pin NSLP This is useful for applications with a continuously powered microcontroller Wake up source recognition The TJA1020 can distinguish between a local wake up request on pin NWAKE and a remote wake up request via a dominant bus state The wake up source flag is set in case the wake up request was a local one The wake up source can be read on pin TXD in the standby mode If an external pull up resistor on pin TXD to the power supply voltage of the microcontroller has been added a HIGH level indicates a remote wake up request weak pull down at pin TXD and a LOW level indicates a local wake up request strong pull down at pin TXD much stronger than the external pull up resistor The wake up request flag signalled on pin RXD as well as the wake up source flag signalled on pin TXD are reset immediately if the microcontroller sets pin NSLP HIGH TXD dominant time out function A TXD Dominant Time out timer circuit prevents the bus line from being driven to a permanent dominant state blocking all network communication if pin TXD is forced permanently LOW by a hardware and or software application failure The timer is triggered by a negative edge on pin TXD If the duration of the LOW level on pin TXD exceeds the internal timer value tym the transmitter is disabled driving the bus line into a recessive state The timer is reset by a positive edge on pin TXD 2002 Jul 17 Product specific
20. mal slope mode C 10 nF R 500 Q VBAT 12 V tf slope dom i tr slope rec 12 Philips Semiconductors Product specification LIN transceiver TJA1020 SYMBOL PARAMETER CONDITIONS ti slope norm dom Normal slope fall time LIN normal slope mode 100 to 0 CL 6 8 nF HL 660 Q Vegar 12 V transition from recessive to dominant note 4 tr slope norm rec normal slope rise time normal slope mode LIN 0 to 100 CL 6 8 nF R 660 Q Vegar 12 V transition from dominant to recessive note 5 Atslope norm normal slope symmetry normal slope mode CL 6 8 nF RL 660 Q VBAT 12V ti slope dom tr slope rec ti slope low dom low slope fall time LIN low slope mode 100 to 0 C 10 nF Ry 500 Q Vear 12 V note 4 tr slope low rec low slope rise time LIN low slope mode 0 to 100 C 10 nF RL 500 Q Vegart 12 V note 5 teus dominant time for sleep mode wake up via bus tNWAKE dominant time for sleep mode wake up via pin NWAKE tgotonorm time period for mode change from sleep or standby mode into normal low slope mode tgotosleep time period for mode change from normal low slope mode into sleep mode TXD dominant time out Vtxp 0V Notes 1 All parameters are guaranteed over the virtual junction temperature by design but only 100 tested at 125 C ambient temperature for dies on wafer level and above th
21. n read the wake up source remote or local wake up HIGH recessive state LOW dominant state Normal slope mode weak pull down normal slope notes 2 3 and 4 mode HIGH recessive state LOW dominant state Low slope mode weak pull down Notes low slope mode notes 2 3 and 5 1 The standby mode is entered automatically upon any local or remote wake up event during sleep mode Pin INH and the 30 kQ termination resistor at pin LIN are switched on 2 The internal wake up source flag set if a local wake up did occur and fed to pin TXD will be reset when entering normal slope or low slope mode NSLP goes HIGH 3 The wake up interrupt on pin RXD is released when entering normal slope or low slope mode NSLP goes HIGH 4 The normal slope mode is entered if TXD is set HIGH set by the microcontroller to recessive during a positive edge on NSLP In the event of a short circuit to ground on pin TXD the transmitter will be disabled 5 The low slope mode is entered if pin TXD is pulled LOW actively set dominant by the microcontroller or due to a failure on TXD during the positive edge on NSLP Sleep mode This mode is the most power saving mode of the TJA1020 and the default state after power up first battery supply Despite its extreme low current consumption the TJA1020 can still be waken up remotely via pin LIN or waken up locally via pin NWAKE or activated directly via pin
22. oughput times preheating soldering and cooling vary between 100 and 200 seconds depending on heating method Typical reflow peak temperatures range from 215 to 250 C The top surface temperature of the packages should preferable be kept below 220 C for thick large packages and below 235 C for small thin packages Wave soldering Conventional single wave soldering is not recommended for surface mount devices SMDs or printed circuit boards with a high component density as solder bridging and non wetting can present major problems To overcome these problems the double wave soldering method was specifically developed 2002 Jul 17 19 Product specification TJA1020 If wave soldering is used the following conditions must be observed for optimal results e Use a double wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave For packages with leads on two sides and a pitch e larger than or equal to 1 27 mm the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit board smaller than 1 27 mm the footprint longitudinal axis must be parallel to the transport direction of the printed circuit board The footprint must incorporate solder thieves at the downstream end For packages with leads on four sides the footprint must be placed at a 45 angle to the transport direction of the printed circ
23. t to make changes without notice in the products including circuits standard cells and or software described or contained herein in order to improve design and or performance Philips Semiconductors assumes no responsibility or liability for the use of any of these products conveys no licence or title under any patent copyright or mask work right to these products and makes no representations or warranties that these products are free from patent copyright or mask work right infringement unless otherwise specified BARE DIE DISCLAIMER All die are tested and are guaranteed to comply with all data sheet limits up to the point of wafer sawing for a period of ninety 90 days from the date of Philips delivery If there are data sheet limits not guaranteed these will be separately indicated in the data sheet There are no post packing tests performed on individual die or wafer Philips Semiconductors has no control of third party procedures in the sawing handling packing or assembly of the die Accordingly Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after third party sawing handling packing or assembly of the die It is the responsibility of the customer to test and qualify their application in which the die is used Philips Semiconductors Product specification LIN transceiver TJA1020 NOTES 2002 Jul 17 23 Philips Semiconductors a worldwide company Cont
24. te and wave shaping to minimize EME The LIN bus output pin is pulled HIGH via an internal termination resistor For a master application an external resistor in series with a diode should be connected between pin INH or pin BAT and pin LIN The receiver detects the data stream at the LIN bus input pin and transfers it via pin RXD to the microcontroller In normal transceiver operation the TJA1020 can be switched in the normal slope mode or the low slope mode In the low slope mode the TJA1020 lengthens the rise and fall slopes of the LIN bus signal thus further reducing the already very low emission in normal slope mode In sleep mode the power consumption of the TJA1020 is very low whereas in failure modes the power consumption is reduced to a minimum SYMBOL PARAMETER supply voltage on pin BAT supply current on pin BAT in sleep mode 1 supply current on pin BAT in standby mode bus recessive 100 400 supply current on pin BAT in normal slope mode bus recessive 100 400 supply current on pin BAT in normal slope mode bus dominant 1 VLIN DC voltage on pin LIN Tyj virtual junction temperature Vesd HBM pins NWAKE LIN and BAT ORDERING INFORMATION electrostatic discharge voltage human body model TYPE PACKAGES NUMBER NAME DESCRIPTION plastic small outline package 8 leads body width 3 9 mm VERSION bare die die dimensions 1480 x 1760 x 375 um TJA1020T SO8 TJA1020U
25. uit board The footprint must incorporate solder thieves downstream and at the side corners During placement and before soldering the package must be fixed with a droplet of adhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured Typical dwell time is 4 seconds at 250 C A mildly activated flux will eliminate the need for removal of corrosive residues in most applications Manual soldering Fix the component by first soldering two diagonally opposite end leads Use a low voltage 24 V or less soldering iron applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 C When using a dedicated tool all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Philips Semiconductors Product specification LIN transceiver TJA1020 Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD WAVE REFLOW BGA LBGA LFBGA SQFP TFBGA VFBGA not suitable suitable HBCC HBGA HLQFP HSQFP HSOP HTQFP HTSSOP HVQFN not suitable 3 suitable PACKAGE HVSON SMS PLCC 4 SO SOJ suitable suitable LQFP QFP TQFP not recommended 4 5 suitable SSOP TSSOP VSO not recommended suitable Notes 1 For more detailed information on the BGA packages refer to the LF BGA Application Note AN01026 ord
26. um Rating System IEC 60134 all voltages are referenced to pin GND SYMBOL PARAMETER CONDITIONS VBAT supply voltage on pin BAT Vixb Vaxp Vinscp DC voltage on pins TXD RXD and NSLP DC voltage on pin LIN DC voltage on pin NWAKE 1 INWAKE current on pin NWAKE only relevant if 15 Vnwake lt Venp 0 3 V current will flow into pin GND VINH DC voltage on pin INH 0 3 Vegart 0 3 linH output current at pin INH 50 15 Virt LIN transient voltage on pin LIN ISO7637 150 100 j virtual junction temperature 40 150 storage temperature 55 Vesd HBM electrostatic discharge voltage human body note 1 model on pins NWAKE LIN and BAT 4 on pins RXD NSLP TXD and INH 2 Vesd MM electrostatic discharge voltage machine note 2 model all pins 200 200 Notes 1 Equivalent to discharging a 100 pF capacitor through a 1 5 KQ resistor 2 Equivalent to discharging a 200 pF capacitor through a 10 Q resistor and a 0 75 uH coil In the event of a discharge from pin INH to pin BAT 150 V lt Vega lt 150 V THERMAL CHARACTERISTICS According to IEC747 1 SYMBOL PARAMETER CONDITION VALUE UNIT Rih a thermal resistance from junction to ambient in in free air SO8 package Rih s base thermal resistance from junction to substrate in free air tbf K W bare die QUALITY SPECIFICATION Quality specification in accordance with AEC Q100 2002 Jul 17 9
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