Home

TEXAS INSTRUMENTS TSB82AA2 handbook

1. information or support that may be provided by TI Further Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety critical applications TI products are neither designed nor intended for use in military aerospace applications or environments unless the TI products are specifically designated by TI as military grade or enhanced plastic Only products designated by TI as military grade meet military specifications Buyers acknowledge and agree that any such use of TI products which TI has not designated as military grade is Solely at the Buyer s risk and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO TS 16949 requirements Buyers acknowledge and agree that if they use any non designated products in automotive applications TI will not be responsible for any failure to meet such requirements Following are URLs where you can obtain information on other Texas Instruments products and application solutions Products Applications Amplifiers amplifier ti com Audio www ti com audio Data Converters dataconverter ti com Automotive www ti com automotive DSP dsp ti com Broadband www ti com broadband Interface interface ti
2. orders and should verify that such information is current and complete All products are sold subject to Tl s terms and conditions of sale supplied at the time of order acknowledgment TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI s standard warranty Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty Except where mandated by government requirements testing of all parameters of each product is not necessarily performed TI assumes no liability for applications assistance or customer product design Customers are responsible for their products and applications using Tl components To minimize the risks associated with customer products and applications customers should provide adequate design and operating safeguards TI does not warrant or represent that any license either express or implied is granted under any TI patent right copyright mask work right or other TI intellectual property right relating to any combination machine or process in which TI products or services are used Information published by TI regarding third party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof Use of such information may require a license from a third party under the patents or other intellectual property of the third party or a license from T
3. 07 PACKAGING INFORMATION Orderable Device Status Package Package Pins Package Eco Plan Lead Ball Finish MSL Peak Temp Type Drawing Qty TSB82AA2GGW ACTIVE BGA MI GGW 176 126 TBD SNPB Level 3 220C 168 HR CROSTA R TSB82AA2IPGE ACTIVE LQFP PGE 144 60 TBD CU NIPDAU Level 1 235C UNLIM TSB82AA2PGE ACTIVE LQFP PGE 144 60 Green RoHS amp CU NIPDAU Level 3 260C 168 HR no Sb Br TSB82AA2PGEG4 ACTIVE LQFP PGE 144 60 Green RoHS amp CUNIPDAU Level 3 260C 168 HR no Sb Br TSB82AA2ZGW ACTIVE BGA MI ZGW 176 126 Green RoHS amp SNAGCU Level 3 260C 168 HR CROSTA no Sb Br R The marketing status values are defined as follows ACTIVE Product device recommended for new designs LIFEBUY TI has announced that the device will be discontinued and a lifetime buy period is in effect NRND Not recommended for new designs Device is in production to support existing customers but TI does not recommend using this part in a new design PREVIEW Device has been announced but is not in production Samples may or may not be available OBSOLETE TI has discontinued the production of the device 2 Eco Plan The planned eco friendly classification Pb Free ROHS Pb Free RoHS Exempt or Green RoHS amp no Sb Br please check http Awww ti com productcontent for the latest availability information and additional product content details TBD The Pb Free Green conversion plan has not been defined Pb Free RoHS TI s terms L
4. GGW DESCRIPTION The TSB82AA2 OHCI Lynx is a discrete 1394b link layer device which has been designed to meet the demanding requirements of today s 1394 bus designs The TSB82AA2 device is capable of exceptional 800M bits s performance thus providing the throughput and bandwidth to move data efficiently and quickly between the PCI and 1394 buses The TSB82AA2 device also provides outstanding ultra low power operation and intelligent power management capabilities The device provides the IEEE 1394 link function and is compatible with 100M bits s 200M bits s 400M bits s and 800M bits s serial bus data rates The TSB82AA2 improved throughput and increased bandwidth make it ideal for today s high end PCs and open the door for the development of S800 RAID and SAN based peripherals The TSB82AA2 OHCI Lynx operates as the interface between a 33 MHz 64 bit or 33 MHz 32 bit PCI local bus and a compatible 1394b PHY layer device such as the TSB81BA3 device that is capable of supporting serial data rates at 98 304M 196 608M 393 216M or 786 432M bits s referred to as S100 S200 S400 or S800 speeds respectively When acting as a PCI bus master the TSB82AA2 device is capable of multiple cacheline bursts of data which can transfer at 264M bytes s for 64 bit transfers or 132M bytes s for 32 bit transfers after connecting to the memory controller A Please be aware that an important notice concerning availability standard warranty and use in criti
5. I under the patents or other intellectual property of TI Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties conditions limitations and notices Reproduction of this information with alteration is an unfair and deceptive business practice TI is not responsible or liable for such altered documentation Information of third parties may be subject to additional restrictions Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice TI is not responsible or liable for any such statements TI products are not authorized for use in safety critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury or death unless officers of the parties have executed an agreement specifically governing such use Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications and acknowledge and agree that they are solely responsible for all legal regulatory and safety related requirements concerning their products and any use of TI products in such safety critical applications notwithstanding any applications related
6. O O OO0O0000000000000 vD 1 CE C AT D C B A 0 9 Bottom View 1 40 MAX c D UUUUUUUUUUUUUUUUJ Seating Plane Yi y 92 610 0 08 1 Le 012 0 35 4205348 2 A 08 03 NOTES A All linear dimensions are in millimeters B This drawing is subject to change without notice C MicroStar BGA configuration D This package is lead free MicroStar BGA is a trademark of Texas Instruments 435 TEXAS INSTRUMENTS www ti com MECHANICAL DATA MTQF017A OCTOBER 1994 REVISED DECEMBER 1996 PGE S PQFP G144 PLASTIC QUAD FLATPACK 0 13 NOM 17 50 TYP gt Y cose Planet Y 20 20 so Ki 19 80 0 25 SQ 21 80 0 75 Q45 gt I LUE EEUU T Seating Plane 1 60 MAX 0 08 4040147 C 10 96 NOTES A Alllinear dimensions are in millimeters B This drawing is subject to change without notice C Falls within JEDEC MS 026 5 TEXAS INSTRUMENTS POST OFFICE BOX 655303 9 DALLAS TEXAS 75265 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries TI reserve the right to make corrections modifications enhancements improvements and other changes to its products and services at any time and to discontinue any product or service without notice Customers should obtain the latest relevant information before placing
7. cal applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet PRODUCTION DATA information is current as of publication date Copyright 2006 Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty Production processing does not necessarily include testing of all parameters TSB82AA2 X3 Texas INSTRUMENTS www ti com SLLA221 JUNE 2006 Due to the high throughput potential of the TSB82AA2 device it possible to encounter large PCI and legacy 1394 bus latencies which can cause the 1394 data to be overrun To overcome this potential problem the TSB82AA2 implements deep transmit and receive FIFOs to buffer the 1394 data thus preventing possible problems due to bus latency This also ensures that the device can transmit and receive sustained maximum size isochronous or asynchronous data payloads at S800 The TSB82AA2 device implements other performance enhancements to improve overall performance of the device such as a highly tuned physical data path for enhanced SBP 2 performance physical post writing buffers multiple isochronous contexts and advanced internal arbitration The TSB82AA2 device also implements hardware enhancements to better support digital video DV and MPEG data stream reception and transmission These enhancements are enabled through the isochronous receive digital video enhancements registe
8. com Digital Control www ti com digitalcontrol Logic logic ti com Military www ti com military Power Mgmt power ti com Optical Networking www ti com opticalnetwork Microcontrollers microcontroller ti com Security www ti com security RFID www ti rfid com Telephony www ti com telephony Low Power www ti com lpw Video amp Imaging www ti com video Wireless Wireless www ti com wireless Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2007 Texas Instruments Incorporated
9. ead Free or Pb Free mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances including the requirement that lead not exceed 0 196 by weight in homogeneous materials Where designed to be soldered at high temperatures TI Pb Free products are suitable for use in specified lead free processes Pb Free RoHS Exempt This component has a RoHS exemption for either 1 lead based flip chip solder bumps used between the die and package or 2 lead based die adhesive used between the die and leadframe The component is otherwise considered Pb Free RoHS compatible as defined above Green RoHS amp no Sb Br TI defines Green to mean Pb Free RoHS compatible and free of Bromine Br and Antimony Sb based flame retardants Br or Sb do not exceed 0 196 by weight in homogeneous material 3 MSL Peak Temp The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications and peak solder temperature Important Information and Disclaimer The information provided on this page represents TI s knowledge and belief as of the date that it is provided TI bases its knowledge and belief on information provided by third parties and makes no representation or warranty as to the accuracy of such information Efforts are underway to better integrate information from third parties TI has taken and continues to take reasonable steps to provide representative and accurate information but ma
10. i vis TEXAS TSB82AA2 INSTRUMENTS www ti com SLLA221 JUNE 2006 1394b OHCI Lynx Controller FEATURES e PCI burst transfers and deep FIFOs to e Single 3 3 V supply 1 8 V internal core tolerate large host latency voltage with regulator Transmit FIFO 5K asynchronous e 3 3 V and 5 V PCI signaling environments Transmit FIFO 2K isochronous e Serial bus data rates of 100M bits s 200M Receive FIFO 2K asynchronous bits s 400M bits s and 800M bits s Receive FIFO 2K isochronous e Physical write posting of up to three e DO D1 D2 and D3 power states and PME outstanding transactions events per the PC Bus Power Management e Serial ROM or boot ROM interface supports Interface Specification 2 wire serial EEPROM devices e Programmable asynchronous transmit e 33 MHz 64 bit and 33 MHz 32 bit selectable threshold PCI interface e Isochronous receive dual buffer mode e Multifunction terminal MFUNC terminal 1 e Out of order pipelining for asynchronous PCI CLKRUN protocol per the PCI Mobile transmit requests Design Guide e Register access fail interrupt when the PHY General purpose I O SYSCLK is not active CYCLEIN CYCLEOUT for external cycle e initial bandwidth available and initial timer control for customized channels available registers synchronization e Digital video and audio performance enhancements e Fabricated in advanced low power CMOS process e Packaged in 144 terminal LQFP PGE or 176 ball MicroStar BGA
11. nced CMOS process and the implementation of an internal 1 8 V core which is supplied by an improved integrated 3 3 V to 1 8 V voltage regulator The TSB82AA2 device implements a next generation voltage regulator which is more efficient than its predecessors thus providing an overall reduction in the device s operational power requirements especially when operating in D3 4 using auxiliary power In fact the TSB82AA2 device fully supports DO D1 D2 and D3 4 4 power states as specified in the PC 2001 Design Guide requirements and the PC Power Management Specification PME wake event support is subject to operating system support and implementation As required by the 1394 Open Host Controller Interface Specification OHCI and IEEE Std 13942 2000 internal control registers are memory mapped and nonprefetchable The PCI configuration header is accessed through configuration cycles as specified by the PCI Local Bus Specification and provides plug and play PnP compatibility Furthermore the TSB82AA2 device is fully compliant with the latest PC Local Bus Specification PCI Bus Power Management Interface Specification IEEE Draft Std 1394b IEEE Std 1394a 2000 and 1394 Open Host Controller Interface Specification NOTE This product is for high volume PC applications only For a complete datasheet or more information contact support ti com 2 Submit Documentation Feedback K Texas PACKAGE OPTION ADDENDUM INSTRUMENTS www ti com 24 Sep 20
12. r at TI extension offset A80h These enhancements include automatic time stamp insertion for transmitted DV and MPEG formatted streams and common isochronous packet CIP header stripping for received DV streams The CIP format is defined by the IEC 61883 1 1998 specification The enhancements to the isochronous data contexts are implemented as hardware support for the synchronization timestamp for both DV and audio video CIP formats The TSB82AA2 device supports modification of the synchronization timestamp field to ensure that the value inserted via software is not stale that is less than the current cycle timer when the packet is transmitted The TSB82AA2 performance and enhanced throughput make it an excellent choice for today s 1394 PC market however the portable mobile and even today s desktop PCs power management schemes continue to require devices to use less and less power and Texas Instrument s 1394 OHCI Lynx product line has continued to raise the bar by providing the lowest power 1394 link layers in the industry The TSB82AA2 device represents the next evolution of Texas Instruments commitment to meet the challenge of power sensitive applications The TSB82AA2 device has ultra low operational power requirements and intelligent power management capabilities that allow it to autonomously conserve power based on the device usage One of the key elements for reducing the TSB82AA2 operational power requirements is Texas Instrument s adva
13. y not have conducted destructive testing or chemical analysis on incoming materials and chemicals TI and TI suppliers consider certain information to be proprietary and thus CAS numbers and other limited information may not be available for release In no event shall TI s liability arising out of such information exceed the total purchase price of the TI part s at issue in this document sold by TI to Customer on an annual basis Addendum Page 1 MECHANICAL DATA GGW S PBGA N176 PLASTIC BALL GRID ARRAY 12 80 TYP OOOOOOOO0OOOOOOO O OOOOOOOQOOOOOO O OO OOOOOQOOOOO OO OO0OOO OOO OOO OOO OOOO OOOO OQ O OO9 OOOO OOOO OOO OOO OOQOO OOO OO OOOOOQOOOOO OO O OOOOOOQOOOOOO O OO0O0000000000000 vD 1 CE C AT D C B A 0 9 Bottom View 1 40 MAX u Seating Plane y 92 E 0 08 O 0 45 0 12 0 45 0 35 4145255 2 E 07 03 NOTES A All linear dimensions are in millimeters B This drawing is subject to change without notice C MicroStar BGA configuration MicroStar BGA is a trademark of Texas Instruments 435 TEXAS INSTRUMENTS www ti com MECHANICAL DATA ZGW S PBGA N176 PLASTIC BALL GRID ARRAY 12 80 TYP OOOOOOOO0OOOOOOO O OOOOOOOQOOOOOO O OO OOOOOQOOOOO OO OO0OOO OOO OOO OOO OOOO OOOO OQ O OO9 OOOO OOOO OOO OOO OOQOO OOO OO OOOOOQOOOOO OO O OOOOOOQOOOOO

TEXAS INSTRUMENTS TSB82AA2 handbook

Contents

Download Pdf Manuals

Related Search

Related Contents