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MOTOROLA MMUN2111LT1 SERIES Data Sheet

1. 0 10 20 30 40 50 COLLECTOR CURRENT mA Figure 11 Input Voltage versus Output Current Motorola Small Signal Transistors FETs and Diodes Device Data 5 MMUN2111LT1 SERIES TYPICAL ELECTRICAL CHARACTERISTICS MMUN2113LT1 1000 100 h Fe CURRENT GAIN NORMALIZED VCE sat MAXIMUM COLLECTOR VOLTAGE VOLTS 0 10 20 30 40 Ic COLLECTOR CURRENT mA Figure 12 VCE sat versus lc 10 100 COLLECTOR CURRENT Figure 13 DC Current Gain 1 100 TA 75 C 25 C f 1MHz IE 0V m 0 8 TA 25 C i 10 25 z uf 06 5 1 5 lt 04 01 E 8 8 0 o 0 01 Vo 5V 001 00 10 20 30 40 50 0 99 1 2 3 4 5 6 7 8 9 10 Vn REVERSE BIAS VOLTAGE VOLTS Figure 14 Output Capacitance Vin INPUT VOLTAGE VOLTS Figure 15 Output Current versus Input Voltage 100 Vo 2V 25 C D 25
2. C 9 0 75 C z Ej gt E a 1 a 1 1 0 10 20 30 40 50 COLLECTOR CURRENT mA Figure 16 Input Voltage versus Output Current 6 Motorola Small Signal Transistors FETs and Diodes Device Data MMUN2111LT1 SERIES TYPICAL ELECTRICAL CHARACTERISTICS MMUN2114LT1 D 1 180 1 1 TA 75 to Vce tov x A N 25 140 Z u 5 400 25 C 2 E z 100 E 5 ha 0 01 60 zl 40 8 p 20 PH 0 001 0 gt 0 20 40 60 80 1 2 4 6 8 10 15 20 40 50 60 70 80 90 100 Ic COLLECTOR CURRENT mA Ic COLLECTOR CURRENT mA Figure 17 VCE sat versus Ic Figure 18 DC Current Gain 4 5 100 4 f 1MHz Ta 75 C 25 C IE 0V 3 5 lt T 25 C t ur 3 e 25 E gt 10 e amp 2 c lt E p 1 5 Q o eu Sig e 0 5 Vo 5V 0 1 0 2 4 6 8 10 15 20 25 30 35 40 45 50 0 2 4 6 8 10 Vp REVERSE BIAS VOLTAGE VOLTS Vin INPUT VOLTAGE VOLTS Figure 19 Output Capacitance Figure 20 Output Current versus I
3. COLLECTOR ISSUE AE SOT 23 TO 236AB Motorola reserves the rightto make changes without further notice to any products herein Motorola makes no warranty representation or guarantee regarding the suitability of its products for any particular purpose nor does Motorola assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability including without limitation consequential or incidental damages Typical parameters can and do vary in different applications All operating parameters including Typicals must be validated for each customer application by customer s technical experts Motorola does not convey any license under its patent rights nor the rights of others Motorola products are not designed intended or authorized for use as components in Systems intended for surgical implant into the body or other applications intended to support or sustain life or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur Should Buyer purchase or use Motorola products for any such unintended or unauthorized application Buyer shall indemnify and hold Motorola and its officers employees subsidiaries affiliates and distributors harmless against all claims costs damages and expenses and reasonable attorney fees arising out of directly or indirectly any claim of personal injury or death associat
4. MMUN2114LT1 MMUN2115LT1 2 COLLECTOR Order this document by MMUN2111LT1 D MMUN2111LT1 SERIES Motorola Preferred Devices PNP SILICON BIAS RESISTOR TRANSISTOR gt CASE 318 08 STYLE 6 SOT 23 TO 236AB 1 Device mounted on a FR 4 glass epoxy printed circuit board using the minimum recommended footprint 2 New devices Updated curves to follow in subsequent data sheets Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value Replaces MMUN2111T1 D Motorola Inc 1996 M MOTOROLA MMUN 2111LT1 SERIES DEVICE MARKING AND RESISTOR VALUES Continued Device Marking MMUN 2116LT1 MMUN2130LT1 MMUN2131LT1 MMUN2132LT1 AGF A6G A6H A6J MMUN2133LT1 2 A6K MMUN2134LT1 2 A6L ELECTRICAL CHARACTERISTICS TA 25 unless otherwise noted Ssa rose so pes URS OFF CHARACTERISTICS Collector Emitter Cutoff Current Vcg 50 V Ig 0 ICEO 5 Emitter Base Cutoff Current MMUN2111LT1 IEBO VEB 6 0 V Ic 0 MMUN2112LT1 MMUN2113LT1 MMUN2114LT1 MMUN2115LT1 MMUN2116LT1 MMUN2130LT1 MMUN2131LT1 MMUN2132LT1 MMUN2133LT1 MMUN2134LT1 Collector Base Breakdown Voltage Ic 10 uA IE 0 V BR CBO m w Collector Emitter Breakdown Voltage 3 Ic 2 0 mA 0 V BR CEO W ON CHARACTERISTICS 3 DC Current Gain MMUN2111LT
5. by conduction The circuit board because it has a large surface area absorbs the thermal energy more efficiently then distributes this energy to the components Because of this effect the main body of a component may be up to 30 degrees cooler than the adjacent solder joints STEP 4 STEP5 STEP6 STEP7 HEATING HEATING VENT COOLING ZONES386 ZONES4 amp 7 PR 205 ade 170 C PEAK AT SOLDER JOINT OLDER IS LIQUID FOR 40 TO 80 SECONDS DEPENDING ON MASS OF ASSEMBLY TIME 3 TO 7 MINUTES TOTAL gt TMAX Figure 23 Typical Solder Heating Profile Motorola Small Signal Transistors FETs and Diodes Device Data 9 MMUN2111LT1 SERIES PACKAGE DIMENSIONS NOTES 1 DIMENSIONING AND TOLERANCING PER ANSI Y14 5M 1982 2 CONTROLLING DIMENSION INCH 3 MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL INCHES MILLIMETERS MIN MAX MIN MAX 0 1102 0 1197 2 80 3 04 0 0472 0 0551 1 20 1 40 0 0350 10 0440 0 89 141 0 0150 0 0200 0 37 0 50 0 0701 0 0807 178 204 0 0005 0 0040 0 013 0 100 0 0034 10 0070 0 085 0 177 0 0180 0 0236 0 45 0 60 0 0350 0 0401 0 89 1 02 0 0830 0 0984 2 10 2 50 0 0177 0 0286 0 45 0 60 B C D G H J K L S V STYLE 6 PIN1 BASE 2 EMITTER CASE 318 08 3
6. 0 50 Ic COLLECTOR CURRENT mA Figure 6 Input Voltage versus Output Current Motorola Small Signal Transistors FETs and Diodes Device Data c MMUN 2111LT1 SERIES TYPICAL ELECTRICAL CHARACTERISTICS VCE sat MAXIMUM COLLECTOR VOLTAGE VOLTS Cob CAPACITANCE pF e MMUN2112LT1 1000 g VcE 10V HM lt gt g TA 75 C 25 ES 100 25 C a a D e Q tH 10 20 40 60 80 1 10 100 Ic COLLECTOR CURRENT mA Ic COLLECTOR CURRENT mA Figure 7 VCE sat versus 1 Figure 8 DC Current Gain 10 20 Vp REVERSE BIAS VOLTAGE VOLTS Figure 9 Output Capacitance Vin INPUT VOLTAGE VOLTS 100 BE TA 25 C 10 E Z 2 LT Hi H 8 001 Vo 5V H 30 40 50 UN ac m uou 678 9 10 Vin INPUT VOLTAGE VOLTS 100 Figure 10 Output Current versus Input Voltage
7. 1 VCE 10 V Ig 5 0 mA MMUN2112LT1 MMUN2113LT1 MMUN2114LT1 MMUN2115LT1 MMUN2116LT1 MMUN2130LT1 MMUN2131LT1 MMUN2132LT1 MMUN2133LT1 MMUN2134LT1 Collector Emitter Saturation Voltage Ic 10 mA Ig 0 3 mA 10 mA IB 5 MMUN2130LT1 MMUN2131LT1 10 mA IB 1 MMUN2115LT1 MMUN2116LT1 MMUN2132LT1 MMUN2133LT1 MMUN2134LT1 Output Voltage on Vcc 5 0 V VB 25V RL 1 0 MMUN2111LT1 MMUN2112LT1 MMUN2114LT1 MMUN2115LT1 MMUN2116LT1 MMUN2130LT1 MMUN2131LT1 MMUN2132LT1 MMUN2133LT1 MMUN2134LT1 Vcc 5 0 V VB 3 5 V RL 1 0 MMUN2113LT1 2 New devices Updated curves to follow in subsequent data sheets 3 Pulse Test Pulse Width lt 300 us Duty Cycle lt 2 0 2 Motorola Small Signal Transistors FETs and Diodes Device Data MMUN2111LT1 SERIES ELECTRICAL CHARACTERISTICS TA 25 C unless otherwise noted Continued Output Voltage off Vcc 5 0 V VB 0 5 V RL 1 0 Vcc 5 0 V Vg 0 25 V RL 1 0 MMUN2115LT1 MMUN2116LT1 MMUN2131LT1 MMUN2132LT1 Vcc 5 0 V VB 0 050 V RL 1 0 kQ MMUN2130LT1 Input Resistor MMUN2111LT1 MMUN2112LT1 MMUN2113LT1 MMUN2114LT1 MMUN2115LT1 MMUN2116LT1 MMUN2130LT1 MMUN2131LT1 MMUN2132LT1 MMUN2133LT1 MMUN2134LT1 Resistor Ratio MMUN2111LT1 MMUN2112LT1 MMUN2113LT1 MMUN2114LT1 MMUN2115LT1 MMUN2116LT1 MMUN2130LT1 MMUN2131LT1 MMUN2132LT1 MMUN2133LT1 Motorola Small Signal Transistors FETs and Diodes Devi
8. MOTOROLA SEMICONDUCTOR TECHNICAL DATA Bias Resistor Transistor PNP Silicon Surface Mount Transistor with Monolithic Bias Resistor Network This new series of digital transistors is designed to replace a single device and its external resistor bias network The BRT Bias Resistor Transistor contains a single transistor with a monolithic bias network consisting of two resistors a series base resistor and a base emitter resistor The BRT eliminates these individual components by integrating them into a single device The use of a BRT can reduce both system cost and board space The device is housed in the SOT 23 package which is designed for low power surface mount applications e Simplifies Circuit Design e Reduces Board Space FNS e Reduces Component Count e The SOT 23 package can be soldered using wave or OUTPUT reflow The modified gull winged leads absorb thermal stress during soldering eliminating the possibility of hy damage to the die BASE e Available 8 mm embossed tape and reel Use the INPUT Device Number to order the 7 inch 3000 unit reel PIN2 Replace T1 with T3 in the Device Number to order EMITTER the 13 inch 10 000 unit reel GROUND MAXIMUM RATINGS TA 25 C unless otherwise noted Collector Base Voltage Collector Emitter Voltage Collector Current Total Power Dissipation TA 25 C 1 Derate above 25 C THERMAL CHARACTERISTICS MMUN 111LT1 MMUN 112LT1 MMUN2113LT1
9. ce Data 3 MMUN2111LT1 SERIES TYPICAL ELECTRICAL CHARACTERISTICS 0 20 40 60 80 COLLECTOR CURRENT mA Figure 2 VCE sat versus 1 COLLECTOR CURRENT 0 1 0 1 2 3 4 5 6 8 9 Vin INPUT VOLTAGE VOLTS Figure 5 Output Current versus Input Voltage Vin INPUT VOLTAGE VOLTS 0 10 20 30 40 50 VR REVERSE BIAS VOLTAGE VOLTS Figure 4 Output Capacitance MMUN2111LT1 250 2 2 lt 200 Q 5 9 150 lt 7 E 2 100 9 gt s z RgJA 625 C W 2 50 a x 9 0 50 0 50 100 150 9 TA AMBIENT TEMPERATURE Figure 1 Derating Curve 1000 A VE 210 V N lt 2 T Q 2 TA 75 C 25 2 100 25 C 2 lt T x Gt 5 3 8 e e ea 10 1 10 100 Ic COLLECTOR CURRENT mA Figure 3 DC Current Gain 100 0 10 20 30 4
10. ed with such unintended or unauthorized use even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part Motorola and o are registered trademarks of Motorola Inc Motorola Inc is an Equal Opportunity Affirmative Action Employer How to reach us USA EUROPE Motorola Literature Distribution JAPAN Nippon Motorola Ltd Tatsumi SPD JLDC Toshikatsu Otsuki P O Box 20912 Phoenix Arizona 85036 1 800 441 2447 6F Seibu Butsuryu Center 3 14 2 Tatsumi Koto Ku Tokyo 135 Japan 03 3521 8315 MFAX RMFAXOQ email sps mot com TOUCHTONE 602 244 6609 HONG KONG Motorola Semiconductors Ltd 8B Tai Ping Industrial Park INTERNET http Design NET com 51 Ting Kok Road Tai Po N T Hong Kong 852 26629298 M MOTOROLA ___ C Q MMUN2111LT1 D
11. erature and time should not exceed 260 C for more than 10 seconds e When shifting from preheating to soldering the maximum temperature gradient should be 5 C or less e After soldering has been completed the device should be allowed to cool naturally for at least three minutes Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress e Mechanical stress or shock should not be applied during cooling Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device 8 Motorola Small Signal Transistors FETs and Diodes Device Data MMUN2111LT1 SERIES SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board solder paste must be applied to the pads A solder stencil is required to screen the optimum amount of solder paste onto the footprint The stencil is made of brass or stainless steel with a typical thickness of 0 008 inches The stencil opening size for the surface mounted package should be the same as the pad size on the printed circuit board i e a 1 1 registration TYPICAL SOLDER HEATING PROFILE For any given circuit board there will be a group of control settings that will give the desired heat pattern The operator must set temperatures for several heating zones and a figure for belt speed Taken together these control se
12. nput Voltage 10 42V Vo 02V 1 25 25 o 9 75 Typical Application for PNP BRTs 1 gt LE 2 a 2 0 1 0 10 20 30 40 50 Ic COLLECTOR CURRENT mA Figure 21 Input Voltage versus Output Current Figure 22 Inexpensive Unregulated Current Source Motorola Small Signal Transistors FETs and Diodes Device Data 7 MMUN2111LT1 SERIES INFORMATION FOR USING THE SOT 23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design The footprint for the semiconductor packages must be the correct size to insure proper solder connection 0 037 0 95 interface between the board and the package With the correct pad geometry the packages will self align when subjected to a solder reflow process 0 037 0 95 0 035 mm SOT 23 SOT 23 POWER DISSIPATION The power dissipation of the SOT 23 is a function of the pad size This can vary from the minimum pad size for soldering to the pad size given for maximum power dissipation Power dissipation for a surface mount device is determined by TJ max the maximum rated junction temperature of the die RgJA the thermal resistance from the device junction to ambient and the operating temperature TA Using the values provided on the data sheet Pp can be calculated as follows TJ max TA RJA The values for
13. the equation are found in the maximum ratings table on the data sheet Substituting these values into the equation for an ambient temperature Ta of 25 C one can calculate the power dissipation of the device which in this case is 200 milliwatts 150 C 25 C ET 2 200 milliwatts The 625 C W assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 200 milliwatts Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal Clad Using a board material such as Thermal Clad a power dissipation of 400 milliwatts can be achieved using the same footprint SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device When the entire device is heated to a high temperature failure to complete soldering within a short time could result in device failure Therefore the following items should always be observed in order to minimize the thermal stress to which the devices are subjected e Always preheat the device e The delta temperature between the preheat and soldering should be 100 C or less e When preheating and soldering the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet When using infrared heating with the reflow soldering method the difference should be a maximum of 10 e The soldering temp
14. ttings make up a heating profile for that particular circuit board On machines controlled by a computer the computer remembers these profiles from one operating session to the next Figure 23 shows a typical heating profile for use when soldering a surface mount device to a printed circuit board This profile will vary among soldering systems but it is a good starting point Factors that can affect the profile include the type of soldering system in use density and types of components on the board type of solder used and the type of board or substrate material being used This profile shows temperature versus time The line on the graph shows the STEP 1 STEP 2 STEP 3 PREHEAT VENT HEATING ZONE 1 SOAK ZONES 2 amp 5 RAMP RAMP 200 C DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150 C 150 C 100 C DESIRED CU 50 C 160 C 140 C RVE FOR LOW MASS ASSEMBLIES actual temperature that might be experienced on the surface of a test board at or near a central solder joint The two profiles are based on a high density and a low density board The Vitronics SMD310 convection infrared reflow soldering system was used to generate this profile The type of solder used was 62 36 2 Tin Lead Silver with a melting point between 177 189 C When this type of furnace is used for solder reflow work the circuit boards and solder joints tend to heat first The components on the board are then heated

MOTOROLA MMUN2111LT1 SERIES Data Sheet

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