TEXAS INSTRUMENTS SN54LV574A/SN74LV574A Manual
Contents
1. MECHANICAL DATA 0 25M Seating Plane 2 00 MAX PLASTIC SMALL OUTLINE PACKAGE 0 15 NOM t Gage Plane c3 0 10 A NOTES A All linear dimensions are in millimeters B This drawing is subject to change without notice C Body dimensions do not include mold flash or protrusion not to exceed 0 15 4040062 C 03 03 45 TEXAS INSTRUMENTS www ti com MECHANICAL DATA MTSS001C JANUARY 1995 REVISED FEBRUARY 1999 PW R PDSO G PLASTIC SMALL OUTLINE PACKAGE 14 PINS SHOWN 0 15 NOM i f casera a E Seating Plane tL EA 20 MAX 0 15 1j Z 0 0 0 05 PINS DIM A MAX A MIN 4040064 F 01 97 NOTES A Alllinear dimensions are in millimeters This drawing is subject to change without notice Body dimensions do not include mold flash or protrusion not to exceed 0 15 Falls within JEDEC MO 153 Dou 35 TEXAS INSTRUMENTS POST OFFICE BOX 655303 DALLAS TEXAS 75265 MECHANICAL DATA MPDSO006C FEBRUARY 1996 REVISE2. TI is not responsible or liable for such altered documentation Information of third parties may be subject to additional restrictions Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice TI is not responsible or liable for any such statements TI products are not authorized for use in safety critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury or death unless officers of the parties have executed an agreement specifically governing such use Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications and acknowledge and agree that they are solely responsible for all legal regulatory and safety related requirements concerning their products and any use of TI products in such safety critical applications notwithstanding any applications related information or support that may be provided by TI Further Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety critical applications TI products are neither designed nor intended for use in military aerospace applications or environments unless the TI products are specifically de
3. SNPB Level 1 240C UNLIM CROSTA R JUNI OR SN74LV574ANSR ACTIVE SO NS 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ANSRE4 ACTIVE SO NS 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ANSRG4 ACTIVE SO NS 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574APW ACTIVE TSSOP PW 20 70 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574APWE4 ACTIVE TSSOP PW 20 70 Green RoHS amp CUNIPDAU Level 1 260C UNLIM no Sb Br SN74LV574APWG4 ACTIVE TSSOP PW 20 70 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574APWR ACTIVE TSSOP PW 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574APWRE4 ACTIVE TSSOP PW 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574APWRG4 ACTIVE TSSOP PW 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574APWT ACTIVE TSSOP PW 20 250 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574APWTE4 ACTIVE TSSOP PW 20 250 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br Addendum Page 1 K Texas PACKAGE OPTION ADDENDUM INSTRUMENTS www ti com 4 Jun 2007 Orderable Device Status Package Package Pins Package Eco Plan Lead Ball Finish MSL Peak Temp Type Drawing Qty SN74LV574APWTG4 ACTIVE TSSOP PW 20 250 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ARGYR ACTIVE QFN RGY 20 1
4. V 100 100 TA Operating free air temperature 40 NOTE 5 All unused inputs of the device must be held at Vcc or GND to ensure proper device operation Refer to the TI application report Implications of Slow or Floating CMOS Inputs literature number SCBAO004 ns V 2 5 0 55 5 5 Voc 2 3 V to 2 7 V 200 2 8 0 5 electrical characteristics over recommended operating free air temperature range unless otherwise noted SN54LV574A SN74LV574A PARAMETER TEST CONDITIONS Ve MIN TYP MIN TYP MAX 2 2 3 8 gt x 2Vto5 5V Vcc 0 1 Vcc 0 1 99 co 3 av 35 3 3 ojo Ayo C o 2 4 wssveaw 9essv loc Vi Vcc or GND lo 20 5 5V 20 PRODUCT PREVIEW information concerns products in the formative or design phase of development Characteristic data and other e specifications are design goals Texas Instruments reserves the right to Jin TEXAS INSTRUMENTS POST OFFICE BOX 655303 DALLAS TEXAS 75265 A SN54LV574A SN74LV574A OCTAL EDGE TRIGGERED D TYPE FLIP FLOPS WITH 3 STATE OUTPUTS SCLS4121l APRIL 1998 REVISED APRIL 2005 timing requirements over recommended operating free air temperature range Vcc 2 5 V 0 2 V unless otherwise noted see Figure 1 Ta 25 C SN54LV574A SN74LV574A iius MN MAX MN max ww wax ONT timing requirements over recommended operating free air temperature range Vcc 3 3 V 0 3 V unless otherwise not
5. control techniques are used to the extent TI deems necessary to support this warranty Except where mandated by government requirements testing of all parameters of each product is not necessarily performed TI assumes no liability for applications assistance or customer product design Customers are responsible for their products and applications using Tl components To minimize the risks associated with customer products and applications customers should provide adequate design and operating safeguards TI does not warrant or represent that any license either express or implied is granted under any TI patent right copyright mask work right or other TI intellectual property right relating to any combination machine or process in which TI products or services are used Information published by TI regarding third party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof Use of such information may require a license from a third party under the patents or other intellectual property of the third party or a license from TI under the patents or other intellectual property of TI Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties conditions limitations and notices Reproduction of this information with alteration is an unfair and deceptive business practice
6. is limited to 5 5 V maximum The input and output negative voltage ratings may be exceeded if the input and output current ratings are observed 2 3 The package thermal impedance is calculated in accordance with JESD 51 7 4 The package thermal impedance is calculated in accordance with JESD 51 5 35 TEXAS INSTRUMENTS POST OFFICE BOX 655303 DALLAS TEXAS 75265 3 SN54LV574A SN74LV574A OCTAL EDGE TRIGGERED D TYPE FLIP FLOPS WITH 3 STATE OUTPUTS SCLS4121 APRIL 1998 REVISED APRIL 2005 recommended operating conditions see Note 5 SN54LV574A SN74LV574A MIN MAX V UN V o oa Vcc Supply voltage 2 55 EHI k C1 Voc 2 3 V to 2 7 V Vcc x 0 7 Voc x 0 7 V VIH High level input voltage Voc 3Vt03 6V Vec x07 Veco Voc 4 5 V to 5 5 V Voc x 0 7 Voc x 0 7 eo oa o oa Voc 2 3 V to 2 7 V Vcc x 0 3 Voc x 0 3 vozy v V Low level i I IL ow level input voltage Voc 3V103 6V Voc x03 Voc x 0 3 Voc x 0 3 Voc 4 5 V to 5 5 V Voc x 0 3 Vi Inputvoltage 0 55 e c1 o C1 255 V 0 Vo Output voltage 3 state EC c1 oa o C1 5 5 NCC OH igh level output current Vec 28V t0 3 6 V 9 a 50 2 200 20 Voc 4 5 V to 5 5 V L D L D Vcc 2V 0 Voc 2 3 V to 2 7 V 2 loL Low level output current Voc 8V 103 6 V IT A A A A o En o Vcc 4 5 V to 5 5 V x e eo At Av Input transition rise or fall rate Voc 3 V to 3 6
7. of thermal vias the thermal pad can be attached directly to the appropriate copper plane shown in the electrical schematic for the device or alternatively can be attached to a special heatsink structure designed into the PCB This design optimizes the heat transfer from the integrated circuit IC For information on the Quad Flatpack No Lead QFN package and its advantages refer to Application Report Quad Flatpack No Lead Logic Packages Texas Instruments Literature No SCBAO17 This document is available at www ti com The exposed thermal pad dimensions for this package are shown in the following illustration Exposed Thermal Pad Bottom View NOTE All linear dimensions are in millimeters Exposed Thermal Pad Dimensions 4206353 4 C 09 07 LAND PATTERN RGY R PQFP N20 Example Stencil Design 0 125mm Stencil Thickness Example Board Layout 14X0 5 we DUUO pr 4X0 75 NOTES A GOW N I Oo 20x0 23 67 solder coverage by printed area on center thermal pad Non Solder Mask N Example Via Layout Design Defined Pad S may vary depending on constraints Note D F Example Solder Mask Opening E 4 X Example Pad Geometry 4x0 725 Note C 4208122 4 C 09 06 All linear dimensions are in millimeters This drawing is subject to change without notice Publication IPC 7351 is recommended for alter
8. www ti com Iprf Video amp Imaging www ti com video Wireless www ti com wireless Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2008 Texas Instruments Incorporated
9. 000 Green RoHS amp CU NIPDAU Level 2 260C 1 YEAR no Sb Br SN74LV574ARGYRG4 ACTIVE QFN RGY 20 1000 Green RoHS amp CU NIPDAU Level 2 260C 1 YEAR no Sb Br SN74LV574AZQNR ACTIVE BGA MI ZQN 20 1000 Green RoHS amp SNAGCU Level 1 260C UNLIM CROSTA no Sb Br R JUNI OR The marketing status values are defined as follows ACTIVE Product device recommended for new designs LIFEBUY TI has announced that the device will be discontinued and a lifetime buy period is in effect NRND Not recommended for new designs Device is in production to support existing customers but TI does not recommend using this part in a new design PREVIEW Device has been announced but is not in production Samples may or may not be available OBSOLETE TI has discontinued the production of the device 2 Eco Plan The planned eco friendly classification Pb Free ROHS Pb Free RoHS Exempt or Green RoHS amp no Sb Br please check http www ti com productcontent for the latest availability information and additional product content details TBD The Pb Free Green conversion plan has not been defined Pb Free RoHS TI s terms Lead Free or Pb Free mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances including the requirement that lead not exceed 0 196 by weight in homogeneous materials Where designed to be soldered at high temperatures TI Pb Free products are suitable for use in specified
10. D AUGUST 2000 DGV R PDSO G PLASTIC SMALL OUTLINE 24 PINS SHOWN FRI Semen 4 je i Y Seating Plane Y 1 20 MAX 0 15 1 Z 0 08 kij 0 05 PINS DIM A MAX A MIN 4073251 E 08 00 NOTES A All linear dimensions are in millimeters This drawing is subject to change without notice Body dimensions do not include mold flash or protrusion not to exceed 0 15 per side Falls within JEDEC 24 48 Pins MO 153 14 16 20 56 Pins MO 194 oom 5 TEXAS INSTRUMENTS POST OFFICE BOX 655303 DALLAS TEXAS 75265 MECHANICAL DATA DW R PDSO G20 PLASTIC SMALL OUTLINE PACKAGE 10 0 020 0 51 0 012 0 31 10 010 0 25 Pin 1 0 050 1 27 Index Area i 2 65 Max 7 0 004 0 10 Gauge Plane A Seating Plane 0 010 0 25 4040000 4 F 06 2004 NOTES A All linear dimensions are in inches millimeters B This drawing is subject to change without notice C Body dimensions do not include m
11. MALL OUTLINE 28 PINS SHOWN 08 Gage Plane 4 0 Y Seating Plane 2 00 MAX 0 05 MIN E 20 10 PINS 4040065 E 12 01 NOTES A Alllinear dimensions are in millimeters This drawing is subject to change without notice Body dimensions do not include mold flash or protrusion not to exceed 0 15 Falls within JEDEC MO 150 Dou 35 TEXAS INSTRUMENTS POST OFFICE BOX 655303 DALLAS TEXAS 75265 MECHANICAL DATA GQN R PBGA N20 PLASTIC BALL GRID ARRAY Ball A1 Corner Ball A1 Identifier Bottom View Index Area ing Plane 4200704 F 06 2007 NOTES A All linear dimensions are in millimeters Dimensioning and tolerancing per ASME Y14 5M 1994 B This drawing is subject to change without notice C Falls within JEDEC MO 285 variation BC 2 D This package is tin lead SnPb Refer to the 20 ZQN package drawing 4204492 for lead free 43 TEXAS INSTRUMENTS www ti com NS R PDSO G 14 PINS SHOWN
12. SN54LV574A SN74LV574A OCTAL EDGE TRIGGERED D TYPE FLIP FLOPS WITH 3 STATE OUTPUTS SCLS412 APRIL 1998 REVISED APRIL 2005 2 V to 5 5 V Vcc Operation loff Supports Partial Power Down Mode Max tog of 10 ns at 5 V Operation Typical Vo p Output Ground Bounce Latch Up Performance Exceeds 250 mA Per 0 8 V at Voc 3 3 V TA 25 C JESD 17 Typical Voyy Output Voy Undershoot ESD Protection Exceeds JESD 22 22 3 Vat Vcc 3 3 V Ta 25 C 2000 V Human Body Model A114 A 200 V Machine Model A115 A DOR Support Mixed Mode Voltage Operation on 1000 V Charged Device Model C101 All Ports SN54LV574A JOR W PACKAGE SN74LV574A RGY PACKAGE SN54LV574A FK PACKAGE SN74LV574A DB DGV DW NS TOP VIEW TOP VIEW OR PW PACKAGE Oo TOP VIEW w S nooWw o 1 3 Aa 19 3D 4 s i 20 18 4D 5 17L 3Q 17 5D 6 16 4Q 16 6D 7 15 5Q 15 7D P 14L 6Q 144 143 a co L Ey 10 2 3 4 5 6 7 8 9 description ordering information ORDERING INFORMATION 4 o fe 0 C to 85 C Tube of 70 SN74LV574APW tssop pw Reelof 2000 SN74LV574APWR LV574A Reelof250 SN74LV574APWT t Package drawings standard packing quantities thermal data symbolization and PCB design guidelines are available at www ti com sc package Please be aware that an important notice concerning availability standard warranty and use in critical applicat
13. UM INSTRUMENTS www ti com 4 Jun 2007 PACKAGING INFORMATION Orderable Device Status Package Package Pins Package Eco Plan Lead Ball Finish MSL Peak Temp Type Drawing Qty SN74LV574ADBR ACTIVE SSOP DB 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADBRE4 ACTIVE SSOP DB 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADBRG4 ACTIVE SSOP DB 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADGVR ACTIVE TVSOP DGV 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADGVRE4 ACTIVE TVSOP DGV 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADGVRG4 ACTIVE TVSOP DGV 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADW ACTIVE SOIC DW 20 25 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADWE4 ACTIVE SOIC DW 20 25 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADWG4 ACTIVE SOIC DW 20 25 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADWR ACTIVE SOIC DW 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADWRE4 ACTIVE SOIC DW 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574ADWRG4 ACTIVE SOIC DW 20 2000 Green RoHS amp CU NIPDAU Level 1 260C UNLIM no Sb Br SN74LV574AGQNR NRND BGA MI GQN 20 1000 TBD
14. ed see Figure 1 TA 25 C SN54LV574A SN74LV574A T a ee a timing requirements over recommended operating free air temperature range Vcc 5 V 0 5 V unless otherwise noted see Figure 1 MET MN MAX MN WAX MN wax ON switching characteristics over recommended operating free air temperature range Vcc 22 5 V 02 V unless otherwise noted see Figure On products compliant to MIL PRF 38535 this parameter is not production tested PRODUCT PREVIEW information concerns products in the formative or design phase of development Characteristic data and other specifications are design goals Texas Instruments reserves the right to change or discontinue these products without notice EXAS ISSTIEXAS ere POST OFFICE BOX 655303 DALLAS TEXAS 75265 5 SN54LV574A SN74LV574A OCTAL EDGE TRIGGERED D TYPE FLIP FLOPS WITH 3 STATE OUTPUTS SCLS4121 APRIL 1998 REVISED APRIL 2005 switching characteristics over recommended operating free air temperature range Vcc 3 3 V 0 3 V unless otherwise noted see Figure 1 o n LOAD az 25 C SN54LV574A SN74LV574A PARAMETER INPUT OUTPUT CAPACITANCE On products compliant to MIL PRF 38535 this parameter is not production tested switching characteristics over recommended operating free air temperature range Vcc 5 V 0 5 V unless otherwise noted see Figure 1 FROM TO LOAD DAL 25 C SN54LV574A SN74LV574A fmax On products complian
15. eed the total purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis Addendum Page 2 X3 Texas PACKAGE MATERIALS INFORMATION INSTRUMENTS www ti com 11 Mar 2008 TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS Reel Diameter Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness y Overall width of the carrier tape Y Pitch between successive cavity centers t Reel Width W1 QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes User Direction of Feed VL Pocket Quadrants All dimensions are nominal Device Package Package Pins SPQ Reel Reel A0 mm BO mm KO mm P1 Ww Pin1 Type Drawing Diameter Width mm mm Quadrant mm W1 mm SN74LV574ADBR SSOP DB 20 2000 330 0 16 4 8 2 7 5 2 5 12 0 16 0 Q1 SN74LV574ADGVR TVSOP DGV 20 2000 330 0 12 4 7 0 5 6 1 6 8 0 12 0 Q1 SN74LV574ADWR SOIC DW 20 2000 330 0 24 4 10 8 13 0 2 7 12 0 24 0 Q1 SN74LV574AGQNR BGA MI GQN 20 1000 330 0 12 4 3 3 4 3 1 5 8 0 12 0 Q1 ROSTA R JUNI OR SN74LV574APWR TSSOP PW 20 2000 330 0 16 4 6 95 7 1 1 6 8 0 16 0 Q1 SN74LV574ARGYR QFN RGY 20 1000 180 0 12 4 3 8 4 8 1 6 8 0 12 0 Q1 SN74LV574AZQNR BGA MI ZQN 20 1000 330 0 12 4 3 3 4 3 1 5 8 0 12 0 Q1 ROSTA R JUNI OR Pack Materia
16. ions of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet UNLESS OTHERWISE NOTED this document contains PRODUCTION Copyright 2005 Texas Instruments Incorporated DATA information current as of publication date Products conform to Jj specifications per the terms of Texas Instruments standard warranty Production processing does not necessarily include testing of all EXAS INSTRUMENTS POST OFFICE BOX 655303 DALLAS TEXAS 75265 1 SN54LV574A SN74LV574A OCTAL EDGE TRIGGERED D TYPE FLIP FLOPS WITH 3 STATE OUTPUTS SCLS4121 APRIL 1998 REVISED APRIL 2005 description ordering information continued The LV5744A devices are octal edge triggered D type flip flops designed for 2 V to 5 5 V Voc operation These devices feature 3 state outputs designed specifically for driving highly capacitive or relatively low impedance loads The devices are particularly suitable for implementing buffer registers I O ports bidirectional bus drivers and working registers On the positive transition of the clock CLK input the Q outputs are set to the logic levels set up at the data D inputs A buffered output enable OE input can be used to place the eight outputs in either a normal logic state high or low logic levels or high impedance state In the high impedance state the outputs neither load nor drive the bus lines significantly The high impedance state and increased drive pro
17. lead free processes Pb Free RoHS Exempt This component has a RoHS exemption for either 1 lead based flip chip solder bumps used between the die and package or 2 lead based die adhesive used between the die and leadframe The component is otherwise considered Pb Free RoHS compatible as defined above Green RoHS amp no Sb Br TI defines Green to mean Pb Free RoHS compatible and free of Bromine Br and Antimony Sb based flame retardants Br or Sb do not exceed 0 196 by weight in homogeneous material 3 MSL Peak Temp The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications and peak solder temperature Important Information and Disclaimer The information provided on this page represents TI s knowledge and belief as of the date that it is provided TI bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information Efforts are underway to better integrate information from third parties TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals TI and TI suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release In no event shall TI s liability arising out of such information exc
18. ls Page 1 X3 Texas PACKAGE MATERIALS INFORMATION INSTRUMENTS www ti com 11 Mar 2008 TAPE AND REEL BOX DIMENSIONS w All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length mm Width mm Height mm SN74LV574ADBR SSOP DB 20 2000 346 0 346 0 33 0 SN74LV574ADGVR TVSOP DGV 20 2000 346 0 346 0 29 0 SN74LV574ADWR SOIC DW 20 2000 346 0 346 0 41 0 SN74LV574AGQNR BGA MICROSTAR GQN 20 1000 346 0 346 0 29 0 JUNIOR SN74LV574APWR TSSOP PW 20 2000 346 0 346 0 33 0 SN74LV574ARGYR QFN RGY 20 1000 190 5 212 7 31 8 SN74LV574AZQNR BGA MICROSTAR ZQN 20 1000 346 0 346 0 29 0 JUNIOR Pack Materials Page 2 MECHANICAL DATA ZQN R PBGA N20 PLASTIC BALL GRID ARRAY Ball A1 Corner Ball A1 Identifier Bottom View Index Area ing Plane 4204492 C 06 2007 NOTES A All linear dimensions are in millimeters Dimensioning and tolerancing per ASME Y14 5M 1994 B This drawing is subject to change without notice C Falls within JEDEC MO 285 variation BC 2 D This package is lead free Refer to the 20 GQN package drawing 4200704 for tin lead SnPb 35 TEXAS INSTRUMENTS www ti com MECHANICAL DATA MSSO002E JANUARY 1995 REVISED DECEMBER 2001 DB R PDSO G PLASTIC S
19. nate designs This package is designed to be soldered to a thermal pad on the board Refer to Application Note Quad Flat Pack Packages Texas Instruments Literature No SCBAO17 SLUA271 and also the Product Data Sheets for specific thermal information via requirements and recommended board layout These documents are available at www ti com http www ti com Laser cutting apertures with trapezoidal walls and also rounding corners will offer better paste release Customers should Refer to IPC 7525 for stencil design considerations contact their board assembly site for stencil design recommendations Customers should contact their board fabrication site for minimum solder mask web tolerances between signal pads 35 TEXAS INSTRUMENTS www ti com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries Tl reserve the right to make corrections modifications enhancements improvements and other changes to its products and services at any time and to discontinue any product or service without notice Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete All products are sold subject to Tl s terms and conditions of sale supplied at the time of order acknowledgment TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with Tl s standard warranty Testing and other quality
20. old flash or protrusion not to exceed 0 006 0 15 D Falls within JEDEC MS 013 variation AC 35 TEXAS INSTRUMENTS www ti com MECHANICAL DATA RGY R PQFP N20 PLASTIC QUAD FLATPACK Pin 1 Index Area Top and Bottom 0 20 Nominal Lead Frame MISSI Y Seating Plane NM 3 ul T I 0 00 Seating Height Exposed Thermal Pad A Bottom View 4203539 4 G 04 2005 NOTES A All linear dimensions are in millimeters Dimensioning and tolerancing per ASME Y14 5M 1994 B This drawing is subject to change without notice C QFN Quad Flatpack No Lead package configuration A The package thermal pad must be soldered to the board for thermal and mechanical performance A Pin 1 identifiers are located on both top and bottom of the package and within the zone indicated The Pin 1 identifiers are either a molded marked or metal feature F Package complies to JEDEC MO 241 variation BC i X9 Texas INSTRUMENTS www ti com X Texas THERMAL PAD MECHANICAL DATA INSTRUMENTS RGY R PQFP N20 THERMAL INFORMATION This package incorporates an exposed thermal pad that is designed to be attached directly to an external heatsink The thermal pad must be soldered directly to the printed circuit board PCB After soldering the PCB can be used as a heatsink In addition through the use
21. see Note 1 Output voltage range applied in the high or low state Vo see Notes 1 and 2 Input clamp current lik Vj lt 0 Output clamp current lox Vo 0 Continuous output current lo Vo 0 to Voc Continuous current through Vcc or GND Package thermal impedance 0 see Note 3 see Note 3 see Note 3 see Note 3 Storage temperature range Tstg see Note 3 see Note 3 see Note 4 mr KT 0 5Vto7V paa diaa dpud dk Fiere dolente Def 0 5 V to7 V TERT 0 5V to 7 V X 0 5 V to Voc 0 5 V ee eee et rere ee rae ere EE 20 mA EET 50 mA UR OShiaddbeakeubrieudevilibasaedekenadaesuuesibieda 35 mA UH 70 mA DB package sseeseeseeeeesee 70 C W DGV package 2 222 Ru tae regan 92 C W DW package cece eee eee eee eee 58 C W GON package 2 40ieakes Diane ieee oh beeen 78 C W NS package cece eee eee eee 60 C W PW package 2 edem aa bebe e Hares des 83 C W RGY package 0 ccc eee eens 37 C W T Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied Exposure to absolute maximum rated conditions for extended periods may affect device reliability NOTES 1 This value
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23. t 50 Voc 50 Voc T Control 50 Vcc 50 Voc 0v tPLH 4 gt tPHL ipPzL P ipiz Vo Output V H cc pos J 50 Voc 50 Voc etl 1 Sox ed Aasna utpu 1 p VoL at Vcc VoL see Note B tPHL 4 gt iPLH tpzH gt 4 gt M ipuz Output NOH ee Fe VOH Out of Phase Waveform 2 Vou 0 3 V Output K 50 Vec 50 Vec S1 at GND J 50 Vec iH a5 gt VOL see Note B E VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS INVERTING AND NONINVERTING OUTPUTS PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES LOW AND HIGH LEVEL ENABLING NOTES A Cy includes probe and jig capacitance B Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control C All input pulses are supplied by generators having the following characteristics PRR lt 1 MHz Zo 50 9 tp 3 ns tf lt 3 ns D The outputs are measured one at a time with one input transition per measurement E tpi z and tpy7 are the same as tgis F tpz and tpzg are the same as ten G tpHL and tp p are the same as tpg H All parameters and waveforms are not applicable to all devices Figure 1 Load Circuit and Voltage Waveforms 35 TEXAS INSTRUMENTS POST OFFICE BOX 655303 DALLAS TEXAS 75265 7 X3 Texas PACKAGE OPTION ADDEND
24. t to MIL PRF 38535 this parameter is not production tested noise characteristics Vcc 3 3 V C 50 pF TA 25 C see Note 6 PARAMETER MIN TYP MAX VOL P Quiet output maximum dynamic VoL VOL V Quiet output minimum dynamic VoL VoH V Quiet output minimum dynamic VOH VIH D High level dynamic input voltage VIL D Low level dynamic input voltage NOTE 6 Characteristics are for surface mount packages only operating characteristics TA 25 C PARAMETER PRODUCT PREVIEW information concerns products in the formative or design phase of development Characteristic data and other specifications are design goals Texas Instruments reserves the right to xin TEXAS INSTRUMENTS 6 POST OFFICE BOX 655303 DALLAS TEXAS 75265 SN54LV574A SN74LV574A OCTAL EDGE TRIGGERED D TYPE FLIP FLOPS WITH 3 STATE OUTPUTS SCLS4121l APRIL 1998 REVISED APRIL 2005 PARAMETER MEASUREMENT INFORMATION o Vcc 1 O Open From Output Test From Output T RL21kO 17 p Under Test Point Under Test GND pLHPHL ue er L tPLZ tPzL see Note A T LOAD CIRCUIT FOR TOTEM POLE OUTPUTS tw see Note A T tpHz tpZH Open Drain LOAD CIRCUIT FOR 3 STATE AND OPEN DRAIN OUTPUTS r th Vcc c m NN NIE Vs o o Input 50 Vec 50 Vec Data Input 50 Vcc 50 Vcc OV 0v VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS PULSE DURATION SETUP AND HOLD TIMES V V cc Output o o cc Inpu
25. vide the capability to drive bus lines without need for interface or pullup components OE does not affect the internal operations of the flip flops Old data can be retained or new data can be entered while the outputs are in the high impedance state To ensure the high impedance state during power up or power down OE should be tied to Voc through a pullup resistor the minimum value of the resistor is determined by the current sinking capability of the driver These devices are fully specified for partial power down applications using lor The log circuitry disables the outputs preventing damaging current backflow through the devices when they are powered down GQN PACKAGE TOP VIEW terminal assignments 1234 moou gt FUNCTION TABLE each flip flop Fue co a 435 TEXAS INSTRUMENTS 2 POST OFFICE BOX 655303 DALLAS TEXAS 75265 logic diagram positive logic SN54LV574A SN74LV574A OCTAL EDGE TRIGGERED D TYPE FLIP FLOPS WITH 3 STATE OUTPUTS SCLS4121 APRIL 1998 REVISED APRIL 2005 1 i D 11 CLK D gt C1 19 iq 1D 1D v v To Seven Other Channels Pin numbers shown are for the DB DGV DW FK J NS PW RGY and W packages absolute maximum ratings over operating free air temperature range unless otherwise noted t Supply voltage range Vcc Input voltage range V see Note 1 Voltage range applied to any output in the high impedance or power off state Vo
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TEXAS INSTRUMENTS SN54LV574A/SN74LV574A Manual