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PHILIPS PCF21xxC family LCD drivers handbook(1)

1. SYMBOL PARAMETER CONDITIONS MIN MAX UNIT Vpp supplv voltage 0 5 8 0 V VI input voltage DLEN CLB DATA and OSC Vss 0 5 Vpp 0 5 V Vo output voltage BP1 BP2 and S1 to S32 Vss 0 5 Vpp 0 5 V bp Iss 1 supply current 50 50 mA l DC input current 20 20 mA lo DC output current 25 25 mA Prot total power dissipation per package note 1 500 mW Po power dissipation per output 100 mW Tstg storage temperature 65 150 C Note 1 Derate by 7 7 mW K when Tamp gt 60 C 9 HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling However to be totally safe it is desirable to take normal precautions appropriate to handling MOS devices See Handling MOS devices ESD in accordance with MIL STD 883C Method 3015 1997 Mar 28 12 Philips Semiconductors LCD drivers 10 DC CHARACTERISTICS Product specification PCF21xxC family Vpp 2 25 to 6 0 V Vss 0 V Tamb 40 to 80 C Ro 1 MQ Co 680 pF unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Supply Vpp supplv voltage 2 25 6 0 V DD supply current note 1 see Fig 13 20 50 HA note 1 Tamb 25 C 20 30 HA see Fig 13 Vpor power on reset voltage level note 2 1 0 1 6 V nputs CLB DATA and DLEN ViL LOVV level input voltage 0 8 V Vin HIGH lev
2. 33 1 Tamb 40 C 2 Tamb 25 C 3 Tamb 85 C Fig 15 Display frequency as a function of supply voltage Co 1 5 nF only PCF2112C MLD281 103 x N N N f IN LCD T Hz x N 102 x 1 ye TN N 10 x N N N AN 10 1071 1 Co nF 10 1 Ro 1 MO 2 Ro 100 ka Fig 16 Display frequency as a function of Ro and Co Tamb 25 C Vpp 5 V 1997 Mar 28 Philips Semiconductors Product specification LCD drivers PCF21xxC family MLD288 2 Ro kQ BP PCF2112C BP1 BP2 15 IL 25 uA S1 to 32 P 1 L 15 pA 0 5 MLD298 0 0 2 4 6 Voo 1 Tamp 85 C 2 Tamb 25 C 3 Tamb 40 C Fig 18 Output resistance of backplane and Fig 17 Test loads segments MLD290 Vpp V 1 Tamb 40 C 2 Tamb 25 C 3 Tamb 85 C Fig 19 LOW level output current as a function of supply voltage only PCF2112C 1997 Mar 28 17 Philips Semiconductors Product specification LCD drivers PCF21xxC family 12 PACKAGE OUTLINES DIP 28 plastic dual in line package 28 leads 600 mil SOT117 1 g plane l4 seatin
3. 22 15 LCD driver output 22 21 16 1 LCD driver output 21 20 17 LCD driver output 20 19 18 LCD driver output 19 18 19 LCD driver output 18 S17 20 LCD driver output 17 S16 21 LCD driver output 16 S15 22 LCD driver output 15 S14 23 1 LCD driver output 14 S13 24 LCD driver output 13 12 25 LCD driver output 12 11 26 1 LCD driver output 11 10 27 LCD driver output 10 S9 28 LCD driver output 9 8 29 LCD driver output 8 S7 30 LCD driver output 7 S6 31 LCD driver output 6 5 32 LCD driver output 5 S4 33 LCD driver output 4 S3 34 LCD driver output 3 S2 35 LCD driver output 2 S1 36 LCD driver output 1 BP2 37 1 backplane driver output 2 BP1 38 backplane driver output 1 DATA 39 data input line CBUS DLEN 40 data input line enable CBUS PCF2111C MLD291 Fig 5 Pin configuration SOT129 1 and SOT158 1 1997 Mar 28 Philips Semiconductors Product specification LCD drivers PCF21xxC family 6 3 PCF2112C SYMBOL PIN DESCRIPTION CLB 1 clock burst input CBUS Vpp 2 supply voltage OSC 3 oscillator input Vss 4 supply voltage ground 32 5 CD driver output 32 31 6 LCD driver output 31 30 7 LCD driver output 30 29 8 LCD driver output 29 S28 9 LCD driver output 28 DATA S27 10 LCD driver output 27 BP S26 11 LCD driver output 26 Hie S25 12 LCD driver out
4. S17 8 LCD driver output 17 S16 9 LCD driver output 16 15 10 LCD driver output 15 14 11 LCD driver output 14 13 12 LCD driver output 13 12 13 LCD driver output 12 11 14 LCD driver output 11 10 15 LCD driver output 10 S9 16 LCD driver output 9 S8 17 LCD driver output 8 S7 18 1 LCD driver output 7 S6 19 LCD driver output 6 S5 20 LCD driver output 5 S4 21 LCD driver output 4 3 22 LCD driver output 3 S2 23 LCD driver output 2 S1 24 LCD driver output 1 BP2 25 1 backplane driver output 2 BP1 26 backplane driver output 1 DATA 27 data input line CBUS DLEN 28 data input line enable CBUS PCF2100C MLD295 DLEN DATA BP1 BP2 S1 2 S3 S4 S5 S6 S7 s8 s9 S10 Fig 4 Pin configuration SOT117 1 and SOT136 1 1997 Mar 28 Philips Semiconductors LCD drivers 6 2 PCF2111C Product specification PCF21xxC family SYMBOL PIN DESCRIPTION CLB 1 clock burst input CBUS Vpp 2 supply voltage OSC 3 oscillator input Vss 4 supply voltage ground 32 5 CD driver output 32 31 6 LCD driver output 31 30 7 LCD driver output 30 29 8 LCD driver output 29 28 9 LCD driver output 28 S27 10 LCD driver output 27 S26 11 LCD driver output 26 S25 12 LCD driver output 25 S24 13 LCD driver output 24 S23 14 LCD driver output 23
5. body width 7 5 mm SOT136 1 pin 1 index detail X 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions UNIT COM A2 A3 D EM He 18 1 7 6 17 7 1 7 4 inches ae 7 Note 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC EIAJ PROJECTION SOT136 1 075E06 MS 013AE E3 5 2 SSUE DATE 1997 Mar 28 20 Philips Semiconductors Product specification LCD drivers PCF21xxC family VSO40 plastic very small outline package 40 leads SOT158 1 21 pin 1 index detail X Aa bp 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions UNIT Ay A2 A3 c D EO He 0 3 0 22 15 6 7 6 0 1 0 14 15 2 7 5 inches 0 0087 0 61 0 30 k 0 0055 0 60 0 29 Notes 1 Plastic or metal protrusions of 0 4 mm maximum per side are not included 2 Plastic interlead protrusions of 0 25 mm maximum per s
6. http www semiconductors philips com Building BE p P O Box 218 5600 MD EINDHOVEN The Netherlands Fax 31 40 27 24825 Philips Electronics N V 1997 SCA53 All rights are reserved Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner The information presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Printed in The Netherlands 417067 1200 02 pp24 Philips Semiconductors Date of release 1997 Mar 28 Document order number 9397 750 01649 Lett make things better S PHILIPS
7. Apply a low voltage soldering iron less than 24 V to the lead s of the package below the seating plane or not more than 2 mm above it If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds If the bit temperature is between 300 and 400 C contact may be up to 5 seconds 13 3 SO and VSO 13 3 1 REFLOW SOLDERING Reflow soldering techniques are suitable for all SO and VSO packages Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement 1997 Mar 28 Product specification PCF21xxC family Several techniques exist for reflowing for example thermal conduction by heated belt Dwell times vary between 50 and 300 seconds depending on heating method Typical reflow temperatures range from 215 to 250 C Preheating is necessary to dry the paste and evaporate the binding agent Preheating duration 45 minutes at 45 C 13 3 2 WAVE SOLDERING Wave soldering techniques can be used for all SO and VSO packages if the following conditions are observed e A double wave a turbulent wave with high upward pressure followed by a smooth laminar wave soldering technique should be used e The longitudinal axis of the package footprint must be parallel to the solder flow e The package footprint mu
8. PCF2100C PCF2111C 60 75 100 Hz PCF2112C Co 1 5 nF 30 35 50 Hz tas transfer time with test loads Vpp 5 V 20 100 us PLCD driver delay time vvith test loads Vpp 5V 20 100 us 1997 Mar 28 14 Product specification Philips Semiconductors PCF21xxC family LCD drivers asind peo Dulu Sng2 Z 9211240d da OZLLZ 40d 1d89xa dd tdg ug peol EF GINS j INS ajqesip 2614 s Ozl LZ4Od PUL DIL LZ40d 40 Ge sind peo7 Z 2 6I4 s 00012 42d 40 ez asind peo7 1 IS gep ol z ulpe l x M HM M vadh He Vans vans Nans lqeu 15 1997 Mar 28 Philips Semiconductors Product specification LCD drivers PCF21xxC family MLD283 MLD282 20 80 1 tee UA e 1 16 typ Ay 3 2 P 27 24 12 ra A 7 72 l ZY ZE 8 70 0 2 4 6 vm 8 0 es 1 Tamb 40 C 2 Tamb 85 C 3 Tamo 25 C Fig 13 Supply current as a function of supply voltage 1 Tamb 40 C 2 Tamb 25 C 3 Tamb 85 C Fig 14 Display frequency as a function of supply voltage Co 680 pF except PCF2112C MLD289 37 flop Hz 36 35 34
9. outline package 40 leads SOT158 1 1997 Mar 28 Philips Semiconductors LCD drivers Product specification PCF21xxC family 5 BLOCK DIAGRAMS DLEN CLB DATA 40 SEGMENT LCD 680 LATCHES OSCILLATOR F pF AND AND DRIVER CONTROL DIVIDER ol MQ Vss MLD286 Fig 1 Block diagram PCF2100C DLEN CLB DATA 64 SEGMENT LCD ANALOG VOLTAGE O 1 BUS LATCHES OSCILLATOR pF AND AND NTROL 9 DRIVER CONTROL DIVIDER SHIFT REGISTER o 1 MQ MLD285 Fig 2 Block diagram PCF2111C 1997 Mar 28 Philips Semiconductors Product specification LCD drivers PCF21xxC family 32 seseawenr ic LCD S1 to 32 36 to 5 ANALOG BACKPLANE AND SEGMENT DRIVERS VOLTAGE 1 5 LATCHES OSCILLATOR OF nF BUS AND AND Esl DRIVER CONTROL DIVIDER Sue aq aq DLEN CLB DATA MLD287 Fig 3 Block diagram PCF2112C 1997 Mar 28 5 Philips Semiconductors LCD drivers 6 PINNING 6 1 PCF2100C Product specification PCF21xxC family SYMBOL PIN DESCRIPTION CLB 1 clock burst input CBUS Vpp 2 supplv voltage OSC 3 oscillator input Vss 4 supply voltage ground 20 5 CD driver output 20 19 6 LCD driver output 19 18 7 LCD driver output 18
10. pulse 35 transfers data from the shift register to the selected latches Product specification PCF21xxC family 7 3 PCF2112C When DATA bit 33 is HIGH the latches are loaded CLB pulse 35 transfers data from the shift register to the selected latches 7 4 Bus control logic The follovving tests are carried out by the bus control logic 1 Test on leading zero 2 Test on number of DATA bits 3 Test of disturbed DLEN and DATA signals during transmission If one of the test conditions is not fulfilled no action follows the load condition load pulse with DLEN LOW and the driver is ready to receive new data xa a test leading zero bit number 0 1 1 2 3 leading zero output S1 2 Fe s4 5 Ee E 4 S1 S2 S3 S4 S5 S6 S7 32 33 34 35 PCF2111C and PCF2112C 20 21 22 23 PCF2100C load pulse BE hes 20 4 PCF2111C and PCF2112C 5 a lt PCF2100C load bit MLD296 Fig 7 CBUS data format 1997 Mar 28 Philips Semiconductors Product specification LCD drivers PCF21xxC family 7 5 Timing OFF OFF ON OFF OFF ON ON ON VDD 0 5 Vpp Ysg Vss VDD 0 5 Vpp Vss rl BP1 BP2 sx FR m pa ul J Vss VoD Vss 0 5 Vbp Vss 0 Se 0 5 Vpp Vss Vpop Vss Vpp Vss 0 5 Vpop Vss Pitre 0 5 Vpp Vss Vpp Vss BP2 SX Tab Alsi f LCD MLD294 Fig 8 Ti
11. scale DIMENSIONS inch dimensions are derived from the original mm dimensions A Az 1 1 UNIT max in max ba D E 36 0 14 1 5 1 4 0 35 0 13 7 l 1 41 0 56 inches 0 20 0 16 1 34 0 54 Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOT117 1 051605 MO 015AH al 92 44 47 95 01 14 1997 Mar 28 18 Philips Semiconductors Product specification LCD drivers PCF21xxC family DIP40 plastic dual in line package 40 leads 600 mil SOT129 1 i seating plane pin 1 index we scale DIMENSIONS inch dimensions are derived from the original mm dimensions A A Az 1 1 UNIT max min max bi D E 52 50 14 1 51 50 13 7 2 067 0 56 2 028 0 54 4 7 0 51 4 0 inches 0 19 0 020 0 16 Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN ISSUE DATE VERSION IEC JEDEC EIAJ PROJECTION SOT129 1 051G08 MO 015AJ E3 20 ji 1997 Mar 28 19 Philips Semiconductors Product specification LCD drivers PCF21xxC family 028 plastic small outline package 28 leads
12. Center Bld 3 r 1211 Volodarski Str 6 220050 MINSK Tel 375 172 200 733 Fax 375 172 200 773 Belgium see The Netherlands Brazil see South America Bulgaria Philips Bulgaria Ltd Energoproject 15th floor 51 James Bourchier Blvd 1407 SOFIA Tel 359 2 689 211 Fax 359 2 689 102 Canada PHILIPS SEMICONDUCTORS COMPONENTS Tel 1 800 234 7381 China Hong Kong 501 Hong Kong Industrial Technology Centre 72 Tat Chee Avenue Kowloon Tong HONG KONG Tel 852 2319 7888 Fax 852 2319 7700 Colombia see South America Czech Republic see Austria Denmark Prags Boulevard 80 PB 1919 DK 2300 COPENHAGEN S Tel 45 32 88 2636 Fax 45 31 57 1949 Finland Sinikalliontie 3 FIN 02630 ESPOO Tel 358 9 615800 Fax 358 9 61580 xxx France 4 Rue du Port aux Vins BP317 92156 SURESNES Cedex Tel 33 1 40 99 6161 Fax 33 1 40 99 6427 Germany HammerbrookstraBe 69 D 20097 HAMBURG Tel 49 40 23 53 60 Fax 49 40 23 536 300 Greece No 15 25th March Street GR 17778 TAVROS ATHENS Tel 30 1 4894 339 239 Fax 30 1 4814 240 Hungary see Austria India Philips INDIA Ltd Shivsagar Estate A Block Dr Annie Besant Rd Worli MUMBAI 400 018 Tel 91 22 4938 541 Fax 91 22 4938 722 Indonesia see Singapore Ireland Newstead Clonskeagh DUBLIN 14 Tel 4353 1 7640 000 Fax 4353 1 7640 200 Israel RAPAC Electronics 7 Kehilat Saloniki St TEL AVIV 61180 Tel 972 3 645 0444 Fax 972 3 649 1007 It
13. H O PCFZ2Doc fam O O INTEGRATED CIRCUITS DATA SHEET PCF21xxC family LCD drivers Product specification 1997 Mar 28 Supersedes data of 1995 May 03 File under Integrated Circuits IC12 Philips PHILIP s Semiconductors DH l LI p Philips Semiconductors Product specification HZ a ia ia kd ran LCD drivers PCF21xxC family CONTENTS 1 FEATURES 2 GENERAL DESCRIPTION 3 QUICK REFERENCE DATA 4 ORDERING INFORMATION 5 BLOCK DIAGRAMS 6 PINNING 6 1 PCF2100C 6 2 PCF2111C 6 3 PCF2112C 7 FUNCTIONAL DESCRIPTION 7 1 PCF2100C 7 2 PCF2111C 7 3 PCF2112C 7 4 Bus control logic 7 5 Timing 7 6 Input circuitry 7 7 Expansion 8 LIMITING VALUES 9 HANDLING 10 DC CHARACTERISTICS 11 AC CHARACTERISTICS 12 PACKAGE OUTLINES 13 SOLDERING 13 1 Plastic dual in line packages 13 1 1 By dip or wave 13 1 2 Repairing soldered joints 13 2 Plastic small outline packages 13 2 1 By wave 13 2 2 By solder paste reflow 13 2 3 Repairing soldered joints by hand held soldering iron or pulse heated solder tool 14 DEFINITIONS 15 LIFE SUPPORT APPLICATIONS 1997 Mar 28 2 Philips Semiconductors LCD drivers 1 FEATURES Supplv voltage 2 25 to 6 0 V e Low current consumption Serial data input e CBUS control One point built in oscillator e Stand alone or expanded svstem Product specification PCF21xxC family 2 GENERAL DESCRIPTION The PCF21xxC family are single chip silicon gate CMOS LCD driver circuits A 3
14. aly PHILIPS SEMICONDUCTORS Piazza IV Novembre 3 20124 MILANO Tel 39 2 6752 2531 Fax 39 2 6752 2557 Japan Philips Bldg 13 37 Kohnan 2 chome Minato ku TOKYO 108 Tel 81 3 3740 5130 Fax 81 3 3740 5077 Korea Philips House 260 199 ltaevvon dong Yongsan ku SEOUL Tel 82 2 709 1412 Fax 82 2 709 1415 Malaysia No 76 Jalan Universiti 46200 PETALING JAYA SELANGOR Tel 60 3 750 5214 Fax 60 3 757 4880 Mexico 5900 Gatevvay East Suite 200 EL PASO TEXAS 79905 Tel 9 5 800 234 7381 Middle East see Italy For all other countries apply to Philips Semiconductors Marketing amp Sales Communications a worldwide company Netherlands Postbus 90050 5600 PB EINDHOVEN Bldg VB Tel 31 40 27 82785 Fax 31 40 27 88399 New Zealand 2 Wagener Place C P O Box 1041 AUCKLAND Tel 64 9 849 4160 Fax 64 9 849 7811 Norway Box 1 Manglerud 0612 OSLO Tel 47 22 74 8000 Fax 47 22 74 8341 Philippines Philips Semiconductors Philippines Inc 106 Valero St Salcedo Village P O Box 2108 MCC MAKATI Metro MANILA Tel 63 2 816 6380 Fax 63 2 817 3474 Poland UI Lukiska 10 PL 04 123 WARSZAWA Tel 48 22 612 2831 Fax 48 22 612 2327 Portugal see Spain Romania see Italy Russia Philips Russia UI Usatcheva 35A 119048 MOSCOW Tel 7 095 755 6918 Fax 7 095 755 6919 Singapore Lorong 1 Toa Payoh SINGAPORE 1231 Tel 65 350 2538 Fax 65 251 6500 Slovakia see Austria Slovenia
15. ation is extracted from a full data sheet with the same type number and title For detailed information see the relevant data sheet or data handbook Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Where application information is given it is advisory and does not form part of the specification 15 LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale 1997 Mar 28 23 Philips Semiconductors Argentina see South America Australia 34 Waterloo Road NORTH RVDE NSW 2113 Tel 461 2 9805 4455 Fax 461 2 9805 4466 Austria Computerstr 6 A 1101 WIEN P O Box 213 Tel 43 1 60 101 Fax 43 1 60 101 1210 Belarus Hotel Minsk Business
16. el input voltage 2 0 V lu input leakage current Vi Vss or Vpp 1 HA Ci nput capacitance note 3 10 pF nput OSC lose oscillator start up current VI Vss 0 5 1 2 5 0 uA LCD outputs Vgp DC voltage of backplane drivers 20 mv Zo BP backplane driver output impedance note 4 Vpp 5V 0 5 5 0 kQ Zo s segment driver output impedance note 4 Vpp 5V 1 7 kQ Notes 1 Outputs open CBUS inactive Resets all logic when Vpp lt Vpor 2 3 Periodically sampled not 100 tested 4 Outputs measured one at a time 1997 Mar 28 13 Philips Semiconductors LCD drivers 11 AC CHARACTERISTICS Vpp 2 25 to 6 0 V Vss 0 V Tamb 40 to 80 C Ro 1 MQ Co 680 pF all timing values are referenced to V H and Vi levels with an input voltage swing of Vss to Vpp unless otherwise specified Product specification PCF21xxC family SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Inputs CLB DATA and DLEN see Fig 12 SUDA data set up time 3 us tHDDA data hold time 3 us SUEN enable set up time 1 us tsupi disable set up time 2 us SULD load pulse set up time 2 5 us BUSY busy time 3 us twH CLB HIGH time 1 us twL CLB LOW time 5 us cLB CLB cycle time 10 us r rise time 10 us tf fall time 10 us LCD timing see Figs 12 14 15 16 and 17 LCD LCD frame frequency
17. ide are not included OUTLINE REFERENCES EUROPEAN VERSION JEDEC EIAJ PROJECTION ISSUE DATE SOT158 1 E4 92 44 47 95 01 24 1997 Mar 28 21 Philips Semiconductors LCD drivers 13 SOLDERING 13 1 Introduction There is no soldering method that is ideal for all IC packages Wave soldering is often preferred when through hole and surface mounted components are mixed on one printed circuit board However wave soldering is not always suitable for surface mounted ICs or for printed circuits with high population densities In these situations reflow soldering is often used This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our IC Package Databook order code 9398 652 90011 13 2 DIP 13 2 1 SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C solder at this temperature must not be in contact with the joint for more than 5 seconds The total contact time of successive solder waves must not exceed 5 seconds The device may be mounted up to the seating plane but the temperature of the plastic body must not exceed the specified maximum storage temperature T stg max If the printed circuit board has been pre heated forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit 13 2 2 REPAIRING SOLDERED JOINTS
18. line bus CBUS structure enables serial data transfer with microcontrollers All inputs are CMOS NMOS compatible The devices have the same function and performance as those of the PCF21xx family which they supersede The maximum operating voltage required is reduced from e Power on reset clear 6 5 to 6 0 V e LCD segments 40 PCF2100C 64 PCF2111C 32 PCF2112C e Multiplex rate 1 2 PCF2100C 1 2 PCF2111C 1 1 PCF2112C e Word length 22 bits PCF2100C 34 bits PCF2111C 34 bits PCF2112C 3 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT VDD supply voltage 225 l 6 0 V Ipp1 supply current 1 outputs open CBUS inactive 20 50 HA Ipp2 supply current 2 outputs open CBUS inactive 20 30 HA Tamb 25 C Po power dissipation per output 100 mW Tamb operating ambient temperature 40 485 C Tstg storage temperature 65 4150 JPEG 4 ORDERING INFORMATION TYPE PACKAGE NUMBER NAME DESCRIPTION VERSION PCF2100CP DIP28 plastic dual in line package 28 leads 600 mil SOT117 1 PCF2100CT S028 plastic small outline package 28 leads body width 7 5 mm SOT136 1 PCF2111CP DIP40 plastic dual in line package 40 leads 600 mil SOT129 1 PCF2111CT VSO40 plastic very small outline package 40 leads SOT158 1 PCF2112CP DIP40 plastic dual in line package 40 leads 600 mil SOT129 1 PCF2112CT VSO40 plastic very small
19. ming diagram for PCF2100C and PCF2111C OFF ON VDD Vss Vi Pe Segment X SX Vss VDD Vss 0 BP SX Vpp Vss flop MLD299 Fig 9 Timing diagram for PCF2112C 1997 Mar 28 10 Philips Semiconductors Product specification LCD drivers PCF21xxC family 7 6 Input circuitry BUS DRIVER PCF21XXC MLD284 Vss line is common In systems where it is expected that Vpp2 gt Vpp1 0 5 V a resistor should be inserted to reduce the current flowing through the input protection Maximum input current lt 40 HA Fig 10 Input circuitry 7 7 Expansion LCD BP2 S1toS32 BP2 S to S32 BP BP2 S to S32 VDD DLEN pcF21110 OSC PCF2111C cg POF2111 Qo DATA Vss Vss MASTER SLAVE1 SLAVE1 DATA CLB PA DLEN1 DLEN DLEN3 MEDES By connecting OSC to Vss the BP pins become inputs and generate signals synchronized to the single oscillator frequency thus allowing expansion of several members of the PCF21xxC family up to the BP drive capability of the master The PCF2112C can only function as a master for other PCF2112Cs Fig 11 Expansion possibility using PCF2111C 1997 Mar 28 11 Philips Semiconductors Product specification LCD drivers PCF21xxC family 8 LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 134
20. put 25 St S24 13 LCD driver output 24 g 23 14 LCD driver output 23 a 22 15 LCD driver output 22 S21 16 LCD driver output 21 s S20 17 LCD driver output 20 s S19 18 1 LCD driver output 19 S6 PCF2112C S18 19 LCD driver output 18 S7 S17 20 LCD driver output 17 s8 S16 21 LCD driver output 16 s S15 22 1 LCD driver output 15 si 14 23 LCD driver output 14 13 24 LCD driver output 13 pi S12 25 LCD driver output 12 S11 26 LCD driver output 11 S13 S10 27 LCD driver output 10 S14 S9 28 LCD driver output 9 S15 8 29 LCD driver output 8 S16 S7 30 LCD driver output 7 S6 31 LCD driver output 6 S5 32 LCD driver output 5 S4 33 LCD driver output 4 3 34 LCD driver output 3 S2 35 LCD driver output 2 S1 36 LCD driver output 1 n c 37 not connected BP 38 backplane driver output DATA 38 jdala inpuljine EBUS Fig 6 Pin configuration SOT129 1 and SOT158 1 DLEN 40 data input line enable CBUS 1997 Mar 28 Philips Semiconductors LCD drivers 7 FUNCTIONAL DESCRIPTION An LCD segment or LED output is activated when the corresponding DATA bit is HIGH 7 1 PCF2100C When DATA bit 21 is HIGH the A latches BP1 are loaded With DATA bit 21 LOW the B latches BP2 are loaded CLB pulse 23 transfers data from the shift register to the selected latches 7 2 PCF2111C When DATA bit 33 is HIGH the A latches BP1 are loaded With DATA bit 33 LOW the B latches BP2 are loaded CLB
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22. st incorporate solder thieves at the downstream end During placement and before soldering the package must be fixed with a droplet of adhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured Maximum permissible solder temperature is 260 C and maximum duration of package immersion in solder is 10 seconds if cooled to less than 150 C within 6 seconds Typical dwell time is 4 seconds at 250 C A mildly activated flux will eliminate the need for removal of corrosive residues in most applications 13 3 3 REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonally opposite end leads Use only a low voltage soldering iron less than 24 V applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 C When using a dedicated tool all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Philips Semiconductors Product specification LCD drivers PCF21xxC family 14 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development Preliminary specification This data sheet contains preliminary data supplementary data may be published later Product specification This data sheet contains final product specifications Short form specification The data in this specific

PHILIPS PCF21xxC family LCD drivers handbook(1)

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