AMD Am29F010 Known Good Die handbook
Contents
1. A m29F010 120D GC 1f nv EEE O ST AMD Am29F010 Known Good Die 1 Megabit 128 K x 8 Bit CMOS 5 0 Volt only Uniform Sector Flash Memory Die Revision 1 DISTINCTIVE CHARACTERISTICS E Single power supply operation 5 0 V 10 for read erase and program operations Simplifies system level power requirements E High performance 90 or 120 ns maximum access time E Low power consumption 30 mA max active read current 50 mA max program erase current lt 25 uA typical standby current E Flexible sector architecture Eight uniform sectors Any combination of sectors can be erased Supports full chip erase E Sector protection Hardware based feature that disables re enables program and erase operations in any combination of sectors Sector protection unprotection can be implemented using standard PROM programming equipment 1 13 98 Embedded Algorithms Embedded Erase algorithm automatically pre programs and erases the chip or any combination of designated sector Embedded Program algorithm automatically programs and verifies data at specified address Minimum 100 000 program erase cycles guaranteed Compatible with JEDEC standards Pinout and software compatible with single power supply flash Superior inadvertent write protection Data Polling and Toggle Bits Provides a software method of detecting program or erase cycle completion Tested to datasheet sp2. i ol i O N fee o pe oO N N N N oO N EN N o pe op ie NJ iw N o wo oO Note The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment 4 Am29F010 Known Good Die 1 13 98 SUPPLEMENT AMD ORDERING INFORMATION Standard Products AMD KGD products are available in several packages and operating ranges The order number Valid Combination is formed by a combination of the following Am29F010 90 DP Cc 1 Valid Combinations Am29F010 90 DPC 1 DPI 1 DPE 1 DGC 1 DGI 1 DGE 1 Am29F010 120 DTC 1 DTI 1 DTE 1 DWC 1 DWI 1 DWE 1 DIE REVISION This number refers to the specific AMD manufacturing process and product technology reflected in this document It is entered in the revision field of AMD standard product nomenclature TEMPERATURE RANGE C Commercial 0 C to 70 C Industrial 40 C to 85 C E Extended 55 C to 125 C PACKAGE TYPE AND MINIMUM ORDER QUANTITY DP Waffle Pack 245 die per 5 tray stack DG Gel Pak Die Tray 486 die per 6 tray stack DT Surftape Tape and Reel 2500 per 7 inch reel DW Gel Pak Wafer Tray sawn wafer on frame Call AMD sales office for minimum order quantity SPEED OPTION See Valid Combinations DEVICE NUMBER DESCRIPTION Am29F010 Kno
3. Observe all standard ESD handling procedures Am29F010 Known Good Die 7 AMD TERMS AND CONDITIONS OF SALE FOR AMD NON VOLATILE MEMORY DIE All transactions relating to AMD Products under this agreement shall be subject to AMD s standard terms and conditions of sale or any revisions thereof which revisions AMD reserves the right to make at any time and from time to time In the event of conflict between the provisions of AMD s standard terms and conditions of sale and this agreement the terms of this agreement shall be controlling AMD warrants articles of its manufacture against defective materials or workmanship for a period of ninety 90 days from date of shipment This warranty does not extend beyond AMD s customer and does not extend to die which has been affixed onto a board or substrate of any kind The liability of AMD under this warranty is limited at AMD s option solely to repair or to replacement with equivalent articles or to make an appropriate credit adjustment not to exceed the original sales price for articles returned to AMD provided that a The Buyer promptly notifies AMD in writing of each and every defect or nonconformity in any article for which Buyer wishes to make a warranty claim against AMD b Buyer obtains authorization from AMD to return the article c the article is returned to AMD transportation charges paid by AMD F O B AMD s fac tory and d AMD s examination of such article
4. D in writing for any claims which exceed AMD s warranty Buyer assumes all responsibility for successful die prep die attach and wire bonding pro cesses Due to the unprotected nature of the AMD Products which are the subject hereof AMD assumes no responsibility for environmental effects on die AMD products are not designed or authorized for use as components in life support appliances devices or systems where malfunction of a product can reason ably be expected to result in a personal injury Buyer s use of AMD products for use in life support applications is at Buyer s own risk and Buyer agrees to fully indem nify AMD for any damages resulting in such use or sale REVISION SUMMARY FOR AM29F010 KNOWN GOOD DIE Formatted to match current template Updated Distinc tive Characteristics and General Description sections using the current main data sheet AMD the AMD logo and combinations thereof are registered trademarks of Advanced Micro Devices Inc Product names used in this publication are for identification purposes only and may be trademarks of their respective companies 8 Am29F010 Known Good Die 1 13 98
5. dis closes to its satisfaction that such alleged defect or nonconformity actually exists and was not caused by negligence misuse improper installation accident or unauthorized repair or alteration by an entity other than AMD The aforementioned provisions do not extend the original warranty period of any article which has either been repaired or replaced by AMD Trademarks Copyright 1998 Advanced Micro Devices Inc All rights reserved SUPPLEMENT THIS WARRANTY IS EXPRESSED IN LIEU OF ALL OTHER WARRANTIES EXPRESSED OR IMPLIED INCLUDING THE IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE THE IMPLIED WARRANTY OF MERCHANTABILITY AND OF ALL OTHER OBLIGATIONS OR LIABILITIES ON AMD S PART AND IT NEITHER ASSUMES NOR AUTHO RIZES ANY OTHER PERSON TO ASSUME FOR AMD ANY OTHER LIABILITIES THE FOREGOING CONSTITUTES THE BUYERS SOLE AND EXCLU SIVE REMEDY FOR THE FURNISHING OF DEFEC TIVE OR NON CONFORMING ARTICLES AND AMD SHALL NOT IN ANY EVENT BE LIABLE FOR DAMAGES BY REASON OF FAILURE OF ANY PRODUCT TO FUNCTION PROPERLY OR FOR ANY SPECIAL INDIRECT CONSEQUENTIAL INCI DENTAL OR EXEMPLARY DAMAGES INCLUDING BUT NOT LIMITED TO LOSS OF PROFITS LOSS OF USE OR COST OF LABOR BY REASON OF THE FACT THAT SUCH ARTICLES SHALL HAVE BEEN DEFECTIVE OR NON CONFORMING Buyer agrees that it will make no warranty representa tions to its customers which exceed those given by AMD to Buyer unless and until Buyer shall agree to indemnify AM
6. ecifications at temperature Quality and reliability levels equivalent to standard packaged components Publication 21116 Rev B Amendment 0 Issue Date January 1998 AMDA GENERAL DESCRIPTION The Am29F010 in Known Good Die KGD form is a 1 Mbit 5 0 Volt only Flash memory AMD defines KGD as standard product in die form tested for functionality and speed AMD KGD products have the same reli ability and quality as AMD products in packaged form Am29F010 Features The Am29F010 device is organized as eight uniform sectors of 16 Kbytes each for flexible erase capability This device is designed to be programmed in system with the standard system 5 0 Volt Vcc supply A power supply providing 12 0 Volt Vpp is not required for program or erase operations The Am29F010 in KGD form offers access times of 90 ns and 120 ns allowing high speed microprocessors to operate without wait states To eliminate bus conten tion the device has separate chip enable CE write enable WE and output enable OE controls The device requires only a single 5 0 volt power sup ply for both read and write functions Internally gener ated and regulated voltages are provided for the program and erase operations The device is entirely command set compatible with the JEDEC single power supply Flash standard Com mands are written to the command register using stan dard microprocessor write timings Register contents serve as input to an internal
7. ls 4 42 mm x 4 80 mm Die Thickness 20 mils or 0 51 mm Bond Pad Size 4 47 mils x 4 47 mils 113 48 um x 113 48 um Pad Area Free of Passivation 19 98 mils 12 878 um Pads PEP Dieu jardidie dace datin che aR wands 30 Bond Pad Metalization Al Si Cu Die Backside 0 000000 eee No metal may be grounded optional Passivation 00 Nitride SOG Nitride DC OPERATING CONDITIONS Voc Supply Voltage 4 5 V to 5 5 V Junction Temperature Under Bias Tj max 130 C For Read only Ty max 140 C Operating Temperature Commercial 0 C to 70 C Industrial 40 C to 85 C Extended 55 C to 125 C 1 13 98 AMDA MANUFACTURING INFORMATION Manufacturing and Test Fab 14 Austin TX Manufacturing ID 98108AK Preparation for Shipment Penang Malaysia Fabrication Process CS19AFDS Die Revision 2 000 cece eee eee 1 SPECIAL HANDLING INSTRUCTIONS Processing Do not expose KGD products to ultraviolet light or process them at temperatures greater than 250 C Failure to adhere to these handling instructions will result in irreparable damage to the devices For best yield AMD recommends assembly in a Class 10K clean room with 30 to 60 relative humidity Storage Store at a maximum temperature of 30 C in a nitrogen purged cabinet or vacuum sealed bag
8. re sector pro tection feature disables both program and erase oper ations in any combination of the sectors of memory and is implemented using standard EPROM program mers The system can place the device into the standby mode Power consumption is greatly reduced in this mode ELECTRICAL SPECIFICATIONS Refer to the Am29F010 data sheet publication number 16736 for full electrical specifications for the Am29F010 in KGD form 1 13 98 SUPPLEMENT AMD PRODUCT SELECTOR GUIDE Family Part Number Am29F010 KGD Speed Option Vcc 5 0 V 10 Max Access Time tacc ns Max CE Access tce ns Max OE Access tog ns DIE PHOTOGRAPH Orientation relative to top left corner of Gel Pak _ gt lt a Orientation relative to leading edge of tape and reel DIE PAD LOCATIONS 76543 2 1 30 29 28 27 26 WUE AY a P ou AMD logo location TEERDE 24 10 11 12 13 14 15 1617 18 19 20 21 22 23 1 13 98 Am29F010 Known Good Die 3 AMDZ SUPPLEMENT PAD DESCRIPTION Pad Center mils Pad Center millimeters a O aoOlN I oa oa AJOJN oO a k EN ine wo n A
9. state machine that controls the erase and programming circuitry Write cycles also internally latch addresses and data needed for the pro gramming and erase operations Reading data out of the device is similar to reading from other Flash or EPROM devices Device programming occurs by executing the program command sequence This invokes the Embedded 2 Am29F010 Known Good Die SUPPLEMENT Program algorithm an internal algorithm that auto matically times the program pulse widths and verifies proper cell margin Device erasure occurs by executing the erase com mand sequence This invokes the Embedded Erase algorithm an internal algorithm that automatically pre programs the array if it is not already programmed be fore executing the erase operation During erase the device automatically times the erase pulse widths and verifies proper cell margin The host system can detect whether a program or erase operation is complete by reading the DQ7 Data Polling and DQ6 toggle status bits After a program or erase cycle has been completed the device is ready to read array data or accept another command The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors The device is erased when shipped from the factory The hardware data protection measures include a low Vcc detector automatically inhibits write operations during power transitions The hardwa
10. wn Good Die 1 Megabit 128 K x 8 Bit CMOS Flash Memory Die Revision 1 5 0 Volt only Program and Erase Valid Combinations Valid Combinations list configurations planned to be sup ported in volume for this device Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations 1 13 98 Am29F010 Known Good Die 5 AMDZ SUPPLEMENT PRODUCT TEST FLOW Figure 1 provides an overview of AMD s Known Good Die test flow For more detailed information refer to the Am29F010 product qualification database supplement for KGD AMD implements quality assurance proce dures throughout the product test flow In addition an off line quality monitoring program QMP further guar antees AMD quality standards are met on Known Good Die products These QA procedures also allow AMD to produce KGD products without requiring or imple menting burn in DC Parameters Functionality Programmability Erasability Data Retention Bake 24 hours at 250 C DC Parameters Functionality Programmability Erasability DC Parameters Wafer Sort 3 Functionality High Temperature Programmability Erasability Speed Incoming Inspection i i Wafer Saw Packaging for Shipment Die Separation 100 Visual Inspection Die Pack Figure 1 AMD KGD Product Test Flow 6 Am29F010 Known Good Die 1 13 98 SUPPLEMENT PHYSICAL SPECIFICATIONS Die dimensions 174 mils x 189 mi
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AMD Am29F010 Known Good Die handbook