ROHM VCSP50L1 Manual(6)
Contents
1. EA CEEE 0 1 0 0 1 01 01 01 0 1 01 0 0 3 02 10 10 Unit mm 2 3 Leader and Trailer 2 3 1 Leader No component pockets are 40 pockets or more 2 3 2 Trailer No component pockets are 10 pockets or more Tape is free from reel 2 4 Label for Reel and Box Product No BU9847GUL WE2 paR EJ Out going inspection stamp D Only unit box U N Quantity pcs Pb Free Mark Mi at PU co Evaa ran Lot number PS MNO 124 023 pcs MNo 124 024 pcs Marking lot number TEES Excellence in Electronics nowmM EES Fig 5 Label example 2 5 Packing style Aa Pe 5 Label 4 reels or less per inner box Joint tape Inner box Fig 6 Packing style 2 6 Shipping style 2 7 Packing materials 4 unit boxes or less per shipping box Embossed carrier tape PS Oo Rea Ps pom a S a A C a ae z TTT a Mma ACO SB BE EE Co AET ANTONON m Shipping labe Jaee Pa Fig 7 Shipping box dimensions and shipping style Unit mm www rohm com 214 2007 08 Rev A 2011 ROHM Co Ltd All rights reserved VCSP50L1 BU9847GUL W Design Support Document Peelback 8 Others 8 1 Peelback strength Cover tape peelback strength is 0 2 0 7N 165 180 Peelback speed 300 10mm min Figz 8 Test method 2 8 2 Missing Ics 1 No consecutive dropouts 2 A maximun 0 1 of specified number of products in each packing may be missing 3 Storage conditions 3 1 S2. ROHM Design Support Document SEMICONDUCTOR Package VCSP50L1 Atable of contents Structure and materials n ne A page Tape and Reel information Hiius AA 3 4 page Stora ge CONGICIONS wes sssseeesssssessssesnenseesenssssssnccnncnerennnncncemannsscnnnnmnccnneeseressnnnamnennannnnnsannnnscersesrssssemmenes OQ UM A page Merling lot number lt OA pape Soldering conditions eessesesocossossosessssoseeecoceoesosooooooseseessecosseetttotesototessesssseteeeossosososessseeeeeeeeeoeseoesseesoesoeesseseseste 37 4 page i Footprint dimMensiorig eessessessossessossesecessossossoesossonesosoosoosasossoosssoassaesooosonessosoooosoosoosososssesesossacsssassssss OE MW A page External dimensions iiir AAA page Fra i iin TR oy OnNoah AN 1 Structure and materials Sn 3Ag 0 5Cu Solder Polyamide imide Resin Laser Marking Fig 1 Structure Dehydrated weight 0 002g 2 Tape and Reel information 2 1 Packing specification 3 000pcs Reel Direction of feed Reel Tpin 2 2 Tape and Reel specification Fig 2 Typical Tape and Reel configuration 2 2 1 Tape and reel dimensions See the table on page 2 4 Fig 3 Tape dimensions Fig 4 Reel dimensions www rohm com 1 4 2007 08 Rev A 2011 ROHM Co Ltd All rights reserved VCSP50L1 BU9847GUL W Design Support Document Tape dimensions Reel dimensions PAR PPN St POO Sl eB rm BPN a ry pA Bicol e wi cle EEEE EE
3. ailable please contact us Bola iLL ROHM Customer Support System SEMICONDUCTOR http www rohm com contact www rohm com 2011 ROHM Co Ltd All rights reserved R1120A
4. oducts If you wish to use any such Product please be sure to refer to the specifications which can be obtained from ROHM upon request Examples of application circuits circuit constants and any other information contained herein illustrate the standard usage and operations of the Products The peripheral conditions must be taken into account when designing circuits for mass production Great care was taken in ensuring the accuracy of the information specified in this document However should you incur any damage arising from any inaccuracy or misprint of such information ROHM shall bear no responsibility for such damage The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products ROHM does not grant you explicitly or implicitly any license to use or exercise intellectual property or other rights held by ROHM and other parties ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information The Products specified in this document are intended to be used with general use electronic equipment or devices such as audio visual equipment office automation equipment commu nication devices electronic appliances and amusement devices The Products specified in this document are not designed to be radiation tolerant While ROHM always makes efforts to enhance the quality and reliability of its Products a P
5. roduct may fail or malfunction for a variety of reasons Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury fire or any other damage caused in the event of the failure of any Product such as derating redundancy fire control and fail safe designs ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual The Products are not designed or manufactured to be used with any equipment device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury Such as a medical instrument transportation equipment aerospace machinery nuclear reactor controller fuel controller or other safety device ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes If a Product is intended to be used for any such special purpose please contact a ROHM sales representative before purchasing If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law you will be required to obtain a license or permit under the Law Thank you for your accessing to ROHM product informations More detail product informations and catalogs are av
6. timize footprint dimensions to the board design and soldering condition le b3 Unit mm 7 External dimentions IPIN MARK LOT No 1 95 0 05 0 15 INDEX POST 6 40 25 0 05 0 475 0 05 Unit mm 8 Precautions 8 1 Caution for handling Silicon substrate surface is exposing to the side of this package Therefore please pay careful attention to chip and crack and handle without touching the side of package 8 2 Regarding the underfill material In some case the underfill material is applied in order to reinforce the solder junction of package Since there is a case that solder joint reliability may deteriorate according to the resin material or coating condition please evaluate it sufficiently for its application In term of the coating condition it is preferable that there is an enough material beyond the each four sides of package lt Preferable example gt lt Non preferable example gt mer cee There is d Underfill resin evenly at cach four sides There is little Underfil resin at one or two sides www rohm com AJA 2007 08 RevA 2011 ROHM Co Ltd All rights reserved Notice Notes No copying or reproduction of this document in part or in whole is permitted without the consent of ROHM Co Ltd The content specified herein is subject to change for improvement without notice The content specified herein is for the purpose of introducing ROHM s products hereinafter Pr
7. torage environment Recommended storage conditions are as follows Temperature 5 30 C Humidity 40 70 RH 3 2 Storage period Specified storage period 1 year 3 3 Specified storage period until soldering This package dose not require additional drying treatment as long as the moisture condition at the mounting process is within our recommended mounting condition 4 Marking lot number o Lop Production lot number Production month code Production year code 5 Soldering conditions 5 1 Recommended temperature profile for reflow 260 C MAX Preheating temperature 130 C 190 C Preheating zone 120sec MAX 255 C s Soldering temperature 220 C 230 C Soldering temperature gt Soldering zone 60sec MAX Notice Maximum 2 times soldering Package surface temperature A N i Time Ran 10secMAX Ce Soldering zone 1 4 C sec gt Preheating gt temperature i Preheating Preheating 5 2 About mounting with Sn Pb solder paste Mounting with Sn Pb solder paste is not recommended because it has a possibility of reducing reliability to connect with Sn 3 0Ag 0 5Cu solder balls 5 3 The wave soldering method is not supported 5 4 Partical heat supply method by soldering iron is not supported rohm A 3 4 2007 08 Rev A 2011 ROHM Co Ltd All rights reserved VCSP50L1 BU9847GUL W Design Support Document 6 Footprint dimensions Op
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ROHM VCSP50L1 Manual(6)