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BenQ SXG 75 Level 1 - 3 Service Manual

1. Exchange BtoB connector Connector Board to Board Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 297 C340 E commerce order name BOARD TO BOARD 30 POL Soldering temperature 360 C TIP Temp IRIS Diagnose Code 32100 Keys Main No Function 32200 Keys Main Reduced Functionality 36000 Keys Illumination Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 55 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 20 Battery Connector Problems Fault Symptoms Customer GRT Mobile does not switch on No connection to GRT Battery connector problems not oka Sst caused by customer SCRAP has to be send separately to WSC check for twisted or bent contacts check for dry joints Back to customer without repair Watch for oxidation and damaged pads of the battery connector not Check the status of the battery connector visually Use the resistor test Exchange function of a multimeter okay Continue with a m battery to check connection higher repair level between spring contacts and soldering contacts The value must be 00 connector Connector BATTERY Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwar
2. If Yes activate the boxes in front of xfs and mapping 1 1 1 1 1 1 4 Read out phone type Variant gt gt Appears in the window above Remarks The decision about a Siemens authorised SW Update depends only on the Master Table The user has no chance to influence the decision Xfs and mapping can be activated on demand GRT will erase in any case the customer data even if the action is cancelled lf the user wants to download an other variant then the automatically identified one he has simply to select an other variant from the list Afterwards he has to start the SW Update Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 34 of 60 Company Confidential 2006 BenQ BenQ mobile Be 10 JPICS Java based Product Information Controlling System 3 JPICS PICS internet portal Microsoft Internet Explorer bereitgestellt von BenQ mobile Kamp Lintfort eee Global Home hty BenQ E Mail oF Beng mobile Username aian Password Lee eee a MBP aaa Overview The following functions are available for the LSO e General mobile information e Generate PINCODE e Generate SIMLOCK UNLOCK Code e Print IMEI labels e Lock Unlock and Test the BF Bus Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 35 of 60 Company Confidential 2006 BenQ BenQ mobile B S JPICS PI s sat Seles we sir Global Home hhy BenQ E Mail Mobile info IMEI label p
3. Company Confidential 2006 BenQ BenQ mobile 18 Fault Symptoms Customer Charging Problems Release 1 2 IO Connector Problems GRT No connection to GRT Problems with external loudspeaker or microphone when using a car kit Problems with accessories connected at the IO connector not okay Exchange IO connector Connector IO Jack Back to customer without repair IO connector Problems Watch for oxidation and damaged pads of the IO connector not okay caused by customer SCRAP has to be send separately to WSC not okay Clean IO connector check for twisted or bent contacts check for dry joints Continue with higher repair level Check the dust inside the IO connector okay Check the status of the IO connector visually okay Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Q okay Use soldering iron to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number E commerce order name Soldering temperature IRIS Diagnose Code Technical Documentation TD Repair L1 L3_SXG75_R1 2 pdf L36334 293 C303 IO JACK SLIM 12 POL 360 C TIP Temp 46100 Interface Charging Connector Mechanical Damage 47300 Interface Data Interface Mechanical Damage 4B100 Interface Headset Con
4. Active area mm 33 84 mm x 45 12 mm Illumination White 4LEDs in series integrated Front side decorated Partly bridgeless keypad i e horizontally bridgeless 12 key block 0 9 tactile finder on key 5 colour adapted to u shaped aluminium brushed sheet metal piece e Four blue LED S for keypad e Five way Navikey e Chrome plated navi key ring with center push button operator logo can be printed on the button which is clipped on the navi key e Four keys functions Back Web access Left amp right soft key e All keys except navi have front side decoration e Four blue LED S for Navikey e ON OFF key combined with the END key the symbol I inside O is used as a symbol for ON OFF e Viedeo telephony key e Task key e Two LED S for edge keys one red one green e Front side decorated Side keys e No illumination e Three side keys functions PoC Volume Camera e Side keys galvanized Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 3 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 Acoustics e Combined handsfree ringer speaker at rear side of phone next to camera e Dedicated ear piece speaker allowing small dimensions as not needed as handfree speaker e Uni directional microphone e Poliphonic ringer tones parallel to GPRS data transfer 16 voices all other Use Cases 40 voices e Hands free mode e Different selectable volume levels f
5. gt Ensure that every required information like fault description customer data a s o is available gt Ensure that the packing of the defective items is according to packing requirements gt Ensure that there is a description available how to unpack the defective items and what to do with them Enter data into your database Depends on your application system gt Ensure that every data which is required for the IRIS Reporting is available in your database gt Ensure that there is a description available for the employees how to enter the data Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 42 of 60 Company Confidential 2006 BenQ Benoa mobile Release 1 2 Incoming check and check after assembling 11 Verify the customers fault description gt After a successful verification pass the defective item to the responsible troubleshooting group gt If the fault description can not be verified perform additional tests to save time and to improve repair quality Switch on the device and enter PIN code if necessary unblock phone Check the function of all keys including side keys Check the display for error in line and row and for illumination Check the ringer loudspeaker acoustics by individual validation Perform a GSM Test as described on page 36 Check the storage capability gt Check internal resistance and capacity of the battery gt Check battery charging capability of the
6. repair level under consideration of this repair instruction All repairs have to be carried out in an ESD protected environment and with ESD protected equipment tools For all activities the international ESD regulations have to be considered Assembling disassembling has to be done according to the latest CF110 Level 1 2 repair documentation It has to be ensured that every repaired mobile Phone is checked according to the latest released General Test Instruction document both documents are available in the Technical Support section of the C market Check at least weekly C market for updates and consider all CF110 related Customer Care Information SXG75 Partnumber on IMEI label S30880 S8900 xxx while may be any letter A Z and xxx may be any number from 100 101 102 Scrap Handling All Scrap information given in this manual are related to the SCRAP Rules and instructions Attention Consider the new LEAD FREE soldering rules available in the communication market avoid excessive heat 13 2 Scope This document is the reference document for all BenQ mobile authorised Service Partners which are released to repair BenQ mobile phones up to level 2 5 light 13 3 Terms and Abbreviations Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 49 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 14 List of available level 3 basic parts according to Component Matrix V1 19 check C
7. Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z97 C415 E commerce order name CONNECTOR RS MMC X75 CONNECTOR RS MMC X75 Soldering temperature 360 C TIP Temp IRIS Diagnose Code 4E000 Interfaces Memory Card Rerader Attention Avoid excessive heat in order not to damage the plastic material of the connector see problem SLIM Lumberg connector Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 60 of 60 Company Confidential 2006 BenQ
8. mobile phone gt Check charging capability of the power supply gt Check current consumption of the mobile phone in different mode Visual inspection gt Check the entire board for liquid damages gt Check the entire board for electrical damages gt Check the housing of the mobile phone for damages SW update gt Carry out a software update and data reset according to the master tables and operator customer requirements Repairs The disassembling as well as the assembling of a mobile phone has to be carried out by considering the rules mentioned in the dedicated manuals If special equipment is required the service partner has to use it and to ensure the correct function of the tools If components and especially soldered components have to be replaced all rules mentioned in dedicated manuals or additional information e g service information have to be considered Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 43 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 GSM Test With the availability of the GRT Test Alignment software this tool has to be used to perform the outgoing test gt Connect the mobile board via internal antenna antenna coupler and external antenna car cradle universal antenna clip to a GSM tester gt Use a Test SIM For Triple Band phones use a separate test case if the test software allows only one handover Skip the GSM Band test cases if not perf
9. step 1 4 to start SW Update SoftwareUpdate CxVE5 Select the mobile phone CPU type IMEI OOOO O par S l Ea M55 MBB eS ee M65 ME5R MCBO E 555 S56 S65 Start SW Update S66 x SK65 SL55 SL56 SL65 30980 57700 4100 Choose if customer data shall be erased If Yes activate the boxes in front of xfs and mapping 1 1 1 1 1 1 1 Read out phone type Variant gt gt Appears in the window above Remarks The decision about a Siemens authorised SW Update depends only on the Master Table The user has no chance to influence the decision Xfs and mapping are always activated there is no chance to deactivate them GRT will erase in any case the customer data even if the action is cancelled lf the user wants to download an other variant then the automatically identified one he has simply to select an other variant from the list Afterwards he has to start the SW Update Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 33 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 9 4 Case 3 Operator SWUpdate blue Step 1 Carry out step 1 4 to start SW Update SoftwareUpdate IMEI OOOO PhoneType 00000 O CAVES FhoneT ype LO 70 L Siemens Phone with S Gold M55 M56 Actuals Select the mobile phone CPU type M65 MESAR lna MCBO i 555 565 S66 SK65 Br Me Start SW Update SL56 SL65 530880 S 7700 4100 Choose if customer data shall be erased
10. Beng mobile Release 1 2 Service Manual SXG 75 Level 1 3 dE MEAS 24 05 2006 BenQ Mobile CC S CES Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 1 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 Table of Content 1 ROY CAS THT 3 2 SXG75 Interface to Accessories sss s sese sese se seene ennenen ennenen enean ennenen 5 3 TWAT IDESCHIDUON ol SXG sarisini ai ri aE iiad 6 A Expl od d View of GOO T 7 DB IWISASSEIMDIY OTSAGI sereni EEEN EN E EE EAR EENE 8 0 ASSemDIy Ol er TTT 18 7 BenQ Service Equipment User Manual ssssssssssss esse sss sese 27 8 GRT Software Functionality Configuration c ccscsecesssseeeseesseesesesseessonseeessoesseessoeees 28 9 GRT Software Regular Usage sss sssssssssssssssssss cesses enesenn neee eee nenen 30 10 JPICS Java based Product Information Controlling System c ccsssessseseeseeneeseeeeeees 35 11 International Mobile Equipment Identity IMEI ss ssssssssssssss sss sss ss sees esse ss sees sese enesenn 41 12 General Testing Information ssssssssssss sese sseesss sss ss sees seene nenen ennenen eenn 42 13 Introduction of Service Repair Documentation Level 3 SXG75 sss ssss sees ss ssss eee enne 49 14 List of available level 3 basic parts sss ssssssssssssssses essen nenen enean 50 15 Hardware requirements ssssssss sese sese sese sese sse sse sse sse senenn ennenen ennenen enean eena 50 16 SXG79 BOar Tay OU sicovccs cesde
11. Check Com Port setting If necessary change it gt Check speed setting Select always the lowest speed if your PC does not have a fast serial card gt Enter the value for JPICS Server Timeout Be careful this value defines how long GRT tries to reach the server until you get an error message Do not select a very long time EEE Settings for Swup and Jpi s F Mobile Fort for JPics incl Initialisation MobilePort Speed 1 hd 115200 Standard JPics Server Timeout fi 80 seconds Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 28 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 Step 3 Connect to GRM Server e Choose in the section GRM the Connect to GRM Database functionality Limit ULimit Result Status ersion Enter your GRT Username and oe LI Password into this fields Password Connect Protocol Cancel aoe SS Activate always both boxes if you I Update Sequence Files connect to the database Start I Update Firmware with Connect Status Configure GRAM connection settings It you IT infrastructure parameter have changed use this button to move to the configuration mask e End the connection with a click onto the Exit button appearing after successful data exchange GRT Software has now finished all required settings and configuration tasks All files ha
12. Handover to GSM Band 2 Including Handover Check TX GSM Band 2 e high TCH e Frequency Error e GSM Spec e second highest PCL e Phase Error RMS e BS Power 75 dBm e Phase Error Peak e middle BCCH e Average Power e Power Time Template RX GSM Band2 e high TCH e RX Level e GSM Spec e BS Power 102 dBm e RX Qual e 50 Frames e BER Class Ib e middle BCCH e BER Class II e BER Erased Frames Call relaese from MS Final Inspection The final inspection contains 1 A 100 network test location update and set up call 2 Refer to point 3 3 3 Arandom sample checks of Data reset if required Optical appearance complete function 4 Check if PIN Code is activated delete the PIN Code if necessary Basis is the international standard of DIN ISO 2859 Use Normal Sample Plan Level Il and the Quality Border 0 4 for LSO Remark All sample checks must be documented Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 45 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 WCDMA Test With the availability of the GRT Test Alignment software this tool has to be used to perform the outgoing test gt Connect the mobile board via internal antenna antenna coupler and external antenna car cradle universal antenna clip to a WCDMA tester gt Use a Test USIM Internal Antenna 1 Location Update e Band 1 3 WCDMA TX Test e UARFCN 10750 e Peak Power dBm e WCDMA Spec e ULTA 30
13. Sun 4 Java additional components Every user is responsible for a proper installation matching the license agreements For installation and further access you need the following 1 The JPICS Installation CD 2 The Smart Card JPICS These cards can be ordered via your responsible Customer Care Manager within Siemens or on http jpics siemens com jpics admin request new_jpics jsp 3 A supported Smart Card Reader Omnikey Cardman in order to access your Smart Card Remark We recommend using Cardman 2020 USB or Cardman 3121 USB Serial card readers are not supported Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 37 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 Generate Codes In the JPICS application you can choose to generate e Masterphone codes e Simlock Unlock Codes Masterphone codes The Masterphone code is used to unlock blocked mobiles Masterphone codes can only be supplied for mobiles which have been delivered in a regular manner Sele Global Home hy BenQ E Mail Bend mobile Troubleshooting Masterphone Code Mobile info Input IMEI label printing IMEI 35163000001 1691 DB Location kamp Lintfort Mobile data Producttype fs 55 Deliverypartnumber 36880 N4910 4150 31 Simlock unlock co Si version foco Partnumber 530880 54910 A100 53 warranty S Status Mormal BFBuUS Status Delivery information Deliverynote Lc00001579 Deliveryda
14. This testing system is known as BenQ Mobile Service Equipment e For disassembling assembling Torque Screwdriver Part Number F 30032 P 228 A1 Opening tool Case opening without destroying Part Number F 30032 P 38 A1 Alternative Opening tool Part Number F30032 P583 A1 Tweezers Camera Ejector Tool Professional Part Number F30032 P514 A1 e For testing All mobile phones have to be tested with the GRT Software The service partner is responsible to ensure that all required hardware is available For additional Software and Hardware options as well as the supported GRT equipment please check the GRT User manual Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 27 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 8 GRT Software Functionality Configuration Note Not implemented in GRT Version 3 x For Software Update please use the tool 3GSWUP_FU Manual and Software are available in the Technical Support section of the C market Sep 1 Select Settings gt gt SWUP JPICS lt a Settings GRM SwWUpdate iv Equipment LSOJLSP Data LLimit ULimit Result Status IMEI Siemens Phone with S Gold Y Ie usePowerSupply chk Exit GetMobilelnfo Step 2 Proceed as follows gt Select all required Variants you need to repair click onto the in front of the product name gt
15. air _L1 L3_SXG75_R1 2 pdf Page 17 of 60 Company Confidential 2006 BenQ Beng mobile G 6 Assembly of SXG75 Assemble UMTS Camera by using Tweezers Connect the UMTS Camera with PCB by using Tweezers Use Tweezers to assemble Camera Cover Technical Documentation 05 2006 TD_Repair_L1 L3_SXG75_R1 2 pdf Page 18 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 Assemble Camera by using Camera Ejector Jig Assemble Display by fixing it in the given frame Take care of the Display Step 6 Assemble Camera Cover Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 19 of 60 Company Confidential 2006 BenQ mobile Release 1 2 Assemble Earphone by using Tweezers carefully Assemble Vibramotor by using Tweezers carefully Technical Documentation 05 2006 TD_Repair_L1 L3_SXG75_R1 2 pdf Page 20 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 Step 10 Assemble Microphone by using Tweezers Be careful with the spring contacts of the Microphone Step 11 Assemble Side keys with Tweezers Step 12 Technical Documentation 05 2006 TD_Repair_L1 L3_SXG75_R1 2 pdf Page 21 of 60 Company Confidential 2006 BenQ BenQ mobile G Step 13 Use Tweezers to assemble Keypad Step 14 Assemble Flexible PCB by using Tweezers Push it carefully with both thumbs in the Upper Case Before assembling PCB in t
16. ds E commerce order number L36334 Z97 C213 E commerce order name CONNECTOR BATTERY 3 POL Soldering temperature 360 C TIP Temp IRIS Diagnose Code 13000 Battery Mechanical Damage Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 56 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 21 Camera Connector Problems Fault Symptoms Customer Camera malfunction Back to customer without repair Camera connector Problems not okay E caused by customer SCRAP has to be send separately to WSC check for twisted or bent contacts check for dry joints Watch for oxidation and damaged pads of the camera connector not okay Check the status of the camera connector visually not oka k a Use the resistor test ape function of a multimeter Continue with to check connection higher repair level between spring contacts and soldering contacts The value must be 0QO Exchange camera connector Connector CAMERA Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z97 C379 E commerce order name CONNECTOR CAMERA SOCKET Soldering temperature 360 C TIP Temp IRIS Diagnose Code BAOOO Accessories Camera Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 57 of 60 Company Confidential 2006 BenQ Benoa mob
17. e 2 85 lt U 7 Connector C Board to onnector Board 20 Antenna ici re o j 4 Bin e g sil TeS G E Connector Camera socket 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Company Confidential 2006 BenQ Page 51 of 60 Benoa mobile Release 1 2 17 SIM Card Problems Fault Symptoms Customer GRT Handset does not accept SIM card SIM Card Problems SIM Card Problems Back to customer without repair not Watch for oxidation and __ Kay x SCRAP has to be send separately to WSC not okay Check the status of th Exchange the eck the status of the EMI Filter visually damaged Filter damaged pads of the okay SIM Card reader not okay Check the status of the SIM Card reader visually check for twisted or bent contacts check for dry joints okay not Use the resistor test oka Exchange oKay function of a multimeter Continue with SIM Card reader to check connection higher repair level between spring contacts and soldering contacts The value must be 0Q Connector SIM Card Reader Use soldering iron to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z97 C406 E commerce order name CONNECTOR SIM CARD READER R65 B Soldering temperature 360 C TIP Temp Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 52 of 60
18. e Magnitude Error RMS e EVM RMS e Phase Error RMS e Frequence Error Average External Antenna carom or T VN Audio Test pC e Audio Loop e Individual check 7 WCDMA TX Min Power e Peak Power dBm e WCDMA Spec e Magnitude Error RMS e EVM RMS e Phase Error RMS e Frequence Error Average WCDMA TX Max Power e Peak Power dBm e WCDMA Spec e Magnitude Error RMS e EVM RMS e Phase Error RMS e Frequence Error Average 10 Test RX BER e UARFCN 10750 e Bit Error Rate e WCDMA Spec e ULTA 30 e Block Error Rate Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 46 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 Annex 1 Test SIM Card There are two different Test SIM Cards in use 1 Test SIM Card from the company ORGA Pin 1 number 0000 PUK 1 l 12345678 Pin 2 number 0000 PUK 2 l 23456789 2 Test SIM Card from the company T D1 Pin 1 number 1234 PUK i 76543210 Pin 2 number 5678 PUK 2 i 98765432 Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 47 of 60 Company Confidential 2006 BenQ BenQ mobile Annex 2 Battery Date Code overview Varta Date code example N9A lt Year N 2001 aae aee eee Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D Dec Maker s marking Revision Letter A B Hitachi Maxwell Date code example __ _N 9 A MX Yea
19. ececientecs acct iecticaeencensatenseuensdeennieviceeysacosckvewedenneeuestendetetoneivesuareaeece 51 17 SIM Card Problems ssssssssssssssssssssssssssssssssssssssssssssssssessss ones asesan annee ae nnes mennene 52 18 IO Connector Problems sss ssssss sss s sss ss cesse sese eenn neee eee 53 19 B to B connector Problems sss ssssssssss sese sees sees esse se neee neee 55 20 Battery Connector ProbleMs 11 cccccssccsscnsessccnnssveccsssesscunnnerscccuseseseesssesceussssacesssseseneassesennes 56 21 Camera Connector Problems sssssssssss sss ss ss sss sse sese seene eenn ennenen ennenen 57 22 IRDA vele 58 23 Display Problems sson E a aE AEEA 59 24 MMC Connector Problems ssssssssssss sss sss s cesse cesses enen 60 Technical Documentation 05 2006 TD_Repair_L1 L3_SXG75_R1 2 pdf Page 2 of 60 Company Confidential 2006 BenQ BenQ mobile 1 Key Features Battery Release 1 2 e Li lon Battery Pack e Nominal Capacity 1000 mAh e GSM Capacity 980 mAh Stand by Time e GSM Up to 3 6hr e WCDMA Up to 3 1hr Talk Time SIM Card Small Plug In 1 8 V or 3 V SIM card Phase II Multi Rate speech coders are available as standard e 30 C to 85 C Storage capability Display 3x4 Block Keypad Function block with Operator key Edge Keys Type Full graphic Resolution 240 x 320 Pixel Technology TFT Epson No of colours 256k Frame Rate 15 frames sec Pixel size mm 0 141 mm x 0 141 mm
20. eciality is a slot for exchangeable RS MultiMediaCard at the side of the phone The keypad is new for a Siemens brick phone and has beside the usual navigation and number key block beneath the display and the 2 side keys on both side surfaces further 4 edge keys 2 on each side beside the LCD module for extended UMTS related functionality Special design element on the rear side is a prominent area with a grid of holes for the loudspeaker There will be one colour variant white silver WP SIEMENS Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 6 of 60 Company Confidential 2006 BenQ BenQ mobi le Release 1 2 4 Exploded View of SXG75 Upper Case Side Keys SSS gt i ee as i Bm P M e E a T E UMTS Camera Cover Display Module UMTS Camera a e ee neS Vihramotor g MMC Holder eas a k 6 N K S L E Battery Cover lt L Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 7 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 5 Disassembly of SXG75 All repairs as well as disassembling and assembling have to be carried out in an ESD protected environment and with ESD protected equipment tools For all activities the international ESD regulations have to be considered For more details please check information in c market https market benqmobile com SO welcome l
21. he Upper Case remove Display Foil Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 22 of 60 Company Confidential 2006 BenQ Bend mobile B Step 17 Assemble PCB by fixing it in the Upper Case To assemble PCB connect it with Flex Cable Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 23 of 60 Company Confidential 2006 BenQ Release 1 2 Assemble MMC holder by pushing it in the given frame Fix the Upper Case on the before assembled Lower Case and PCB Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 24 of 60 Company Confidential 2006 BenQ Bena mobile Release 1 2 Place screws by using Torque Screwdriver Top screw Antenna Screw size T5 Torque 17 cNm Centre Bottom screws Screw size T5 Torque 20 cNm Step 23 Assemble Rear Cover Assemble Battery Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 25 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 Assemble Battery Cover Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 26 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 7 BenQ Service Equipment User Manual Introduction Every LSO repairing BenQ handset must ensure that the quality standards are observed BenQ has developed an automatic testing system that will perform all necessary measurements
22. igned with 2 digits 6 digits have been allocated for the equipment serial number for manufacturer and the last digit is spare The part number for the SXG75 is S30880 8900 xxx where the last for letters specify the housing and software variant SXG 75 series IMEI label is accessible by removing the battery Re use of IMEI label is possible by using a hair dryer to remove the IMEI label On this IMEI label BenQ has also includes the data code for production or service which conforms to the industrial standard DIN EN 60062 The data code comprises of 2 characters first character denotes the year and the second character denotes the month For example P SHS MRN 3 R Sns APRIL a S feos may j 5 T2008 sune e U 2006 JULY 7 To display the IMEI number exit code and SW HW version key 0 6 Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 41 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 12 General Testing Information General Information The technical instruction for testing GSM mobile phones is to ensure the best repair quality Validity This procedure is to apply for all from Siemens AG authorized level 2 up to 2 5e workshops Procedure All following checks and measurements have to be carried out in an ESD protected environment and with ESD protected equipment tools For all activities the international ESD regulations have to be considered Get delivery
23. ile Release 1 2 22 IRDA Problems Fault Symptoms Customer GRT No infrared connection possible Thd IRDA Problems not okay E caused by customer SCRAP has to be send separately to WSC check for twisted or bent contacts check for dry joints Back to customer without repair Watch for oxidation and damaged pads of the IRDA not okay Check the status of the IRDA visually la Continue with higher repair level Exchange IRDA IRDA Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L36197 F5008 F492 E commerce order name IRDA 115 2 KBIT Soldering temperature 360 C TIP Temp IRIS Diagnose Code 41100 Interfaces IRDA No Function 41300 Interfaces IRDA Mechanical Damage Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 58 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 23 Display Problems Fault Symptoms Customer GRT Display problems Current measured failed Display Problems not T SCRAP has to be send separately to WSC check for twisted or bent contacts check for dry joints Back to customer without repair Watch for oxidation and damaged pads of the Display connector not okay Check the status of the Display connector visually okay Use the resist
24. management to perform SW Updates for Net Operators Basis for the decision if a SW Update is authorised by Siemens is the so called Master Table Like in Personal Repair customer data can be erased on request xfs and mapping have to be activated Of course JPICS hardware and authorisation have to be available Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 30 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 9 1 Window explanation This general explanation is valid for all SW Update channels Personal Repair Operator SWAP Operator SWUpdate After using Check Variant Phone IMEI Number will be shown here SoftwareUpdate IMEI Window to select the mobile T i Siemens Phone with S Gold phone CPU S L Shows the different SW Versions J SetviceRelease a SW inside the mobile phone T b Version of Service Release Table SW from M aztert able Hl SW me c Version of Master Table SW L ST Kar dey GRE pdate Check arian Stop leave SW Update 1 1 1 1 1 1 3 Automatic read Ge ae for H onteni XTS 21 E en a phone Settings mapping type Variant Appearing in the Renan window above Activation of the boxes will cause erase of customer date while SW Update Remarks In case of malfunction please check o Is the correct phone type selected o Is the correct COM Port selected o lIfavariant is missing move back to Settings select the missing
25. market for updates Product ID SXG75 V2100 SXG75 X100 SXG75 X1100 SXG75 X1400 SXG75 X1500 SXG75 X1900 SXG75 X1901 SXG75 X200 SXG75 X2000 SXG75 X2201 15 Hardware requirements Order Number L36197 F5008 F492 L36334 Z93 C303 L36334 Z97 C213 L50634 297 C348 L36334 Z297 C337 L36197 F5008 F341 L50634 297 C379 L36334 Z93 C297 L50697 F5008 F288 L50634 Z97 C340 Description CM IRDA 115 2 KBIT IO JACK SLIM 12 POL CONNECTOR BATTERY 3 POL CONNECTOR RS MMC READER X75 CONNECTOR SIM CARD READER K1 CONNECTOR BOARD TO BOARD 20 POL CONNECTOR CAMERA SOCKET CONNECTOR ANTENNA 6mm BOARD TO BOARD 16 POL 0 5MM BOARD TO BOARD 30 POL according to General soldering information V1 3 check C market for updates Jigs Tools and working materials for all described repairs hot air blower soldering gun tweezers flux solder SXG 75 dome sheet jig Technical Documentation TD Repair L1 L3 SXG75_R1 2 pdf 05 2006 Page 50 of 60 Company Confidential 2006 BenQ BenQ mobile 16 SXG7 5 Board layout Upper board side Connector Front Camera Lower board side Connector Connector IRDA Battery SIM Card IO Jack Reader Slim E E L lt i ji SUY 1 L g T Tree add x TES T u E Y Krs 9 I i 1 a missed I at l 1 D V Connector RS MMC Technical Documentation co 5 a fe L E Y See anes R I L L a 4 Release 1 2 Connector Display _ v RB p
26. nector Mechanical Damage 05 2006 Page 53 of 60 Company Confidential 2006 BenQ BenQ mobile G Important additional soldering hints The MMC Reader is located on the opposite of the SLIM Lumberg connector Therefore the risk to damage the plastic material of this MMC Reader is potentially high if excessive heat is used while removal or soldering of the SLIM Lumberg connector Please follow these instructions a Remove the SLIM Lumberg connector with a soldering iron and Desolder Wick b Clean the Pads afterwards c Solder the new connecter by using soldering iron under consideration of the max allowed temperature range Samples of critical area Lock mechanism damaged Lock mechanism OK Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 54 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 19 B to B connector Problems Fault Symptoms Customer GRT Upper slider keyboard malfunction Keyboard malfunction Upper slider keypad illumination does not work Current measured failed Display problems B to B connector problems not oka SS caused by customer Back to customer without repair Watch for oxidation and damaged pads of the B to B connector SCRAP has to be send separately to WSC not check for twisted or bent contacts check for dry joints Check the status of the B to B connector visually la Continue with higher repair level
27. ookup asp There you can find the document ESD Guideline Remove Battery Cover and Battery Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 8 of 60 Company Confidential 2006 BenQ Bene mobile Release 1 2 Remove Rear Cover by pushing it with both thumbs forwards Remove screws with Torque Screwdriver Screws size T5 Step 4 Remove Upper Case by using Alternative Opening Tool carefully Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 9 of 60 Company Confidential 2006 BenQ Bena mobile Release 1 2 Disconnect Flex Cable from PCB by using Tweezers carefully Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 10 of 60 Company Confidential 2006 BenQ BenQ mobile G Remove MMC Holder by pushing it with Alternative Opening Tool outside the frame Use Alternative Opening Tool to remove PCB from Lower Case carefully To avoid scratches it is mandatory to place a Protection Foil onto the Display Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 11 of 60 Company Confidential 2006 BenQ Beng mobile Release 1 2 Remove Flexible PCB with Alternative Opening Tool carefully The Loudspeaker is not removable Remove Side keys by using Tweezers Technical Documentation 05 2006 TD_ Repair _L1 L3_SXG75_R1 2 pdf Page 12 of 60 Company Confidential 2006 BenQ Release 1 2 Use Twee
28. or handsfree handset and ringer mode for the amount see SW product description Antenna integrated Quad band antenna Receiver e Compliant with 3GPP specification TS34 121 Rel 99 Sensitivit Transmitter Power e Compliant with 3GPP specification TS34 121 Rel 99 The transmitter output power is compliant to following Power classes UMTS nominal 0 25W gt power class 4 GSM 900 nominal 2W gt power class 4 GSM 1800 GSM 1900 nominal 1W gt power class 1 Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 4 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 2 SXG75 Interface to Accessories The phone has the following compatible interfaces to accessories electrically by the Lumberg I O connector Lumberg slim antenna connection by courtesy of RF connector IR and Bluetooth interface is implemented Slot wit reader for additional reduced size MultiMediaCard exchangeable is available car holder interface is implemented Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 5 of 60 Company Confidential 2006 BenQ Benga mobile Release 1 2 3 Unit Description of SXG75 The SXG 7 5 is a brick phone with 2 integrated cameras for video telephony and photo applications The phone has two different acoustic modules one for receiver mode on the topside and one for sound ringer and hands free mode with separate hole on the bottom side Additional sp
29. or test Exchange function of a multimeter Continue with display to check connection higher repair level connector between spring contacts and soldering contacts The value must be 0Q Connector DISPLAY Use hot air blower to remove defective component Avoid excessive heat Watch surrounding components Resolder new component afterwards E commerce order number L50634 Z97 C380 E commerce order name CONNECTOR DISPLAY 20POL Soldering temperature 360 C TIP Temp IRIS Diagnose Code 21000 Display Performance 22000 Display Background Illumination Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 59 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 24 MMC Connector Problems Fault Symptoms Customer MMC malfunction Back to customer without repair MMC connector problems not okay E caused by customer SCRAP has to be send separately to WSC check for twisted or bent contacts check for dry joints okay Continue with gt higher repair level Watch for oxidation and damaged pads of the MMC connector not okay Check the status of the MMC connector visually Use the resistor test function of a multimeter to check connection between spring contacts and soldering contacts The value must be 0Q Exchange MMC connector Connector MMC Use soldering iron to remove defective component Avoid excessive heat
30. ormed by the mobile phone example 1 Test file Band 1 GSM900 Band 2 GSM1800 2 Test file Band 1 GSM1900 Internal Antenna res case Parameter Measurements Limits yeast Update e GSM Band 1 e Display check e individual e BS Power 55 dBm check e middle BCCH from BS e low TCH e Ringer Loudspeaker e individual e highest PCL check check e BS Power 75 dBm e middle BCCH TX GSM Band 1 e low TCH e Frequency Error e GSM Spec e highest PCL e Phase Error RMS e BS Power 75 dBm e Phase Error Peak e middle BCCH e Average Power e Power Time Template eang to GSM Band T igear Handover Check TX GSM Band 2 e low o e Frequency Error e GSM Spec e highest PCLO e Phase Error RMS e BS Power 75 dBm e Phase Error Peak e middle BCCH e Average Power e Power Time Template Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 44 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 External Antenna 7 Call from MS e GSM900 e Keyboard check e individual e high TCH check e second highest PCL e BS Power 75 dBm e middle BCCH TX GSM Band 1 e high TCH e Frequency Error e GSM Spec e second highest PCL e Phase Error RMS e BS Power 75 dBm e Phase Error Peak e middle BCCH e Average Power e Power Time Template 9 RX GSM Band 1 e high TCH e RX Level e GSM Spec e BS Power 102 dBm e RX Qual e 50 Frames e BER Class Ib e middle BCCH e BER Class II e BER Erased Frames 10
31. pair _L1 L3_SXG75_R1 2 pdf Page 39 of 60 Company Confidential 2006 BenQ BenQ mobile G Printing IMEI label The module printing IMEI label offers the possibility to re print IMEI labels for mobiles again DER Global Home hy BenQ E Mail Mobile info IMEI 35163000001 1691 DE Location Kamp Lintfort IMEI label printing Input Masterphone codes I l 1 I U l l l Simlock unlock co BFBuUS Status connected You are able to print 1 label in just one step To prevent that misaligned labels are being printed the setting Print test labels v is activated by default After having printed a well aligned test label you can uncheck the setting and print the correct label Hint For correct printing of IMEI labels you must have a Zebra label printer with special material that fits for label printing This printer has to be connected to local LPT1 printer port also see Installation of IMPRINT and MUST feature a printing resolution of 300dpi Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 40 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 11 International Mobile Equipment identity IMEI The mobile equipment is uniquely identified by the International Mobile Equipment Identity IMEI which consists of 15 digits Type approval granted to a type of mobile is allocated 6 digits The final assembly code is used to identify the final assembly plant and is ass
32. r N 2001 GO K Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D Dec Maker s marking Revision Letter A B Sanyo Date code example m gt _ N 9 A SY Year N 2001 OO _ o Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D Dec Maker s marking Revision Letter A B NEC Date code example _ NSA Year N 2001 ee a Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D D c Maker s marking Revision Letter A B IS Panasonic Date code er ON o Year N 2001 0 2002 aioli Code Month 1 Jan 2 2002 J Sep O Oct N Nov D De c Maker s marking Revision Letter A B Sony Date code example _ PNAS Year 0 2002 B L Supplier Code Month 1 Jan 2 Feb 9 Sep O Oct N Nov D D c Maker s marking Revision Letter A B Technical Documentation Release 1 2 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 48 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 13 Introduction of Service Repair Documentation Level 3 SXG75 13 1 Purpose This Service Repair Documentation is intended to support Service partners to carry out repairs on BenQ repair level 3 The described failures shall only be repaired in BenQ authorized local workshops The level 3 former Level 2 5light partners are obliged to repair level 3 classified boards up to their
33. rinting Masterphone codes Simlock unlock co BFBus Status 4 itUncdiemn connected The access to the JPICS server which is located in Kamp Lintfort is protected by chip card and in addition using secure socket layer SSL connection The JPICS server is only available for authorized users with a specially coded smart card These smart cards and the administration of the JPICS web server and the PICS database server can only be provided by the JPICS TRUST Center of the responsible department in Kamp Lintfort In case of any questions or requests concerning smart cards or administration of the databases please ask your responsible BenQ Customer Care Manager Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 36 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 Installation overview The following installation description assumes that a web browser is already installed JPICS is tested with the following browsers 1 Internet Explorer Version 5 5 and higher 2 Netscape Version 6 and higher For further information regarding supported browsers browser version and supported operating systems see the Sun FAQ s Here is a step by step instruction to install all the required components It is necessary to follow this order 1 Smart Card Reader Omnikey Cardman 2020 USB or Cardman 3121 USB CardOS interface Siemens Version 3 0 B 2 3 Java Runtime Environment
34. te 15 09 05 Masterphone codes Mobile codes Mobile unlock cade F 0003 40158737 dda connected Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 38 of 60 Company Confidential 2006 BenQ BenQ mobile Release 1 2 Simlock Unlock Code The Simlock Unlock Codes can only be generated if the following conditions are given e Mobile must have an active Simlock inside e The user must be given the authorization to obtain Simlock Unlock Codes for the variant of the operator to which the mobile was delivered last time JPICS PICS internet portal Microsoft Internet Explorer bereitgestellt von BenQ mobile Kamp Lintfort Seles E GZ Global Home My BenQ E Mail Simnlock Unlock Code Mobile info paet information For given IMEI IMEI label printing IMEI 350673547 180612 DB Location kamp Lintfort Mobile data Producttype leas Deliverypartnumber 36880 55100 K139 15 Simlock unlock co Si version 049 Partnumber S30880 55100 4139 14 warranty 21 08 05 Status Mormal BFBus Status Delivery information Deliverynote 0066015319 Deliverydate 22 08 03 Mobile codes Masterphone codes Metworkcade Network Mastercode 5 Providercode 5 Provider Mastercode SIM Mastercode SIM Reeanablecode Corporatecode Corporate Mastercode Network Subnet Code Network Subnet Mastercode 0004 28101158 connected Technical Documentation 05 2006 TD Re
35. variant and conncet the GRM Server Then continue with SW Update Technical Documentation 05 2006 TD Repair L1 L3_SXG75_R1 2 pdf Page 31 of 60 Company Confidential 2006 BenQ BenQ mobile 9 2 Case 1 Personal Repair green Step 1 Carry out step 1 4 to start SW Update SoftwareUpdate l IMEI OOOO O l Siemens Phone with S Gold Y a P Sw from Mastertable al p R Mapping StartUpdate 30880 S7700 4100 1 1 1 1 1 1 2 Read out phone type Variant gt gt Appears in the window above Remarks Release 1 2 Select the mobile phone CPU type Start SW Update Choose if customer data shall be erased If Yes activate the boxes in front of xfs and mapping The decision about a Siemens authorised SW Update depends only on the Service Release Table The SW which is booted by GRT can be below the SW mentioned in the service Release Table if this SW is not released for the Net Operator If xfs and mapping are activated GRT will erase in any case the customer data even if the action is cancelled lf the user wants to download an other variant then the automatically identified one he has simply to select an other variant from the list Afterwards he has to start the SW Update Technical Documentation TD Repair L1 L3 SXG75_R1 2 pdf Company Confidential 2006 BenQ 05 2006 Page 32 of 60 Beno mobile Release 1 2 9 3 Case 2 Operator SWAP red Step 1 Carry out
36. ve been down and uploaded In dependency of the selected number of mobile phones and variants the volume of transferred date could be 100MB Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 29 of 60 Company Confidential 2006 BenQ Beno mobile Release 1 2 9 GRT Software Regular Usage Step 1 Select the section SWUpdate Step 2 Choose the area you want to work with SoltwareUpdate Concept Please choose your update concept PersonalRepair Operators wap Operators pdate Cancel e Personal Repair Personal Repair is always accessible Basis for the decision if a SW Update is authorised by Siemens is the so called Service Release Table Example Mobile Phone has already SW50 Service Release Table shows SW50 In this case SW Update is not necessary and therefore not authorised In any case customer data can be erased on request xfs and mapping have to be activated Of course JPICS hardware and authorisation have to be available e Operator SWAP This area is only accessible if you are released by the service management to perform SW Updates for Net Operators Basis for the decision if a SW Update is authorised by Siemens is the so called Master Table Customer data will be erased without any exception and any chance to influence by the user JPICS hardware and authorisation have to be available e Operator SWUpdate This area is only accessible if you are released by the service
37. zers to remove Keypad Remove Microphone by using Tweezers carefully Be careful with the spring contacts of the Microphone Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 13 of 60 Company Confidential 2006 BenQ Release 1 2 Remove Vibramotor by using Tweezers carefully Remove Earphone by using Tweezers carefully Use Alternative Opening Tool to remove Camera Cover carefully Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 14 of 60 Company Confidential 2006 BenQ Bena mobile G Disconnect Flex Cable from PCB with Tweezers Technical Documentation 05 2006 TD Repair _L1 L3_SXG75_R1 2 pdf Page 15 of 60 Company Confidential 2006 BenQ Bena mobile Release 1 2 Step 23 Remove Display from PCB by using Alternative Opening Tool very carefully Step 24 Put the Camera Ejector Jig professional through the four edges between the Camera and the Camera Connector Now push the Ejector Jig and pull out the Camera carefully Remove UMTS Camera Cover by using Tweezers carefully Technical Documentation 05 2006 TD_Repair_L1 L3_SXG75_R1 2 pdf Page 16 of 60 Company Confidential 2006 BenQ Release 1 2 Step 27 Remove UMTS Camera with Alternative Opening Tool very carefully Overview Lower Parts Overview Upper Parts Camera Cover i l BD ead ET S UMTS Camera Technical Documentation 05 2006 TD Rep

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