ROHM VCSP50L1 Manual(1)
Contents
1. 2010 06 Rev A 2011 ROHM Co Ltd All rights reserved Notice Notes No copying or reproduction of this document in part or in whole is permitted without the consent of ROHM Co Ltd The content specified herein is subject to change for improvement without notice The content specified herein is for the purpose of introducing ROHM s products hereinafter Products If you wish to use any such Product please be sure to refer to the specifications which can be obtained from ROHM upon request Examples of application circuits circuit constants and any other information contained herein illustrate the standard usage and operations of the Products The peripheral conditions must be taken into account when designing circuits for mass production Great care was taken in ensuring the accuracy of the information specified in this document However should you incur any damage arising from any inaccuracy or misprint of such information ROHM shall bear no responsibility for such damage The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products ROHM does not grant you explicitly or implicitly any license to use or exercise intellectual property or other rights held by ROHM and other parties ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information The Products specified in this document ar2. solder balls 5 3 The wave soldering method is not supported 5 4 Partial heat supply method by soldering iron is not supported www rohm com 3 4 2010 06 RevA 2011 ROHM Co Ltd All rights reserved VCSP50L1 BD5465GUL Design Support Document 6 Footprint dimensions Optimize footprint dimensions to the board design and soldering condition le b3 j 6O Unit mm 7 External dimensions IE MAK aen Na 8g HIS s e ihe 9 0 25 0 05 8 l 005 JA18 F 0 15 INDEX POST xf B 2 x a E 05 P 0 5 x 2 fi 04 005 P 05x2 Unit mm 8 Precautions 8 1 Caution for handling Silicon substrate surface is exposing to the side of this package Therefore please pay careful attention to chip and crack and handle without touching the side of package 8 2 Regarding the underfill material In some case the underfill material is applied in order to reinforce the solder junction of package Since there is a case that solder joint reliability may deteriorate according to the resin material or coating condition please evaluate it sufficiently for its application In term of the coating condition it is preferable that there is an enough material beyond the each four sides of package lt Preferable example gt lt Non preferable example gt There is a Underfill resin evenly at each four sides There is little Underfill resin at one or two sides www rohm com 4 4
3. ROHM Design Support Document SEMICONDUCTOR Package VCSP50L1 Atable of contents 14 Structure and materials AOPA n A tas ahaa teased pega TOEA ERRA T AE AEA RRE 1 4 page pi A Tape and Reel information VIRE ARPE SAARA PORTAAN REER A AEEA REATOR 1 4 to 3 4 page 3 Storage CONGICIONS cress tsseereeseeeseetesceeseeeeeeensnennnccnsnsecnccnnnnenscnsonnsenrecssnneseesonsnseceennanecssssnnessscennecess 3 4 page 4 Marking lot number OPIPO IESE EI EREE gate ENIE NAE AAA ENA AENEIS 3 4 page 5 Soldering conditions SS ee ee 3 4 page 6 Footprint EONS CR eaaa 4 4 page 7 External dimensions ENEE AIPE E E E S E II E EAE O S T AI A ITEA NA ON 4 4 page 8 Precautions sien ie aoe LELLES NAE EREE IOIEN SEELE PENON EEEE EE 4 4 page 1 Structure and materials Q O cups o O _ Moid Compound Epoxy Resn Ext terminal Sn 3Ag 0 5Cu Solder s Mold Compound Polyamide imide Resin QO Marking Laser Marking Fig 1 Structure Dehydrated weight 3 1mg 2 Tape and Reel information 2 1 Packing specification Embossed carrier tape Direction of feed E2 See Fig 2 Reel 2 2 Tape and Reel specification Fig 2 Typical Tape and Reel configuration 2 2 1 Tape and reel dimensions See the table on page 2 4 Oo O O O O O O G O OOQ 1pin Direction of feed ne Direction of feed na Fig 3 Tape dimensions Fig 4 Reel dimensions www rohm com 1 4 2010 06 Rev A 2011 ROHM Co Lt
4. d All rights reserved VCSP50L1 BD5465GUL Design Support Document Tape dimensions Reel dimensions A1 Bil c c o oi eF K roji e tr w alset cto wil wa 2 00 2 00 0 6 0 2 61 5 60 5 1 75 3 5 0 8 4 0 4 0 25 8 0 180 13 0 1 5 9 0 11 4 0 1 0 1 0 1 40 1 0 1 0 1 0 1 0 1 0 1 0 05 0 3 0 0 2 MIN 1 0 1 0 0 1 5 0 Unit mm 2 3 Leader and Trailer 2 3 1 Leader No component pockets are 100 pockets 400mm or more 2 3 2 Trailer No component pockets are 40 pockets 160mm or more Tape is free from reel Out going inspection stamp 2 4 Label for Reel and Box Only unit box Product No BD5465GUL E2 dur N TTC UIT as Quantity 3 000 0124 A5110F FOR ROLUM ONLY Lot number Ht PLUM LITT Marking lot number Internal product code BD5465GUL E2 pes MNo 124 024 Fe Pb Free Mark WEE AOE IN JAPAN 2 5 Packing style Sie Label 4 reels or less per inner aa 182 hia n er Inner box Fig 6 Packing style 183 Joint tape Label Reel Unit mm 2 6 Shipping style 2 7 Packing materials 4 unit boxes or less per shipping box p Reo PS lt Shipping label gt 1 Product code 2 QTY 3 N O C pe Lee soe Fig 7 Shipping box dimensions and shipping style Unit mm www rohm com 214 2010 06 RevA 2011 ROHM Co Ltd All rights reserved VCSP50L1 BD5465GUL Design Support Document 2 8 Others 2 8 1 Peelbac
5. e intended to be used with general use electronic equipment or devices such as audio visual equipment office automation equipment commu nication devices electronic appliances and amusement devices The Products specified in this document are not designed to be radiation tolerant While ROHM always makes efforts to enhance the quality and reliability of its Products a Product may fail or malfunction for a variety of reasons Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury fire or any other damage caused in the event of the failure of any Product such as derating redundancy fire control and fail safe designs ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual The Products are not designed or manufactured to be used with any equipment device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury Such as a medical instrument transportation equipment aerospace machinery nuclear reactor controller fuel controller or other safety device ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes If a Product is intended to be used for any such special purpose please contact a ROHM sal
6. es representative before purchasing If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law you will be required to obtain a license or permit under the Law Thank you for your accessing to ROHM product informations More detail product informations and catalogs are available please contact us Bola iLL ROHM Customer Support System SEMICONDUCTOR http www rohm com contact www rohm com 2011 ROHM Co Ltd All rights reserved R1120A
7. k strength Peelback Cover tape peelback strength is 0 2 to 0 7N Peelback speed a 165 to 180 300 10mm min Fig 8 Test method 2 8 2 Missing ICs 1 No consecutive dropouts 2 A maximum 0 1 of specified number of products in each packing may be missing 3 Storage conditions 3 1 Storage environment Recommended storage conditions are as follows Temperature lt 5 to 30 C Humidity 40 to 70 RH 3 2 Storage period Specified storage period 1 year 3 3 Specified storage period until soldering This package dose not require additional drying treatment as long as the moisture condition at the mounting process is within our recommended mounting condition 4 Marking lot number EEE Production lot number Production monthly code The last figure of production year code 5 Soldering conditions 5 1 Recommended temperature profile for reflow 260 C MAX Preheating temperature 130 C to 190 C X Preheating zone 120sec MAX 255 C ee Soldering temperature 220 C to 230 C Soldering temperature gt Soldering zone 60sec MAX 1 to 4 C sec gt Notice Preheating gt temperature Maximum 3 times soldering Package surface temperature Preheating zone Soldering zone Js 5 2 About mounting with Sn Pb solder paste Mounting with Sn Pb solder paste is not recommended because it has a possibility of reducing reliability to connect with Sn 3 0Ag 0 5Cu
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ROHM VCSP50L1 Manual(1)