ROHM BD6721FS Technical Note
Contents
1. 0 15 0 15 Operating range Operating range 0 20 0 20 0 5 10 15 20 0 5 10 15 20 Supply voltage Vcc V Supply voltage Vcc V Fig 23 TH bias current Fig 24 MIN bias current www rohm com 2012 ROHM Co Ltd All rights reserved 9 13 TS202201 0H1H0B100170 1 2 TSZ22111 15 001 28 JUL 2012 Rev 002 BD6721FS Application circuit example Constant values are for reference Datasheet GND PWM SOFT SIGNAL AL 1 TSD SWITCHING OUTPUT 16 WA gt SIG OQ to 330pF Stabilize REF voltage to 1000pF OSC SIGNAL FG 2 osc OUTPUT 15 e S Ej Pile 2 E dicio wp Bs Se COMP O 1uF t amp ide of ha OUT o 3 REF REF 14 p output a d ha at conve gt 3 t L ae an2. NS N C CO LL LL 0 0 0 2 4 6 8 10 Output sink current Ifg Ial mA Fig 11 FG AL output low voltage Vcc 12V 8 z gt 6 o o S S S E 5 4 gt d d 5 Q O 5 lt E 1 c lt O c5 a Operating range O 2 0 5 10 15 20 Supply voltage Vcc V Fig 13 FG AL output leak current www rohm com 2012 ROHM Co Ltd All rights reserved 6 13 TSZ22111 15 001 0 8 0 6 0 4 0 2 0 0 3 0 2 5 2 0 0 5 Datasheet 2 4 6 8 10 Output sink current Ifg Ial mA Fig 12 FG AL output low voltage Ta 25 C Operating range 5 10 15 20 Supply voltage Vcc V Fig 14 OSC high low voltage TSZ02201 0H1H0B100170 1 2 28 JUL 2012 Rev 002 BD6721FS Datasheet Typical performance curves Reference data 60 10 lt ES O o 40 NS ma 2 S 60 Ma o c x G C a0 o 0 S 50 o LC St Operating range E i 20 5 P 49 o0 40 O o O 60 30 0 5 10 15 20 1 E 01 1 E 02 1 E 03 1 E 04 Supply voltage Vcc V Input frequency Flain Hz Fig 15 OSC charge discharge current Fig 16 Level amplifier gain Vcc 12V 70 2 0 gt Be aw 18 em 60 RU S i Es B p E 16 E o 90 2 B E 14 Fe i D gt J 40 3 12 E Operating range 30 1 0 1 E 01 1 E 02 1 E 03 1 E 04 0 5 10 15 20 Input frequency Flain Hz Supply vol
3. V Fig 19 Output ON duty 1 Pohl as 90 95 Vrel x 0 383 Output 1kQ OSC 470pF Output ON duty 2 Poh2 DEER de feo Output 1kQ OSC 470pF Output ON duty 3 Poh3 BE BEL SENE MEM dos Output 1kO OSC 470pF Reference voltage Vref 2 8 3 0 3 2 V Iref2 2mA Fig 20 21 Current limit setting voltage Vcl 290 310 330 mV Fig 22 TH input bias current Ith 0 2 MA Vth 0V Fig 23 MIN input bias current Imin 0 2 UA Vmin 0V Fig 24 About a current item define the inflow current to IC as a positive notation and the outflow current from IC as a negative notation www rohm com 2012 ROHM Co Ltd All rights reserved TSZ22111 15 001 3 13 TSZ02201 0H1H0B100170 1 2 28 JUL 2012 Rev 002 BD6721FS OG Typical performance curves Reference data 10 gt 8 E o gt lt m gt E 3 9 6 S Ka O H gt D a 2 4 2 3 2 O 5 Q c 2 Operating range I 0 0 5 10 15 20 Supply voltage Vcc V Fig 3 Circuit current 0 0 0 2 gt gt Be Be O O gt gt o 0 4 o a0 DD E E O O gt gt ob en 06 gt gt B B gt gt O O 0 8 1 0 0 0 0 1 0 2 0 3 0 4 0 5 0 6 0 7 Output source current Io A Fig 5 Output high voltage Vcc 12V www rohm com 2012 ROHM Co Ltd All rights reserved 4 13 TSZ22111 15 001 20 10 10 0 0 Datasheet Operating range 9 10 15 20 Supply voltage Vcc
4. L L H High L Low Hi Z High impedance FG output is open drain type Motor state AL Rotating L Locking Hi Z L Low Hi Z High impedance AL output is open drain type www rohm com 2012 ROHM Co Ltd All rights reserved 2 12 TSZ02201 0H1H0B100170 1 2 TSZ22111 15 001 28 JUL 2012 Rev 002 OG Electrical characteristics Unless otherwise specified Ta 25 C Vcc 12V BD6721FS Datasheet Limit Ref Parameter Symbol Unit Conditions Min Typ Max data Circuit current Icc 4 7 10 mA Fig 3 Hall input hysteresis voltage Vhys 5 10 15 mV Fig 4 lo 300mA l Output voltage Vo 0 6 0 9 V Fig 5 to 8 High and low side total Lock detection ON time Ton 0 3 0 5 0 7 Fig 9 Lock detection OFF time Toff 3 0 5 0 7 0 S Fig 10 FG output low voltage Vfgl 0 15 0 30 V Ifg bmA Fig 11 12 FG output leak current Ifgl 10 UA Vfg 17V Fig 13 AL output low voltage Vall 0 15 0 30 V lal 5mA Fig 11 12 AL output leak current lall 10 uA Val 17V Fig 13 OSC high voltage Vosch 2 3 2 5 2 7 V Fig 14 OSC low voltage Voscl 0 8 1 0 1 2 V Fig 14 OSC charge current Icosc 50 32 26 MA Fig 15 OSC discharge current Idosc 26 32 50 MA Fig 15 Level amplifier gain Gla 50 dB Fig 16 17 Level amplifier output high voltage Vlaoh 1 6 2 0 V For Vcc voltage Fig 18 Level amplifier output low voltage Vlaol 0 2 0 3
5. Operating supply voltage range 4 5 to 17 0 Operating input voltage range Oto 7 H H TH MIN LAIN more than Vcc 9V Operating input voltage range H H TH MIN LAIN less than Vcc 9V O to Vcc 2 OProduct structure Silicon monolithic integrated circuit OThis product is not designed protection against radioactive rays www rohm com 2012 ROHM Co Ltd All rights reserved 1 13 TSZ02201 0H1H0B100170 1 2 TSZ22111 14 001 28 JUL 2012 Rev 002 BD6721FS Datasheet Pin configuration Pin description T Name Function TOP VIEW Ground terminal signal ground Oscillating capacitor connecting GND AL terminal OSC FG Level amplifier output terminal Level amplifier input terminal LAOUT REF Output duty controllable input terminal Minimum output duty setting terminal LAIN H Motor output terminal 1 TH H Output current detecting resistor connecting terminal motor ground MIN Vcc Motor output terminal 2 Output current detection terminal OUTI CS Power supply terminal RNE OUT2 Hall input terminal Hall input terminal Reference voltage output terminal Fig 1 Pin configuration Speed pulse signal output terminal Lock alarm signal output terminal Block diagram PWM SOFT SWITCHING CONTROL LOGIC LOCK 1 PROTECT CURRENT LIMIT COMP Fig 2 Block diagram 1 0 truth table Hall input Driver output H H OUT1 OUT2 FG L H H
6. ROHM Datasheet SEMICONDUCTOR ZAR DC Brushless Fan Motor Drivers Multifunction Single phase Full wave ZICC ROLLS Fan Motor Driver BD6721FS G General description G Package W Typ x D Typ x H Max BD6721FS is a 1chip driver that composes H bridge of SSOP A16 6 60mm x 6 20mm x 1 71mm power DMOS FET Moreover because the level amplifier is installed the temperature control by the thermistor is also easy G Features Driver including power DMOS FET Speed controllable by DC direct PWM input PWM soft switching Quick start Current limit Lock protection and automatic restart Rotation speed pulse signal FG output Lock alarm signal AL output SSOP A16 Application B Fan motors for general consumer equipment of desktop PC and Projector etc Absolute maximum ratings Parameter Symbol Supply voltage 20 Power dissipation 812 5 Operating temperature range 40 to 100 Storage temperature range 55 to 150 Output voltage 20 Output current 1 0 Rotation speed pulse signal FG output voltage Rotation speed pulse signal FG output current Lock alarm signal AL output voltage Lock alarm signal AL output current Reference voltage REF output current Junction temperature 1 Reduce by 6 5mW C over Ta 25 C On 70 0mmx70 0mmx1 6mm glass epoxy board 2 This value is not to exceed Pd Recommended operating conditions Parameter Symbol
7. V Fig 4 Hall input hysteresis voltage 0 0 0 1 0 2 0 3 0 4 0 5 0 6 0 7 Output source current Io A Fig 6 Output high voltage Ta 25 C TSZ02201 0H1H0B100170 1 2 28 JUL 2012 Rev 002 BD6721FS OG Typical performance curves Reference data 1 0 0 8 100 C gt gt gt gt s 06 25 C Go B 5 gt gt 04 E 40 C E gt O O 02 0 0 0 0 0 1 02 0 3 04 0 5 0 6 0 7 Output sink current Io A Fig 7 Output low voltage Vcc 12V 0 7 Wb og E ET P E E D z LL 0 5 O c 5 s o O 2 D S x 9 04 6 i 5 Operating range 0 3 0 D 10 15 20 Supply voltage Vcc V Fig 9 Lock detection ON time www rohm com 2012 ROHM Co Ltd All rights reserved 5 13 TSZ22111 15 001 Datasheet 1 0 5V 0 8 12V 0 6 17V 0 4 0 2 0 0 0 0 0 1 0 2 0 3 0 4 0 5 0 6 0 7 Output sink current Io A Fig 8 Output low voltage Ta 25 C 10 6 0 5 0 4 0 Operating range 3 0 0 5 10 15 20 Supply voltage Vcc V Fig 10 Lock detection OFF time TSZ02201 0H1H0B100170 1 2 28 JUL 2012 Rev 002 BD6721FS OG Typical performance curves Reference data 0 8 gt gt e e gt 06 E E po gt gt on on 5 5 04 S z z D D 4 D 2 2 E E 2 Sch O O Jg 02 lt lt
8. e Products are exposed to sea wind or corrosive gases including Cl2 H2S NH3 SO2 and NO2 d Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves e Use of our Products in proximity to heat producing components plastic cords or other flammable items f Sealing or coating our Products with resin or other coating materials g Use of our Products without cleaning residue of flux even if you use no clean type fluxes cleaning residue of flux is recommended or Washing our Products by using water or water soluble cleaning agents for cleaning residue after soldering h Use of the Products in places subject to dew condensation The Products are not subject to radiation proof design Please verify and confirm characteristics of the final or mounted products in using the Products In particular if a transient load a large amount of load applied in a short period of time such as pulse is applied confirmation of performance characteristics after on board mounting is strongly recommended Avoid applying power exceeding normal rated power exceeding the power rating under steady state loading condition may negatively affect product performance and reliability De rate Power Dissipation Pd depending on Ambient temperature Ta When used in sealed area confirm the actual ambient temperature Confirm that operation temperature is within the specified range described in the product specificatio
9. e a CONTROL HALL of TA Con LOGIC AMP P d 4 COMP 13 H Sce me se of Suk in dl P r Ta LEVEL COMP AMP TL A LOCK H Paverce connecte ovo l5 TH PROTECT 12 j EE Ee Of the Onnecio eet PRES uc 5 MIN Vcc rs QUICK PRE Vel START DRIVER EN 100pF prm to 0 LuF TLOUT1 LCS no Tasa CURRENT 2000 LIMIT COMP to 20kO 3 RNF OUT2 o GU Doss ie votade Si C 0 330 to M Sg g Su CIO E L Ei EIE E Er Er E cit ie e Bu S E EA S E ae E E Fig 25 PWM controllable 4 wires type FG motor application circuit GND PWM SOFT SIGNAL AL 1 TSD SWITCHING OUTPUT 16 VVV gt SIG OQ to 330pF to 1000pF OSC SIGNAL FG 2 osc OUTPUT 15 COMP O 1uF to 3 OUT N REF REF 14 H e p ee c9 1 a c 2 UE ed CONTROL HALL tb SLY Con LOGIC AMP J 4 COMP 13 H s e cont qb LEVEL CU L E AMP T 1 po S LOCK Hir a TH PROTECT 5 MIN Vert QUICK PRE Vel START DRIVER T 100pF pr to O 1uF 7 QUT1 LCS no 4 ei CURRENT 2000 LIMIT COMP E to 20kO 3 RNF OUT2 sis ee 0 330 to M F10 26 Thermistor controllable 3 wires type AL motor application circuit Substrate design note and arranged near to land IC power motor outputs and motor ground lines are made as fat as possible IC ground signal ground line is common with the application ground except motor ground i e hall ground etc The bypass capacitor and or Zenner diode are arrangement near to Vcc terminal H and H
10. hall not be in any way responsible or liable for failure malfunction or accident arising from the use of any ROHM s Products against warning caution or note contained in this document All information contained in this document is current as of the issuing date and subject to change without any prior notice Before purchasing or using ROHM s Products please confirm the latest information with a ROHM sales representative Precaution on using ROHM Products 1 2 3 4 5 6 7 8 9 Our Products are designed and manufactured for application in ordinary electronic equipments such as AV equipment OA equipment telecommunication equipment home electronic appliances amusement equipment etc If you intend to use our Products in devices requiring extremely high reliability such as medical equipment transport equipment traffic equipment aircraft spacecraft nuclear power controllers fuel controllers car equipment including car accessories safety devices etc and whose malfunction or failure may cause loss of human life bodily injury or serious damage to property Specific Applications please consult with the ROHM sales representative in advance Unless otherwise agreed in writing by ROHM in advance ROHM shall not be in any way responsible or liable for any damages expenses or losses incurred by you or third parties arising from the use of any ROHM s Products for Specific Applications ROHM designs and manufact
11. he equation below 6ja Tj Ta P C W Thermal de rating curve indicates power that can be consumed by IC with reference to ambient temperature Power that can be consumed by IC begins to attenuate at certain ambient temperature This gradient is determined by thermal resistance Oja Thermal resistance 8ja depends on chip size power consumption package ambient temperature packaging condition wind velocity etc even when the same package is used Thermal de rating curve indicates a reference value measured at a specified condition Fig 28 shows a thermal de rating curve Value when mounting FR4 glass epoxy board 7O mm x 70 mm x 1 6 mm copper foil area below 3 Thermal resistance Ojc from IC chip joint part to the package surface part of mounting the above mentioned same substrate is shown in the following as a reference value jc 43 C W reference value Pd mW i ja Tj Ta P C W 812 5 Ojc Tj _ Tc P C W 750 HIST NE us lcu MINE ME MEE 0ja 153 8 C W Ambient temperature Ta C g Package surface temperature Tc C 500 D E Ss 250 nr i Ta C 0 25 50 75 100 125 150 Reduce by 6 5mW C over 25 C On 70 0mm x 70 0mm x 1 6mm glass epoxy board Chip surface temperature Tj C Power consumption P W Fig 27 Thermal resistance Fig 28 Thermal de rating curve 1 O equivalence circuit Resistance values are typical 3 Minimum output duty setting termi
12. is translation version only for a reference to help reading the formal version If there are any differences in translation version of this document formal version takes priority www rohm com 2012 ROHM Co Ltd All rights reserved 12 13 TSZ02201 0H1H0B100170 1 2 TSZ22111 15 001 28 JUL 2012 Rev 002 BD6721FS Datasheet Physical dimension tape and reel information SSOP A16 DE lt Tape and Reel information gt MAX 6 95 include BURR Embossed carrier tape 16 15 14 13 12 11 10 9 Quantity 2500pcs E2 The direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand Direction of feed a O O O O O O ER QOO is Sens 0 36 0 1 Direction of feed D K Unit mm Reel Order quantity needs to be multiple of the minimum quantity 1 2 3 4 5 6 7 8 Marking diagram SSOP A16 TOP VIEW Part Number LOT Number 1PIN Mark Revision history Revision Comments 07 JUL 2012 New Release 28 JUL 2012 Color appearance change There is no change in the content www rohm com O 2012 ROHM Co Ltd All rights reserved 13 12 TSZ02201 0H1H0B100170 1 2 TSZ22111 15 001 28 JUL 2012 Rev 002 Datasheet Notice General Precaution 1 2 Before you use our Products you are requested to carefully read this document and fully understand its contents ROHM s
13. lines are arranged side by side and made from the hall element to IC as shorter as possible because it is easy for the noise to influence the hall lines www rohm com 2012 ROHM Co Ltd All rights reserved TSZ22111 15 001 TSZ02201 0H1H0B100170 1 2 10 13 28 JUL 2012 Rev 002 BD6721FS Datasheet G Power dissipation Power dissipation total loss indicates the power that can be consumed by IC at Ta 25 C normal temperature IC is heated when it consumes power and the temperature of IC chip becomes higher than ambient temperature The temperature that can be accepted by IC chip depends on circuit configuration manufacturing process etc and consumable power is limited Power dissipation is determined by the temperature allowed in IC chip maximum junction temperature and thermal resistance of package heat dissipation capability The maximum junction temperature is in general equal to the maximum value in the storage temperature range Heat generated by consumed power of IC is radiated from the mold resin or lead frame of package The parameter which indicates this heat dissipation capability hardness of heat release is called heat resistance represented by the symbol ja C W This heat resistance can estimate the temperature of IC inside the package Fig 27 shows the model of heat resistance of the package Heat resistance 9ja ambient temperature Ta junction temperature Tj and power consumption P can be calculated by t
14. n ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document Notice Rev 003 2012 ROHM Co Ltd All rights reserved Datasheet Precaution for Mounting Circuit board design 1 When a highly active halogenous chlorine bromine etc flux is used the residue of flux may negatively affect product performance and reliability 2 In principle the reflow soldering method must be used if flow soldering method is preferred please consult with the ROHM representative in advance For details please refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1 If change is made to the constant of an external circuit please allow a sufficient margin considering variations of the characteristics of the Products and external components including transient characteristics as well as static characteristics 2 You agree that application notes reference designs and associated data and information contained in this document are presented only as guidance for Products use Therefore in case you use such information you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document ROHM shall not be in any way responsible or liable for any damages expenses or losses incurred by you or third parties arising from the use of such i
15. n diode can be added Power supply line Back electromotive force causes regenerated current to power supply line therefore take a measure such as placing a capacitor between power supply and GND for routing regenerated current And fully ensure that the capacitor characteristics have no problem before determine a capacitor value When applying electrolytic capacitors capacitance characteristic values are reduced at low temperatures GND potential It is possible that the motor output terminal may deflect below GND terminal because of influence by back electromotive force of motor The potential of GND terminal must be minimum potential in all operating conditions except that the levels of the motor outputs terminals are under GND level by the back electromotive force of the motor coil Also ensure that all terminals except GND and motor output terminals do not fall below GND voltage including transient characteristics Malfunction may possibly occur depending on use condition environment and property of individual motor Please make fully confirmation that no problem is found on operation of IC Thermal design Use a thermal design that allows for a sufficient margin in light of the power dissipation Pd in actual operating conditions Inter pin shorts and mounting errors Use caution when positioning the IC for mounting on printed circuit boards The IC may be damaged if there is any connection error or if pins are shorted together Actions in str
16. nal 4 Motor output terminals and Output current detecting resistor connecting terminal 1 Power supply terminal and Ground terminal 2 Hall input terminals Output duty controllable input terminal Output current detection terminal and Level amplifier input terminal Vcc Vcc b Vcc H MIN H 1kQ TH 300 CS 1kQ GND LAIN 5 Reference voltage output 6 Speed pulse signal output 7 Oscillating capacitor 8 Level amplifier output terminal terminal connecting terminal terminal Lock alarm signal output T m terminal Vcc Vcc Vcc Vcc 450 450 1kQ REF ju 1kQ 1kQ 31kO de www rohm com 2012 ROHM Co Ltd All rights reserved TSZ22111 15 001 TSZ02201 0H1H0B100170 1 2 11 13 28 JUL 2012 Rev 002 BD6721FS Datasheet G Operational Notes 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Absolute maximum ratings An excess in the absolute maximum ratings such as supply voltage temperature range of operating conditions etc can break down the devices thus making impossible to identify breaking mode such as a short circuit or an open circuit If any over rated values will expect to exceed the absolute maximum ratings consider adding circuit protection devices such as fuses Connecting the power supply connector backward Connecting of the power supply in reverse polarity can damage IC Take precautions when connecting the power supply lines An external directio
17. nformation Precaution for Electrostatic This Product is electrostatic sensitive product which may be damaged due to electrostatic discharge Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products Please take special care under dry condition e g Grounding of human body equipment solder iron isolation from charged objects setting of lonizer friction prevention and temperature humidity control Precaution for Storage Transportation 1 Product performance and soldered connections may deteriorate if the Products are stored in the places where a the Products are exposed to sea winds or corrosive gases including CI2 H2S NH3 SO2 and NO2 b the temperature or humidity exceeds those recommended by ROHM c the Products are exposed to direct sunshine or condensation d the Products are exposed to high Electrostatic 2 Even under ROHM recommended storage condition solderability of products out of recommended storage time period may be degraded It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period 3 Store transport cartons in the correct direction which is indicated on a carton with a symbol Otherwise bent leads may occur due to excessive stress applied when dropping of a carton 4 Use Products within the specified time after opening a h
18. on so that the pattern wiring resistance and voltage variations caused by large currents do not cause variations in the small signal ground voltage Be careful not to change the GND wiring pattern of any external components either Capacitor between output and GND When a large capacitor is connected between output and GND if Vcc is shorted with OV or GND for some cause it is possible that the current charged in the capacitor may flow into the output resulting in destruction Keep the capacitor between output and GND below 100pF IC terminal input When Vcc voltage is not applied to IC do not apply voltage to each input terminal When voltage above Vcc or below GND is applied to the input terminal parasitic element is actuated due to the structure of IC Operation of parasitic element causes mutual interference between circuits resulting in malfunction as well as destruction in the last Do not use in a manner where parasitic element is actuated In use We are sure that the example of application circuit is preferable but please check the character further more in application to a part that requires high precision In using the unit with external circuit constant changed consider the variation of externally equipped parts and our IC including not only static character but also transient character and allow sufficient margin in determining Status of this document The Japanese version of this document is formal specification A customer may use th
19. ong electromagnetic field Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction ASO When using the IC set the output transistor so that it does not exceed absolute maximum rations or ASO Thermal shut down circuit The IC incorporates a built in thermal shutdown circuit TSD circuit Operation temperature is 175 C typ and has a hysteresis width of 25 C typ When IC chip temperature rises and TSD circuit works the output terminal becomes an open state TSD circuit is designed only to shut the IC off to prevent thermal runaway It is not designed to protect the IC or guarantee its operation Do not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed Testing on application boards When testing the IC on an application board connecting a capacitor to a pin with low impedance subjects the IC to stress Always discharge capacitors after each process or step Always turn the IC s power supply off before connecting it to or removing it from a jig or fixture during the inspection process Ground the IC during assembly steps as an antistatic measure Use similar precaution when transporting or storing the IC GND wiring pattern When using both small signal and large current GND patterns it is recommended to isolate the two ground patterns placing a single ground point at the ground potential of applicati
20. ovided on an as is basis and ROHM does not warrant that all information contained in this document is accurate and or error free ROHM shall not be in any way responsible or liable for any damages expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information 2 This document may not be reprinted or reproduced in whole or in part without prior written consent of ROHM 3 The Products may not be disassembled converted modified reproduced or otherwise changed without prior written consent of ROHM 4 In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes including but not limited to the development of mass destruction weapons 5 The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM its affiliated companies or third parties Notice Rev 003 2012 ROHM Co Ltd All rights reserved
21. tage Vcc V Fig 17 Level amplifier gain Ta 25 C Fig 18 Level amplifier output high voltage www rohm com 2012 ROHM Co Ltd All rights reserved 7 13 T9202201 0H1H0B100170 1 2 TSZ22111 15 001 28 JUL 2012 Rev 002 BD6721FS OG Typical performance curves Reference data 0 20 0 15 0 10 0 05 Level amplifier output low voltage Vlaol V 0 00 3 2 3 1 3 0 Reference voltage Vref V 29 2 8 Output source current Iref mA Fig 21 Reference voltage current ability Vcc 12V www rohm com 2012 ROHM Co Ltd All rights reserved TSZ22111 15 001 2 ram 2 gt a o0 E O gt o O c L T o or Operating range 0 5 10 15 20 Supply voltage Vcc V Fig 19 Level amplifier output low voltage gt E gt a o0 E O gt o0 E B o o E PE c 2 5 CO 0 2 4 6 8 8 13 3 2 3 1 3 0 2 9 2 8 340 325 310 295 280 Datasheet Operating range 5 10 15 20 Supply voltage Vcc V Fig 20 Reference voltage Operating range 5 10 15 20 Supply voltage Vcc V Fig 22 Current limit setting voltage TSZ02201 0H1H0B100170 1 2 28 JUL 2012 Rev 002 BD6721FS Datasheet Typical performance curves Reference data 0 05 0 05 0 00 0 00 lt 5 J c c E 0 05 0 05 4d c c L L 5 5 O O 0 10 o 0 10 re T Z z
22. umidity barrier bag Baking is required before using Products of which storage time is exceeding the recommended storage time period Precaution for Product Label QR code printed on ROHM Products label is for ROHM s internal use only Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act please consult with ROHM representative in case of export Precaution Regarding Intellectual Property Rights 1 All information and data including but not limited to application example contained in this document is for reference only ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data 2 Nolicense expressly or implied is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the information contained in this document Notice Rev 003 2012 ROHM Co Ltd All rights reserved Datasheet Other Precaution 1 The information contained in this document is pr
23. ures its Products subject to strict quality control system However semiconductor products can fail or malfunction at a certain rate Please be sure to implement at your own responsibilities adequate safety measures including but not limited to fail safe design against the physical injury damage to any property which a failure or malfunction of our Products may cause The following are examples of safety measures a Installation of protection circuits or other protective devices to improve system safety b Installation of redundant circuits to reduce the impact of single or multiple circuit failure Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions as exemplified below Accordingly ROHM shall not be in any way responsible or liable for any damages expenses or losses arising from the use of any ROHM s Products under any special or extraordinary environments or conditions If you intend to use our Products under any special or extraordinary environments or conditions as exemplified below your independent verification and confirmation of product performance reliability etc prior to use must be necessary a Use of our Products in any types of liquid including water oils chemicals and organic solvents b Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust c Use of our Products in places where th
Download Pdf Manuals
Related Search
ROHM BD6721FS Technical Note