HI-SINCERITY MICROELECTRONICS HJ6668 PNP EPITAXIAL PLANAR TRANSISTOR
Contents
1. Characteristics Curve Current Gain amp Collector Current 10 100 1000 10000 Collector Current mA On Voltage amp Collector Current On Voltage mV E S 100 Collector Current mA Capacitance amp Reverse Biased Voltage Capacitance pF S 1 10 Reverse Biased Voltage V Saturation Voltage mV Switching Times us Saturation Voltage amp Collector Current 100 1000 Collector Current mA Switching Time amp Collector Current L VCC 30V IC 2501B1 2501B2 Collector Current A HSMC Product Specification a TO 252 Dimension HI SINCERITY MICROELECTRONICS CORP Spec No Preliminary Data Issued Date 1999 03 01 Revised Date 2000 11 01 Page No2. H POWER H S N C E R ITY Spec No Preliminary Data Issued Date 1999 03 01 d A MICROELECTRONICS CORP Revised Date 2000 11 01 HJ6668 PNP EPITAXIAL PLANAR TRANSISTOR Description The HJ6668 is designed for general purpose amplifier and switching applications Absolute Maximum Ratings Ta 25 C e Maximum Temperatures Storage SERIES EEN 55 150 C JUNCTION TEMPChALUNG EE 150 C Maximum e Maximum Power Dissipation Total Power Dissipation lebt 65 W e Maximum Voltages and Currents BVCBO Collector to Base Voltage ssssssseeeeeeesseennrtrrrenserrttrrnnrrnnsrertnnnnnnnnnnrnnenernnnn nenn 80 V BVCEO Collector to Emitter Voltage enn 80 V BVEBO Emitter to Base Voltage AEN 5 V IC Collector et LEE 10 A Characteristics Ta 25 C ByCcBO 80 v IC 10mi_ gt O BVCEO 80 V_ IC 200mA O JEBO 100 mA _ VEB 5V EE ff mA VCE 80V ICEV 300 VCE 80V VBE off 1 5V ween o a E IB 10mA vCE sat 2 3 v IC 10A IB 100mA_ si VBE on i 28 v Gan VCE 3V VBE on 2 LL as Vv IC 10A VCE 3V WEE 1 20 K GA VCE 3V EES 100 IC 10A VCE 3V Pulse Test Pulse Width lt 380us Duty Cycle lt 2 HSMC Product Specification CA HI SINCERITY MICROELECTRONICS CORP Revised Date 2000 11 01 Spec No Preliminary Data Issued Date 1999 03 01 Page No 2 3
3. 3 3 Marking HSMC Logo Part Number Date Code W Product Series h Rank D ink Mark Style Pin 1 Base 2 Collector 3 Emitter AJ 3 Lead TO 252 Plastic Surface Mount Package HSMC Package Code J Typical DIM Inches Millimeters DIM Inches Millimeters Min Max Min Max Min Max Min Max A 0 0177 0 0217 0 45 0 55 G 0 0866 0 1102 2 20 2 80 B 0 0650 0 0768 1 65 1 95 H 0 0906 2 30 C 0 0354 0 0591 0 90 1 50 0 0354 0 90 D 0 0177 0 0236 0 45 0 60 J 0 0315 0 80 E 0 2520 0 2677 6 40 6 80 K 0 2047 0 2165 5 20 5 50 F 0 2125 0 2283 5 40 5 80 L 0 0551 0 0630 1 40 1 60 Notes 1 Dimension and tolerance based on our Spec dated May 05 1996 2 Controlling dimension millimeters 3 Maximum lead thickness includes lead finish thickness and minimum lead thickness is the minimum thickness of base material Alt there is any question with packing specification or packing method please contact your local HSMC sales office Material e Lead 42 Alloy solder plating e Mold Compound Epoxy resin family flammability solid burning class UL94V 0 Important Notice e All rights are reserved Reproduction in whole or in part is prohibited without the prior written approval of HSMC e HSMC reserves the right to make changes to i
4. ts products without notice e HSMC semiconductor products are not warranted to be suitable for use in Life Support Applications or systems e HSMC assumes no liability for any consequence of customer product design infringement of patents or application assistance Head Office And Factory e Head Office Hi Sincerity Microelectronics Corp 10F No 61 Sec 2 Chung Shan N Rd Taipei Taiwan R O C Tel 886 2 25212056 Fax 886 2 25632712 25368454 e Factory 1 No 38 Kuang Fu S Rd Fu Kou Hsin Chu Industrial Park Hsin Chu Taiwan R O C Tel 886 3 5983621 5 Fax 886 3 5982931 e Factory 2 No 17 1 Ta Tung Rd Fu Kou Hsin Chu Industrial Park Hsin Chu Taiwan R O C Tel 886 3 5977061 Fax 886 3 5979220 HSMC Product Specification
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