PHILIPS BGF802-20 CDMA800 power module handbook
Contents
1. f4 882 MHz fo 883 MHz Fig 7 Two tone intermodulation distortion as function of load power typical values MBL768 58 ACPR400 kHz dBc 60 f 882 MHz Fig 8 GSM EDGE ACPR at 400 kHz as a function of load power typical values MBL769 f 882 MHz Fig 9 GSM EDGE rms EVM as a function of load power typical values 2003 Feb 24 Philips Semiconductors Product specification CDMA800 power module BGF802 20 MBL770 MBL771 12 31 0 EVMM S214 521 S411 dB S411 dB 10 29 6 S14 8 27 12 6 25 18 4 23 24 2 0 21 30 0 2 4 6 8 10 12 750 850 950 1050 PL AV W f MHz f 882 MHZ Fig 10 GSM EDGE peak EVM as a function of load power typical values Fig 11 s parameters as a function of frequency 2003 Feb 24 6 Philips Semiconductors CDMA800 power module MOUNTING RECOMMENDATIONS General LDMOST base station modules are manufactured with the dies directly mounted onto a copper flange The matching and bias circuit components are mounted on a printed circuit board PCB which is also soldered onto the copper flange The dies and the PCB2. DISCRETE SEMICONDUCTORS DATA SHEET BGF802 20 CDMA800 power module Product specification 2003 Feb 24 Supersedes data of 2002 Nov 12 Philips PHILIPS Semiconductors DH l LI Philips Semiconductors Product specification CDMAS800 power module BGF802 20 FEATURES e Typical CDMA IS95 performance at a supply voltage of 28 V Output power 3 W Gain 30 dB Efficiency 18 ACPR lt 53 dBc at 750 kHz and BW 30 kHz ACPR lt 69 dBc at 1 98 MHz and BW 30 kHz Low distortion to CDMA signals Excellent 2 tone performance Low die temperatures using copper flange Integrated temperature compensated bias 50 Q input output system Flat gain over frequency range APPLICATIONS e Base station RF power amplifiers in the 869 to 894 MHz frequency range e CDMA IS95 CDMA2000 multi carrier applications e Macrocell driver stage and Microcell final stage DESCRIPTION 25 W LDMOS power amplifier module for base station amplifier applications in the 869 to 894 MHz range QUICK REFERENCE DATA Typical RF performance at Tmp 25 C f MODE OF OPERATION MHz PL Gp W dB PINNING SOT365C PIN DESCRIPTION 1 RF input 2 3 Vs RF output Flange ground MBL257 Top view Fig 1 Simplified outline ACPR EVM n dBc CW 869 to 894 29 48 IS95 CDMA 869 to 894 30 18 GSM EDGE 869 to 894 26 2 5 30 16 65 4 0
3. The leads are for electrical connection only and should not be used to support the module at any time in the assembly process A soldering iron may be used up to a temperature of 250 C for a maximum of 10 seconds Avoid contact between the soldering iron and the plastic cap Electrical connections The main ground path of all modules is via the flange It is therefore important that the flange is well grounded and that return paths are kept as short as possible An incorrectly grounded flange can result in a loss of output power or in oscillation The RF input and output of the module are designed for 50 Q connections Incoming inspection When incoming inspection is performed use a properly designed test fixture to avoid excessive mechanical stress and to ensure optimal RF performance Philips can deliver dedicated test fixtures on request Philips Semiconductors Product specification CDMA800 power module BGF802 20 APPLICATION INFORMATION TEMPERATURE COMPENSATED GATE BIAS 50 Q Vs 509 input MBL781 output Fig 12 Test circuit List of components see Figs 12 and 13 CATALOGUE COMPONENT DESCRIPTION VALUE NUMBER C1 C3 multilayer X7R ceramic chip capacitor 100 nF 50 V tantalum SMD capacitor 10 uF 35 V electrolytic capacitor 100 uF 35 V grade 4S2 Ferroxcube bead 4330 030 36300 metal film resistor 2322 195 13109 stripline note
4. 1 Note 1 The striplines are on a double copper clad printed circuit board RO5880 with e 2 2 and thickness 0 79 mm 2003 Feb 24 8 Philips Semiconductors Product specification CDMA800 power module BGF802 20 Oo000 0000 ooooo0o0000000000 O O ecocoo ecco O00000 O00000 O MBL780 Dimensions in mm Fig 13 Printed circuit board and component layout 2003 Feb 24 9 Philips Semiconductors Product specification CDMA800 power module BGF802 20 PACKAGE OUTLINE Plastic rectangular single ended flat package flange mounted 2 mounting holes 3 in line leads SOT365C me 0 10 20 mm paa tarea EN scale DIMENSIONS mm are the original dimensions UNIT A c e e1 9 5 0 3 mm g0 0 2 OUTLINE REFERENCES EUROPEAN VERSION JEDEC JEITA PROJECTION SOT365C E3 02 11 13 ISSUE DATE 2003 Feb 24 10 Philips Semiconductors Product specification CDMA800 power module BGF802 20 DATA SHEET STATUS DATA SHEET STATUS PRODUCT STATUS 2 3 Development DEFINITION Objective data This data sheet contains data from the objective specification for product development Philips Semiconductors reserves the right
5. are encapsulated in a plastic cap and pins extending from the module provide a means of electrical connection This construction allows the module to withstand a limited amount of flexing although bending of the module is to be avoided as much as possible Mechanical stress can occur if the bottom surface of the module and the surface of the amplifier casing external heatsink are not mutually flat This therefore should be a consideration when mounting the module in the amplifier Another cause of mechanical stress can arise from thermal mismatch after soldering of the pins Precautions should be taken during soldering and efforts made to ensure a good thermal contact between the flange and the external heatsink External heatsink amplifier casing The module should always be mounted on a heatsink with a low thermal resistance to keep the module temperature as low as possible The mounting area of the heatsink should be flat and free from burrs and loose particles We recommend a flatness for the mounting area of between 50 um concave and 50 um convex The 50 um concave value is to ensure optimal thermal behaviour while the 50 um convex value is intended to limit mechanical stress due to bending In order to ensure optimal thermal behaviour the use of thermal compound is recommended when mounting the module onto the amplifier external heatsink The following recommended thermal compounds have a thermal conductivity of gt 0 5 W m
6. 4 Notes 1 IS95 CDMA Pilot paging sync and traffic codes 8 13 2 ACPR 750 kHz at 30 kHz resolution bandwidth 3 ACPR 1 98 MHz at 30 kHz resolution bandwidth 4 ACPR 400 kHz at 30 kHz resolution bandwidth 2003 Feb 24 Philips Semiconductors Product specification CDMA800 power module BGF802 20 LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 60134 SYMBOL PARAMETER MIN MAX UNIT Vs DC supply voltage input drive power load power storage temperature Tmb operating mounting base temperature CHARACTERISTICS Tmb 25 C Vg 28 V PL 3 0 W f 869 to 894 MHz Zs Z 50 Q unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Iba quiescent current pin 2 Pp 0 mW 245 280 320 mA load power at 1 dB gain compression power gain gain flatness over frequency range gain flatness over power band phase linearity over frequency range PL 30 mW up to 3 W delay flatness Gos out of band gain VSWRin input VSWR small signal Pp 0 dBm f lt 869 MHz f gt 894 MHz Ho second harmonic H3 third harmonic stability ruggedness VSWR lt 3 1 through all phases Vs2 25 to 28 V VSWR 10 1 through all phases PL 5 W all spurious outputs more than 60 dB below desired signal IS95 CDMA P 3 W average n efficiency ACPR 750 kHz spectral regrowth ACPR 1 98 MHz measur
7. K e WPS II silicone free from Austerlitz Electronics e Comp Trans from KF e 340 from Dow Corning e Trans Heat from E Friis Mikkelsen The use of thermal pads instead of thermal compound is not recommended as the pads may not maintain a uniform flatness over a period of time Mounting PREPARATION Ensure that the surface finishes are free from burrs dirt and grease 2003 Feb 24 Product specification BGF802 20 CAUTION During the following procedures ESD precautions should be taken to protect the device from electrostatic damage PROCEDURE 1 Apply athin evenly spread layer of thermal compound to the module flange bottom surface Excessive use of thermal compound may result in increased thermal resistance and possible bending of the of the flange Too little thermal compound will result in an increase in thermal resistance 2 Take care that there is some space between the cap and the PCB Bring the module into contact with the external heatsink casing ensuring that there is sufficient space for excessive thermal compound to escape 3 Carefully align the module with the heatsink casing mounting holes and secure with two 3 mm bolts and two flat washers Initially tighten the bolts to finger tight approximately 0 05 Nm Using a torque wrench tighten each bolt in alternating steps to a final torque of 0 4 Nm 4 After the module is secured to the casing the module leads may be soldered to the PCB
8. ed in 30 kHz RBW Note 1 Gpiis small signal in band gain 2003 Feb 24 Philips Semiconductors CDMA800 power module MBL762 30 4 G p dB Gp 30 30 n 29 6 20 29 2 10 28 8 0 0 2 4 6 8 PL avy W f 882 MHz Fig 2 1S95 power gain and efficiency as functions of load power typical values Product specification BGF802 20 MBL763 8 PL av W f 882 MHz Fig 3 ACPR at 750 kHz as a function of output power typical values MBL764 60 ACPR1 98 MHz dBc 64 PL av W f 882 MHz Fig 4 ACPR at 1 98 MHZ as a function of output power typical values MBL765 30 4 60 Gp 7 dB Gp n 30 50 29 6 40 29 2 30 28 8 20 28 4 10 28 0 0 5 10 15 20 25 30 PL W f 882 MHz Fig 5 CW power gain and efficiency as functions of load power typical values 2003 Feb 24 Philips Semiconductors CDMA800 power module MBL766 30 4 48 Gp dB Gp n 30 36 29 6 24 29 2 12 28 8 0 0 4 8 12 16 PL av W fy 882 MHz fo 883 MHz Fig 6 Two tone power gain and efficiency as functions of load power typical values Product specification BGF802 20 MBL767
9. imum Rating System IEC 60134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Applications that are described herein for any of these products are for illustrative purposes only Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification 2003 Feb 24 DISCLAIMERS Life support applications These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits standard cells and or software described or contained herein in order to improve design and or performance When the product is in full production status Production relevant changes will be communica
10. ted via a Customer Product Process Change Notification CPCN Philips Semiconductors assumes no responsibility or liability for the use of any of these products conveys no licence or title under any patent copyright or mask work right to these products and makes no representations or warranties that these products are free from patent copyright or mask work right infringement unless otherwise specified Philips Semiconductors a worldwide company Contact information For additional information please visit http www semiconductors philips com Fax 31 40 27 24825 For sales offices addresses send e mail to sales addresses www semiconductors philips com Koninklijke Philips Electronics N V 2003 SCA75 All rights are reserved Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner The information presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Printed in The Netherlands 613524 04 pp12 Date of release 2003 Feb 24 Document order number 9397 750 10698 Lott make things better i eee S5 PHILIPS
11. to change the specification in any manner without notice Preliminary data Qualification This data sheet contains data from the preliminary specification Supplementary data will be published at a later date Philips Semiconductors reserves the right to change the specification without notice in order to improve the design and supply the best possible product This data sheet contains data from the product specification Philips Semiconductors reserves the right to make changes at any time in order to improve the design manufacturing and supply Relevant changes will be communicated via a Customer Product Process Change Notification Product data Production CPCN Notes 1 Please consult the most recently issued data sheet before initiating or completing a design 2 The product status of the device s described in this data sheet may have changed since this data sheet was published The latest information is available on the Internet at URL http Awww semiconductors philips com 3 For data sheets describing multiple type numbers the highest level product status determines the data sheet status DEFINITIONS Short form specification The data in a short form specification is extracted from a full data sheet with the same type number and title For detailed information see the relevant data sheet or data handbook Limiting values definition Limiting values given are in accordance with the Absolute Max
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PHILIPS BGF802 20 CDMA800 power module handbook