ROHM UCSP50L1 Manual(1)(1)
Contents
1. 2 2 Tape and Reel specification Fig 2 Typical Tape and Reel configuration 2 2 1 Tape and reel dimensions See the table on page 2 4 1pin Direction of feed gt Direction of feed Fig 3 Tape dimensions Fig 4 Reel dimensions www rohm com 4 4 2010 03 RevA 2011 ROHM Co Ltd All rights reserved UCSP50L1 BD1204GWL Design Support Document Tape dimensions Reel dimensions A1 Bi C ci po or E F K Pol P1 E wt w2 2 20 2 20 0 60 0 25 61 5 0 8 1 75 3 5 0 85 4 0 4 0 9 0 11 4 0 1 0 1 0 1 40 1 0 1 0 1 0 1 0 1 0 1 1 0 1 0 0 5 0 Unit mm 2 3 Leader and Trailer 2 3 1 Leader No component pockets are 100 pockets 400mm or more 2 3 2 Trailer No component pockets are 40 pockets 160mm or more Tape is free from reel Out going inspection stamp 2 4 Label for Reel and Box Only unit box BD1204GWL E2 mspas m u a Eag 3 000pcs 9124 A5110F FOR ROHM ONLY I 0 01 ed BD1204GWL E2 pcs p pes Free Product No Quantity Lot numbe Marking lot number Internal product code MNo 124 02 MNo 124 024 MM OMADE IN JAPAN pte US rari Pb Free Mark Fig 5 Label example 2 5 Packing style 4 reels or less per inner x esto Reel Joint tape Fig 6 Packing style 2 6 Shipping style 2 7 Packing materials 4 unit boxes or less per shipping box Embossed carrier ta2. ROHM Design Support Document SEMICONDUCTOR Package UCSP50L1 A table of contents 4 Structure and materials msssiisiiiiiniaiinisianineiiaa aaa 1 4 page 2 Tape and Reel information POAN TEOR OPIRA EISEIN ie ceusassasseesessndeeeseesresecteiesecabeibeutineseuaseserecetbbeies 1 4 to 3 4 page 3 Storage COnNdIt OnNnS eeesssssssssssssssssussoesssesesssesosssessessesosssesvesuesoesoesuessessessessesonsesoreoeeeozoosoesressossonsoessrss 3 4 page 4 Marking lot NUMDE weressssererrvvsnsnssssseeoescnncnnnnnnnnnsonsosenscensnseesssnnensnnnnnocsooessoesseseeensesnsesssnnsssscssccessssnsuessssscessee 3 4 page 5 Soldering conditions ANE AEI EPA EN AAA IEN EAA A O T I ELEA EAA 3 4 page 6 Footprint d MEnS OnNS strtssrsrrssssressrssrrsssrtsrrsssssrssnrsnnrnnneanseanreansennroneennranrennrnuronnrnnrennnne 4 4 page External dimensions PAEPAE AAA AE A EEEE I E A O A NEAR AA EE 4 4 page 8 Precautions we eersssssssesssssvvvsessscssenssssnsssnsnsssccsscessssssessoesesssonesnunsnsnssnsssserssnsssssasesessssssssusnassessasusssessssssossconeseees 4 4 page 1 Structure and materials e o O euP o oo Q Mold Compound Epoxy Resin G Ext terminal Sn 3Ag 0 5Cu Solder 5 Mold Compound Polyamide imide Resin CS Marking Laser Marking Fig 1 Structure Dehydrated weight 3 3mg 2 Tape and Reel information 2 1 Packing specification Embossed carrier tape Direction of feed E2 See Fig 2 Reel
3. beyond the each four sides of package lt Preferable example gt lt Non preferable example gt There is a Underfill resin evenly at each four sides There is little Underfill resin at one or two sides www rohm com 4 4 2010 03 Rev A 2011 ROHM Co Ltd All rights reserved Notice Notes No copying or reproduction of this document in part or in whole is permitted without the consent of ROHM Co Ltd The content specified herein is subject to change for improvement without notice The content specified herein is for the purpose of introducing ROHM s products hereinafter Products If you wish to use any such Product please be sure to refer to the specifications which can be obtained from ROHM upon request Examples of application circuits circuit constants and any other information contained herein illustrate the standard usage and operations of the Products The peripheral conditions must be taken into account when designing circuits for mass production Great care was taken in ensuring the accuracy of the information specified in this document However should you incur any damage arising from any inaccuracy or misprint of such information ROHM shall bear no responsibility for such damage The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products ROHM does not grant you explicitly or implicitly any license to use or exercise
4. ing ooann Soldering zone 60sec MAX Notice Maximum 3 times soldering Package surface temperature 1 to 4 C sec gt Preheating gt a F Preheating zone 5 2 About mounting with Sn Pb solder paste Mounting with Sn Pb solder paste is not recommended because it has a possibility of reducing reliability to connect with Sn 3 0Ag 0 5Cu solder balls Soldering zone 5 3 The wave soldering method is not supported 5 4 Partial heat supply method by soldering iron is not supported www rohm com 3 4 2010 03 Rev A 2011 ROHM Co Ltd All rights reserved UCSP50L1 BD1204GWL Design Support Document 6 Footprint dimensions Optimize footprint dimensions to the board design and soldering condition Unit mm 7 External dimensions 1PIN MARK Lot No F J Unit mm 8 Precautions 8 1 Caution for handling Silicon substrate surface is exposing to the side of this package Therefore please pay careful attention to chip and crack and handle without touching the side of package 8 2 Regarding the underfill material In some case the underfill material is applied in order to reinforce the solder junction of package Since there is a case that solder joint reliability may deteriorate according to the resin material or coating condition please evaluate it sufficiently for its application In term of the coating condition it is preferable that there is an enough material
5. intellectual property or other rights held by ROHM and other parties ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information The Products specified in this document are intended to be used with general use electronic equipment or devices such as audio visual equipment office automation equipment commu nication devices electronic appliances and amusement devices The Products specified in this document are not designed to be radiation tolerant While ROHM always makes efforts to enhance the quality and reliability of its Products a Product may fail or malfunction for a variety of reasons Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury fire or any other damage caused in the event of the failure of any Product such as derating redundancy fire control and fail safe designs ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual The Products are not designed or manufactured to be used with any equipment device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury Such as a medical instrument transportation equipment aerospace machinery nuclear reactor controller fuel control
6. ler or other safety device ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes If a Product is intended to be used for any such special purpose please contact a ROHM sales representative before purchasing If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law you will be required to obtain a license or permit under the Law Thank you for your accessing to ROHM product informations More detail product informations and catalogs are available please contact us Bola iLL ROHM Customer Support System SEMICONDUCTOR http www rohm com contact www rohm com 2011 ROHM Co Ltd All rights reserved R1120A
7. pe PS Yes PET PE Cardboard Cardboard None None lt Shipping label gt co 1 Product code 3 Borzcwe2 480 4 4F26 2005 042147408 2 QTY 3 N O C 7 4 LOT No Fig 7 Shipping box dimensions and shipping style Unit mm www rohm com 214 2010 03 RevA 2011 ROHM Co Ltd All rights reserved UCSP50L1 BD1204GWL Design Support Document 2 8 Others 2 8 1 Peelback strength Peelback Cover tape peelback strength is 0 2 to 0 7N Peelback speed a 165 to 180 300 10mm min Fig 8 Test method 2 8 2 Missing ICs 1 No consecutive dropouts 2 A maximum 0 1 of specified number of products in each packing may be missing 3 Storage conditions 3 1 Storage environment Recommended storage conditions are as follows Temperature 5 to 30 C Humidity 40 to 70 RH 3 2 Storage period Specified storage period 1 year 3 3 Specified storage period until soldering This package dose not require additional drying treatment as long as the moisture condition at the mounting process is within our recommended mounting condition 4 Marking lot number Production lot number Production monthly code The last figure of production year code 5 Soldering conditions 5 1 Recommended temperature profile for reflow 260 C MAX Preheating temperature 130 C to 190 C 255 C Preheating zone 120sec MAX Soldering temperature 220 C to 230 C Solder
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ROHM UCSP50L1 Manual(1)(1)