ROHM VCSP85H2 Manual
Contents
1. L eee E Fig 7 Shipping box dimensions and shipping style 2008 04 Rev A VCSP85H2 BH6172GU Design Support Document 2 8 Others 2 8 1 Peelback strength Peelback Cover tape peelback strength is 0 2 to 0 7N Peelback speed a 165 to 180 300 10mm min 9 Fig 8 Test method 2 8 2 Missing Ics 1 No consecutive dropouts 2 A maximun 0 1 of specified number of products in each packing may be missing 3 Storage conditions 3 1 Storage environment Recommended storage conditions are as follows Temperature to 30 C Humidity 40 to 70 RH 3 2 Storage period Specified storage period 1 year 3 3 Specified storage period until soldering This package dose not require additional drying treatment as long as the moisture condition at the mounting process is within our recommended mounting condition 4 Marking lot number aan mas Production lot number Production week code The last figure of production year code 5 Soldering conditions 5 1 Recommended temperature profile for reflow 260 C MAX Preheating temperature 130 C to 190 C Preheating zone 120sec MAX 255 C Soldering temperature 220 C to 230 C Soldering temperature gt Soldering zone 60sec MAX 1 to 4 C sec gt Preheating gt Notice temperature Maximum 2 times soldering Package surface temperature 10sec MAX Preheating zone Soldering zone a 5 2 About mou2. 08 04 Rev A 2011 ROHM Co Ltd All rights reserved Notice Notes No copying or reproduction of this document in part or in whole is permitted without the consent of ROHM Co Ltd The content specified herein is subject to change for improvement without notice The content specified herein is for the purpose of introducing ROHM s products hereinafter Products If you wish to use any such Product please be sure to refer to the specifications which can be obtained from ROHM upon request Examples of application circuits circuit constants and any other information contained herein illustrate the standard usage and operations of the Products The peripheral conditions must be taken into account when designing circuits for mass production Great care was taken in ensuring the accuracy of the information specified in this document However should you incur any damage arising from any inaccuracy or misprint of such information ROHM shall bear no responsibility for such damage The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products ROHM does not grant you explicitly or implicitly any license to use or exercise intellectual property or other rights held by ROHM and other parties ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information The Products specified in this document are i
3. 2008 04 Rev A 2011 ROHM Co Ltd All rights reserved VCSP85H2 BH6172GU Tape dimensions 2 3 Leader and Trailer 2 3 1 Leader No component pockets are 40 pockets or more 2 3 1 Trailer No component pockets are 10 pockets or more Tape is free from reel 2 4 Label for Reel and Box Product No BH6172GU E2 Quantity 3 000 pcs 01 ig Lot number Dee A1 B1 ci ci oo ote rik rPo er e2z t w atest ci of e wii wai 3 01 3 01 0 85 0 25 61 5 61 0 1 75 35 1 1 4 0 4 0 2 0 0 3 8 0 0 1 0 1 i 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 05 0 3 A AT aes Tt eee FIE M No 124 02 M No 124 024 DCS EE JAPAN Es Excellence in Electronics ROH M emez Design Support Document Reel dimensions 6180 50 613 0 20 2 1 5 9 4 13 4 MAX MIN 40 2 MIN MIN 1 0 1 0 Unit mm Out going inspection stamp aye Only unit box Pb Free Mark pcs Marking lot number Fig 5 Label example 2 5 Packing style 4 reels or less per inner box yy gt Joint tape Label N p Fig 6 Packing style 2 6 Shipping style 4 unit boxes or less per shipping box 193 7 Unit mm www rohm com 2011 ROHM Co Ltd All rights reserved Shipping label En 2 4 hia r Inner box 2 7 Packing materials Embossed carrier taoe PS Shipping box Cardboard eo a L 6 C
4. ROHM Design Support Document SEMICONDUCTOR Package VCSP85H2 A table of contents 3 Storage conditiong wmmmrrnrveomeweneneeereerre enon eennasrsnaessemensinsvncnnnsnccsvnnssscnnsccnececensnsoescnrcnssennenencocnene 3 4 page 4 Marking lot MUTMIDE crvrnrennnnnenemennevnenssosooesveensmenensnanamnmnananennnensnsanocccssnsnscssocsssonsessenesossconsammnensesseeesesese 3 4 page 5 Soldering conditions sancossnenasoonenenes lt eUSDenrsictosenesban ENA ESTEE EE E AE ARA E A E R 3 4 page 6 Footprint CIMEMSIONS s sstrsssssrorsurrssussvstureuseusoseueouenvsusouseenreueoruzrunsuororenstoeneronrenn oneee 4 4 page 7 External dimensions VETETTE EE E E AERE 4 4 page 8 Precautions cress neeesssssccensecennennnncercsnsnsansnnnesecnreenenenecenssnnsonsssssssnnanesseranensunsssseeseeesenensassssnnnnneneneests 4 4 page 1 Structure and materials O_ be Sten CuPost Cu _ Mold Compound Epoxy Resin 4 Ext terminal Sn 3Ag 0 5Cu Solder Ss Mold Compound Polyamide imide Resin Marking Laser Marking Fig 1 Structure Dehydrated weight 0 01g 2 Tape and Reel information 2 1 Packing specification Tape Embossed carrier tape 3 000pcs Reel Direction of feed Reel 1pin 2 2 Tape and Reel specification Fig 2 Typical Tape and Reel configuration 2 2 1 Tape and reel dimensions See the table on page 2 4 Fig 3 Tape dimensions Fig 4 Reel dimensions www rohm com l 1 4
5. ntended to be used with general use electronic equipment or devices such as audio visual equipment office automation equipment commu nication devices electronic appliances and amusement devices The Products specified in this document are not designed to be radiation tolerant While ROHM always makes efforts to enhance the quality and reliability of its Products a Product may fail or malfunction for a variety of reasons Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury fire or any other damage caused in the event of the failure of any Product such as derating redundancy fire control and fail safe designs ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual The Products are not designed or manufactured to be used with any equipment device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury Such as a medical instrument transportation equipment aerospace machinery nuclear reactor controller fuel controller or other safety device ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes If a Product is intended to be used for any such special purpose please contact a ROHM sales
6. nting with Sn Pb solder paste Mounting with Sn Pb solder paste is not recommended because it has a possibility of reducing reliability to connect with Sn 3 0Ag 0 5Cu solder balls 5 3 The wave soldering method is not supported 5 4 Partical heat supply method by soldering iron is not supported www rohm com 3 4 2008 04 Rev A 2011 ROHM Co Ltd All rights reserved VCSP85H2 BH6172GU Design Support Document 6 Footprint dimensions Optimize footprint dimensions to the board design and soldering condition Unit mm 7 External dimentions IPIN MARK Lot No P 0 5x4 Unit mm 8 Precautions 8 1 Caution for handling Silicon substrate surface is exposing to the side of this package Therefore please pay careful attention to chip and crack and handle without touching the side of package 8 2 Regarding the underfill material In some case the underfill material is applied in order to reinforce the solder junction of package Since there is a case that solder joint reliability may deteriorate according to the resin material or coating condition please evaluate it sufficiently for its application In term of the coating condition it is preferable that there is an enough material beyond the each four sides of package lt Preferable example gt lt Non preferable example gt There is a Underfill resin eventy at each four sides There is little Underfill resin at one or two sides www rohm com 4 4 20
7. representative before purchasing If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law you will be required to obtain a license or permit under the Law Thank you for your accessing to ROHM product informations More detail product informations and catalogs are available please contact us Bola iLL ROHM Customer Support System SEMICONDUCTOR http www rohm com contact www rohm com 2011 ROHM Co Ltd All rights reserved R1120A
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ROHM VCSP85H2 Manual