ALLEGRO SANKEN - RGB Multi Chip LED Modules
Contents
1. Red LEDs Green LEDs Blue LEDs 100 100 100 T T 10 10 10 3 0 4 0 5 0 6 0 120 130 140 15 0 160 5 0 6 0 7 0 8 0 V V V V V V Luminous Flux versus Forward Current Red LEDs Green LEDs Blue LEDs 2 LEDs in Series 4 LEDs in Series 2 LEDs in Series 20 60 0 10 0 18 16 50 0 80 14 F 40 0 127 6 0 10 F 30 0 8r e 40 6 200 4r 20 al 10 0 0 1 1 1 1 1 0 0 1 1 1 1 1 0 0 1 1 1 1 1 0 10 20 30 40 50 60 0 10 20 30 40 50 60 0 10 20 30 40 50 60 I mA I mA I mA Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com SEPM Series RGB Multi Chip LED Modules Dominant Wavelength verses Forward Current Ta 25 C Red LEDs Green LEDs Blue LEDs 634 534 632 532 pie 630 530 470 628 528 468 626 526 466 E 624 E 524 E 464 c 622 522 462 S 620 P 520 P 460 618 518 458 616 516 456 614 514 454 612 512 452. Features and Benefits equivalent to CCFLs Low thermal resistance Rojc 6 C W Superior directivity 5 23 mm x 13 7 mm case footprint and low 2 5 mm overall package height Silver plated leadframe LED array of 8 RGB chips Package 16 pin 1 27 mm pitch surface mount High efficiency 50 1m W with all LEDs illuminated High optical output 25 Im with all LEDs illuminated SEPM Series RGB Multi Chip LED Modules Description The SEPM series of LEDs provides a range of high powered ALGalnP red Ap 616 nm and InGaN green 523 nm and blue 461 nm LEDs that can be used in general lighting applications amusement and gaming equipment and for backlighting TFT displays Each module combines 8 LED chips in 4 separate channels Modular designallowsthe SEPM devicesto be easily assembled into string arrays by simply connecting the modules in series The devices also provide superior color balance throughout the display because of the high density of LEDs that can be achieved This also minimizes the distance that power and control lines must run between LEDs and from the LEDs to the control electronics The white thermoplastic case is an innovative Sanken original design with exceptional heat dissipation properties The white resincompoundis especially formulated forsuperiorreflectance and transmittance of the generated light Enhanced thermal dissipation is achieved through the incorporated heatsink on the b
3. Part Number LEDs calor A An poene SU Packing 16 15 14 13 12 11 10 9 Red 2 LEDs in series O O O O SEP8MA4001 8 Green 4 LEDs 2 in series k c sc oP RS 1000 pieces per reel Blue 2 LEDs in series 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 Red 2 LEDs in parallel SEP8MAB8001 8 Green 4 LEDs in parallel xk x Xy 1000 pieces per reel Blue 2 LEDs in paralel C B R e G RP Bi ef Absolute Maximum Ratings Characteristic Symbol Notes Rating Units Forward Current Continuous lf Per element 40 mA Forward Current Pulsed lip Frequency f 1 kHz pulse width ty 100 us 100 mA Reverse Voltage Vn 5 V Isolation Voltage Vis Measured from device pins to heatsink with DC voltage applied 60 V Operating Temperature Topr 40 to 85 C Storage Temperature Tstg 40 to 90 C Maximum Allowable Forward Current versus Duty Cycle Ta 25 C tw lt 100 us 120 100 Maximum Allowable Forward Current mA Duty Cycle on time 10 100 All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature T4 of 25 C unless otherwise stated SanKen Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com Maximum Allowable Forward Current mA Maximum Allowable For
4. Because reliability can be affected adversely by improper storage environments and handling methods please observe the following Cautions for Storage Ensure that storage conditions are within 5 C to 40 C and relative humidity 3096 avoid storage locations that experience extreme changes in temperature or humidity Avoid locations where dust or harmful gases are present and avoid direct sunlight Reinspect for rust on leads and solderability of products that have been stored for a long time Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods protect the products from power surges from the testing device shorts between adjacent products and shorts to the heatsink Precautions During Use Because the light generated inside the LED must be emitted efficiently out of the module a resin with high light transmittance is used Therefore additives that are commonly used in semiconductor devices to improve the heat resistance or moisture resistance such as silica glass cannot be added to the resin Consequently the ability of the resin to withstand heat is usually low and the following precautions must be observed Never apply an external force stress or excess vibration to resin or terminals when at high temperature e Take particular care about heat dissipation when designing the application If dissipation is not adequate the LEDs can reach high temper
5. Fax 1 508 853 7895 Allegro MicroSystems Inc 14 Hughes Street Suite B105 Irvine California 92618 U S A Tel 1 949 460 2003 Fax 1 949 460 7837
6. product Power Supply Bypass Capacitor Resistor Resistor MXperLED I ZD VR 7 to 8V v Protective Circuit Protective Circuit Reference Circuit Using Capacitor Reference Circuit Using Zener Diode Application and operation examples described in this document are quoted for the sole purpose of reference only for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights intellectual property rights or any other rights of Sanken or any third party which may result from its use When using the products herein the applicability and suitability of such products for an intended purpose or object shall be reviewed at the user s responsibility Although Sanken undertakes to enhance the quality and reliability of its products the occurrence of failure and defect of semiconductor prod ucts at a certain rate is inevitable Users of Sanken products are requested to take at their own risk preventative measures including safety design of the equipment or systems against any possible injury death fires or damages to the society due to device failure or malfunction Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or appa ratus home appliances office equipment telecommunication equipment measuring equipment etc Before placing an order the user s
7. to swell Therefore attention must be paid to the following Examine the moisture resistant packing before opening If the indicator color blue of the desiccant such as silica gel has disappeared the product must be prebaked as described below After the product packing is opened and staged for assembly soldering should be carried out as soon as practicable During handling ambient conditions should be 5 C to 30 C with relative humidity 7096 After 120 hours of exposure prebake is recommended before soldering bake out at 60 5 C for more than 10 hours After soldering no mechanical force or excessive vibration should be applied to the product until the product has cooled down to normal room temperature Quick cooling must be avoided When soldering the products please be sure to minimize the working time within the following limits Soldering Iron Temperature Time C s 350410 3 once only Reflow soldering can be performed a maximum of 2 times with preheat conditions of 150 C to 180 C at the device surface for 60 to 120 s and soldering conditions less than 40 s at more than 220 C with a peak temperature less than 260 C using the following recommended profile Temperature of Device Package Surface C Reflow Soldering Profile Peak 260 C Max Pre heat 60 to 120 sec 0 50 100 150 200 250 300 Soldering Time s Allegro Mi
8. 2 610 510 450 10 100 10 100 10 100 I mA I mA l mA Chromaticity verses Forward Current Red LEDs Green LEDs Blue LEDs 0 310 0 74 0 044 0 308 0 72 10 mA 0 042 mu 0 040 dou 0 306 0 70 0 038 gt Ma gt gt 0 304 0 68 0 036 50 mA 50 MA 0 034 0 302 0 66 50 mA 0 032 0 300 0 64 0 030 0 688 0 690 0 692 0 694 0 696 0 698 0 10 0 12 0 14 0 16 0 18 0 20 0 22 0 140 0 142 0 144 0 146 0 148 0 150 X x x Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com SEPM Series Vr V Relative Intensity 96 Ap nm RGB Multi Chip LED Modules Dominant Wavelength verses Case Temperature Red LEDs 35 45 55 65 75 85 95 Case Temperature Tc C p nm TA 25 C p 20 mA Green LEDs 530 520 25 35 45 55 65 75 85 95 Case Temperature Tc C 455 Blue LEDs 25 35 45 55 65 75 85 95 Forward Voltage versus Case Temperature Red LEDs 3 00 25 35 45 55 65 75 85 95 Case Temperature Tc C Vr V 2 LEDs in Series I 20 mA Green LEDs 7 5 oo 6 5 gt 6 0 F 5 5F 5 0 L L L L L L 25 35 45 55 65 75 85 95 Case Temperature Tc C Vr V 70 68 66 64 62 60 58 56 54 52 50 Luminous Flux versus Case Temperature Red LEDs SH gt NWHKATDMDND WOO OoOoOooo0o0oo0o0000 T N o 35 45 55 65 75 85 95 Ca
9. 4 Sanken Electric Shanghai Co Ltd Room 3202 Maxdo Centre Xingyi Road 8 Changning District Shanghai China Tel 86 2 1 5208 1177 Fax 86 2 1 5208 1757 Taiwan Sanken Electric Co Ltd Room 1801 18th Floor 88 Jung Shiau East Road Sec 2 Taipei 100 Taiwan R O C Tel 886 2 2356 8161 Fax 886 2 2356 8261 India Saket Devices Pvt Ltd Office No 13 First Floor Bandal Dhankude Plaza Near PMT Depot Paud Road Kothrud Pune 411 038 India Tel 91 20 5621 2340 91 20 2528 5449 Fax 91 20 2528 5459 Japan Sanken Electric Co Ltd Overseas Sales Headquarters Metropolitan Plaza Building 1 11 1 Nishi Ikebukuro Toshima ku Tokyo 171 0021 Japan Tel 81 3 3986 6164 Fax 81 3 3986 8637 Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com Korea Sanken Electric Korea Co Ltd Mirae Asset Life Building 6F 168 Kongduk dong Mapo ku Seoul 121 705 Korea Tel 82 2 714 3700 Fax 82 2 3272 2145 Singapore Sanken Electric Singapore Pte Ltd 150 Beach Road 214 03 The Gateway West Singapore 189720 Tel 65 6291 4755 Fax 65 6297 1744 Europe Sanken Power Systems UK Limited Pencoed Technology Park Pencoed Bridgend CF35 5HY United Kingdom Tel 44 1656 869 100 Fax 44 1656 869 162 North America United States Allegro MicroSystems Inc 115 Northeast Cutoff Worcester Massachusetts 01606 U S A Tel 1 508 853 5000
10. ED Modules Directivity Ta 25 C Il 20 mA Viewing Anglet 201 2 Short Axis Direction 100 100 75 o 75 QO 4 o 50 50 204557121 na 25 25 0 DSO SS SHS SOS HSS SS SO HS eoopPPS ePSPORPSS c 100 2 0 75 Z QO o sS 5 50 204 0 116 g D Zo Wo o ra 0 100 75 a 75 QO 2 60 204 131 o 90 a 25 25 0 0 FESPHPP PSS SHS SHORTS FPLPPPE PSS LHS SSSRSS A Short Axis BEBE 1847 is the angular displacement from the indicated device O axis to 50 of peak intensity on one side of that axis 2Viewing Angle 291 2 is the included angle between Module Top View f FORTE 04 and 04 2 for the indicated axis Relative Luminescence Spectrum Blue at 100 TA 25 C I 20 mA 100 Blue 80 Red 60 40 Green 20 0 380 430 480 530 580 630 680 730 780 Emission Frequency nm Relative Luminescence 96 Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com SEPM Series d Im RGB Multi Chip LED Modules Forward Current versus Forward Voltage 2 LEDs in Series
11. atures with resulting color change luminous flux reduction and shortening of product lifetime When the device is connected to an external radiator please coat the heatsink area with thermal conduction material such as thermal conductive bond or thermal conductive grease Extra attention should be paid to the sealing resin of the product which is rubber like silicon resin The surface of sealing resin is slightly sticky surface tack Therefore touching the emitting area or exposing it to unclean conditions may cause dust or smudges to adhere to it and possibly penetrate the resin This could cause deterioration of product characteristics when contacted by materials such as epoxy resin The silver plating of the leadframe may discolor if the product comes into contact with material containing sulfides or if it is exposed to an atmosphere containing sulfide gas The emitting area of the LEDs contains fine gold wires Touching this area without care may add excess stress on the internal gold wires and may result in disconnection of the internal wires Soldering The product is in a surface mount package The product should not be mounted on warped direction of the PCB When the product is mounted by means of solder reflow and the resin is unusually damp solder dipping may cause interfacial SanKen www allegromicro com defoliation This occurs when a drastic temperature change causes moisture in the resin to evaporate and
12. croSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 Between the first and second reflow sessions follow the guidelines in the Cautions for Storage section above Electrostatic Discharge When handling the products operator must be grounded Grounded wrist straps worn should have at least 1 MO of SEPM Series RGB Multi Chip LED Modules resistance to ground to prevent shock hazard aluminum foil Workbenches where the products are handled should be Exposure to any overvoltage exceeding the Absolute Maximum grounded and be provided with conductive table and floor mats Rating of the products may cause damage to or possibly result in When using measuring equipment such as a curve tracer the destruction of the products Buyer shall take absolutely secured equipment should be grounded countermeasures against static electricity and surge when When soldering the products the head of soldering irons or the handling the products solder bath must be grounded in other to prevent leak voltages Typical anti static and anti surge reference circuits are shown generated by them from being applied to the products below The circuits shown are for reference only and the buyer The products should always be stored and transported in our must make a sufficient experimental verification of the static and shipping containers or conductive containers or be wrapped in surge levels when employing the
13. ification 29 4 1 0 Taping reel dimensions 1 4 330 2 le 2541 0 100 1 Embossed taping outline dimensions 1 1 Pull direction LEDs mounting part Top cover tape COON A AAA A AR Reel Lead No LEDs Min 320 mm Reel Lead Min 160 mm 1000 pcs reel Reel Lead Min 400 mm Detailed drawing 1 1 Accmulative tolerance per 10 pitches shall be 0 2 mm Adhesion strength shall be 0 1 0 7 N when the cover tape and the carrier tape are torn off at the angle of 10 degrees P N manufacturing date code number and quantitiy shall be indicated on moist proof package Embossed carrier tape Tolerance 0 2 Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com SEPM Series RGB Multi Chip LED Modules WARNING These devices are designed to be operated at lethal voltages and energy levels Circuit designs that embody these components must conform with applicable safety requirements Precautions must be taken to prevent accidental contact with power line potentials Do not connect grounded test equipment The use of an isolation transformer is recommended during circuit development and breadboarding This product series emits high light output Do NOT look directly into the light emitting area Direct exposure to the light over an extended time period may harm eyes
14. k 4 t N d eS Au wires Resin to LEDs case case Section A A Section B B i PT27x7 8 89 pe Indicator AXR1 8 13 3 Terminal core material Cu Package labeling codes exact appearance at manufacturer discretion Terminal treatment Ag plating 1st line type SEP A BB C D EE Heatsink core material Cu Where Ais the quantity of LEDs in the module Heatsink treatment Ag plating BB is the color combination code C is the number of channels D is the package code and EE is the device subtype code Dimensions in millimeters 2ndline lot YMDD Where Y is the last digit of the year of manufacture M is the month 7 to 9 O N D DD is the date Device is lead Pb free 3rd line quantity of units in the container Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com SEPM Series RGB Multi Chip LED Modules Solder Pad Layout wo M x eo wo 8 M 2 x ceo Recommended Solder Pad Pattern 16 pads Pin 1 Indicator E 2 2 Le el Led Le In case the device is installed to external radiator please coat heatsink area with thermal conduction material such as thermal conductive bond or thermal conductive grease Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com SEPM Series RGB Multi Chip LED Modules Embossed Tape and Reel Spec
15. ottom of the package The heatsink can be mated directly to an external radiator through the PCB for superior heat conduction allowing dense placement of modules The leadframe is plated with silver providing a highly reflective surface for the bottom and sides of the emitting area The terminals and heatsink are also silver plated Typical Application 8 SEPM modules 8 LEDs each ey Ey 1 iy uy ves t Q A a A l Not to scale Ve L1 5to20V 10H D1 T T I 2 2 uF 50V Za Za Pg Pp Ay Ia Tg Fy p P DEDEDE PEDD A8500 LED Driver 5V SEP8Mx The SEPM devices can be mounted in tight SEP8M x arrays on a single PCB substrate for ease of SEP8Mx manufacture and to provide a dense uniform appearance when illuminated SEP8Mx The application shown here uses eight SEP8Mx SEP8Mx LED modules each populated by 1 eight LEDs connected in series Different peer eM combinations of LEDs can be placed in the SEP8Mx modules SEP8Mx O00 00010 DOO000 10 DO0000 00 DO 0000 10 10000001 DO 000000 D000 0001 Donmnngng Esssss33 TUUTUUUU TUUTUUUT TUUTUUUT TUUUUTUU TUUTUTUU TUUTUTUU TJUUTUTUU UUUUTUUT 48101 001 Rev 2 SEPM Series Selection Guide RGB Multi Chip LED Modules
16. se Temperature Tc C SanKen Relative Intensity Green LEDs 25 35 45 55 65 75 85 95 Case Temperature Tc C Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com Relative Intensity Case Temperature Tc C Blue LEDs 25 35 45 55 65 75 85 95 Case Temperature Tc C Blue LEDs 25 35 45 55 65 75 85 95 Case Temperature Tc C SEPM Series RGB Multi Chip LED Modules Typical Applications Diagrams Schematics are shown for the SEP8MA8001 with all parallel circuits this device supports the greatest variety of possible circuit configurations End to end layout www allegromicro com G2 Side by side layout Matrix layout G1 B R G2 G2 Allegro MicroSystems Inc 8 115 Northeast Cutoff Box 15036 L Worcester Massachusetts 01615 0036 508 853 5000 L SEPM Series RGB Multi Chip LED Modules Package Outline Drawing Sealing Resin Terminal Transparent LED element C47 Heatsink A Heatsin
17. ward Current versus Ambient Temperature Without heatsink N K DS 0 0 20 40 60 8 100 Ambient Temperature T4 C SEPM Series RGB Multi Chip LED Modules Operating Characteristics Characteristic Symbol Conditions Min Typ Max Units Electrical Red 3 4 4 4 5 4 V Each subcircuit 2 chips in series SEP8MA4001 G 54 6 4 7 8 V reen y 20 mA Ta 25 C Blue 5 2 6 2 7 6 V Forward Voltage per LED channel Vi Red 1 7 2 2 2 7 V Each subcircuit 1 chip in parallel SEP8MA8001 G 2 7 3 2 3 9 V reen y 20 mA Ta 25 C Blue 2 6 3 1 3 8 V Reverse Current per LED channel IR VR 5V 10 UA Optical Red 3 5 5 0 Im Luminous Flux all channels o Green l 20 mA LED 12 0 17 0 Im Blue 1 5 2 2 Im Red 615 625 635 nm Dominant Wavelength p Green lp 20 mA Ta 25 C 518 524 530 nm Blue 455 460 465 nm Thermal Roc Junction to heat sink 6 C W Thermal Resistance Rosa Junction to ambient 120 C W Chromaticity Ta 25 C I 20 mA Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com SEPM Series Relative Intensity Red LEDs Green LEDs Blue LEDs Long Axis Direction RGB Multi Chip L
18. written consent to the specifications is requested When considering the use of Sanken products in the applications where higher reliability is required transportation equipment and its control systems traffic signal control systems or equipment fire crime alarm systems various safety devices etc please contact your nearest Sanken sales representative to discuss and obtain written confirmation of your specifications The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required aerospace equipment nuclear power control systems life support systems etc is strictly prohibited Anti radioactive ray design is not considered for the products listed herein If there is any discrepancy between English and Japanese versions of this datasheet the Japanese version should take precedence over the English one Please accept in advance that the content of this datasheet is subject to change without notice for the purpose of such as improvement of the product Copyright O 2007 2008 Allegro MicroSystems Inc Allegro MicroSystems Inc 115 Northeast Cutoff Box 15036 Worcester Massachusetts 01615 0036 508 853 5000 www allegromicro com SEPM Series RGB Multi Chip LED Modules Worldwide Contacts Asia Pacific China Sanken Electric Hong Kong Co Ltd Suite 1026 Ocean Centre Canton Road Tsimshatsui Kowloon Hong Kong Tel 852 2735 5262 Fax 852 2735 549
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