ROHM HSOP Manual
Contents
1. Box Out going inspection Product No BA1234FP E2 RARER BEERS Quantity 1 500 0124 5110 SS Lot number BA1234FP E2 MNo 124 023 pcs MNo 124 024 pcs Marking lot number Pb Free Mark Internal product code Fig 5 Label example 2 5 Packing style Unit box Label Fig 6 Packing style 2 6 Shipping style 2 7 Packing materials 5 unit boxes or less per shipping box g Y Cover tape PET PE HSOP25 372 368 355 HSOP28 372 368 355 all dimensions mm Shipping box Cardboard Please obey the indication of top side in a shipping box Fig 7 Shipping box dimensions and Shipping style Peelback Peelback speed ed s SON 180 300 10mm min 8 8 1 Peelback strength Cover tape peelback strength is 0 2 to 0 7N Fig 8 Test method www rohm com 214 2010 11 2 2011 ROHM Ltd All rights reserved HSOP Design Support Document 2 8 2 Missing Ics 1 No consecutive dropouts 2 A maximun 0 1 of specified number of products in each packing may be missing 3 Storage conditions 3 1 Storage environment Recommended storage conditions are as follows Temperature 5to 30 C Humidity 40 to 70 RH 3 2 Storage period Specified storage period 1 year 4 Marking lot number HSOP28 bo Production lot number Production week code Production year code 5 Footprint dimensions Optimize footprint dimension2. 51814111 Design Support Document SEMICONDUCTOR Package HSOP Atablie of contents 1 Structure and materials 1 4 page 2 Tape and Reel information 1 4 to 3 4 page a Storage conditions eee060060000006 0600000000000000000000000000008 0000000000 0000000000000000000000000000000000000000000000000 0040000000020 3 4 page 4 Marking lot number 4 M 9 3 4 page 5 Footprint dimensiOnS MM 8 M 3 4 6 Soldering conditions 1 Structure and materials o No Hem Materials Lead Frame External lead Pb free solder plating Q Die Silicon 8 Die Attach Wire 5 Molding Epoxy Resin Fig 1 Structure 2 Tape and Reel information 2 1 Packing specification Embossed carrier tape See the table on page 4 4 Direction of feed E2 See Fig 2 1Pin Direction of feed 2 2 Tape and Reel specification Reel 2 2 1 Tape and reel dimensions See the table on page 4 4 Fig 2 Typical Tape and Reel configuration P2 Y W1 Fig 3 Tape dimensions Fig 4 Reel dimensions 1 4 2010 11 Rev J 2011 ROHM Co Ltd All rights reserved HSOP Design Support Document 2 3 Leader and Trailer 2 3 1 Leader No component pockets are 40 pockets or more 2 3 2 Trailer No component pockets are 10 pockets or more Tape is free from reel 2 4 Label for Reel and
3. erating redundancy fire control and fail safe designs ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual The Products are not designed or manufactured to be used with any equipment device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury such as a medical instrument transportation equipment aerospace machinery nuclear reactor controller fuel controller or other safety device ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes If a Product is intended to be used for any such special purpose please contact a ROHM sales representative before purchasing If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law you will be required to obtain a license or permit under the Law Thank you for your accessing to ROHM product informations More detail product informations and catalogs are available please contact us ROHM ROHM Customer Support System SEMICONDUCTOR http www rohm com contact www rohm com 2011 ROHM Co Ltd All rights reserved R1120A
4. ons of the Products The peripheral conditions must be taken into account when designing circuits for mass production Great care was taken in ensuring the accuracy of the information specified in this document However should you incur any damage arising from any inaccuracy or misprint of such information ROHM shall bear no responsibility for such damage The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products ROHM does not grant you explicitly or implicitly any license to use or exercise intellectual property or other rights held by ROHM and other parties ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information The Products specified in this document are intended to be used with general use electronic equipment or devices such as audio visual equipment office automation equipment commu nication devices electronic appliances and amusement devices The Products specified in this document are not designed to be radiation tolerant While ROHM always makes efforts to enhance the quality and reliability of its Products a Product may fail or malfunction for a variety of reasons Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury fire or any other damage caused in the event of the failure of any Product such as d
5. s Mounting time 4sec or less Tape dimensions Quantity Tape dimensions all dimensions in mm Po Tolerance 0 1 40 1 x0 1 40 1 0 1 0 1 0 1 40 3 40 1 Reel dimensions Tolerance 0 2 MIN MIN Z MAX www rohm com AJA 2010 11 RevJ 2011 ROHM Ltd All rights reserved Design Support Document SEMICONDUCTOR Package Dimensions HSOP25 13 6 0 2 MAX 13 95 include BURR gt s N 5 1 12 0 0 2 Unit mm www rohm com 2011 06 Rev A 2011 ROHM Co Ltd All rights reserved Design Support Document SEMICONDUCTOR Package Dimensions HSOP28 18 5 0 2 MAX 18 85 include BURR Unit mm www rohm com 2011 ROHM Co Ltd All rights reserved 2011 06 Rev A Notice Notes No copying or reproduction of this document in part or in whole is permitted without the consent of ROHM Co Ltd The content specified herein is subject to change for improvement without notice The content specified herein is for the purpose of introducing ROHM s products hereinafter Products If you wish to use any such Product please be sure to refer to the specifications which can be obtained from ROHM upon request Examples of application circuits circuit constants and any other information contained herein illustrate the standard usage and operati
6. s to the board design and soldering condition A all dimensions in mm Package Land pitch Land space Land length Land width e MIE 12 b2 b3 b4 sores to 120 os 2 ar soras v PRR PURE PROF 6 Soldering conditions 6 1 Recommended temperature profile for reflow 260 MAX Preheating temperature 130 C to 190 C Preheating zone 120sec MAX 255 C gt Soldering temperature 220 C to 230 C Soldering temperature gt Soldering zone 60sec MAX 1 to 4 C sec gt Notice Preheating gt Maximum 2 times soldering temperature Package surface temperature Time 10sec MAX Soldering zone Preheating zone www rohm com 3 4 2010 11 Rev J 2011 ROHM Ltd All rights reserved HSOP Design Support Document 6 2 Recommended condition for wave soldering Preheating 120 C to 150 60sec MAX Soldering 260 C x 3 12sec Notice Soldering time is provided for total soldering time case of dual wave soldering 6 2 1 Notes for wave soldering 1 Do not use other soldering methods with wave soldering 2 Recommend to clean the board to eliminate flux solder waste and other impurities for reliability after soldering 3 Optimize soldering condition to prevent solder bridging 6 3 Recommended condition for solder iron Recommended condition for solder iron Solder iron temperature 380 C or les
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