SGS-THOMSON TDA1904 Manual(1)
Contents
1. WARS RAGA BER Ama SGS THOMSON m HIGH OUTPUT CURRENT CAPABILITY m PROTECTION AGAINST CHIP OVERTEM PERATURE m LOWNOISE m HIGH SUPPLY VOLTAGE REJECTION m SUPPLY VOLTAGE RANGE 4V TO 20V DESCRIPTION The TDA 1904 is a monolithic integrated circuit in POWERDIP package intended for use as low fre quency power amplifier in wide range of applica tions in portable radio and TV sets ABSOLUTE MAXIMUM RATINGS Parameter Supply voltage Peak output current non repetitive Peak output current repetitive 1904 4W AUDIO AMPLIFIER Powerdip 8 8 ORDERING NUMBER TDA1904 2 Total power dissipation at 80 C at Tpins 60 C Storage junction temperature R4 is necessary only for Vs lt 6V March 1993 40 to 150 G S 5292 2 wam 1 10 TDA1904 PIN CONNECTION top view INVERT NON INVERT INPUT SCHEMATIC DIAGRAM THERMAL DATA Symbol Parameter Value Unit Thermal resistance junction pins max Thermal resistance junction ambient max 2 10 Gr SGS THOMSON ELECTRICAL CHARACTERISTICS Refer to the test circuit 25 Rin heatsink 20 C W unless otherwisw specified Supply voltage Quiescent output voltage Quiescent drain current Output power Harmonic distortion Input saturation voltage2. rms m Input resistance pin 8 Efficiency Small signal bandwidth 3 dB Voltage gain open loop in Voltage gain closed loop eN Total input noise Supply voltage rejection Vs Vo V n BW G G SV Ts i R d Thermal shut down case temperature Note Weighting filter curve A Test conditions Vs 4V Vs 14V Vs 9V Vs 14V f 1 KHz Vs 9V Po 2 50 mW to 1 2W Vs 9V Vs 14V 4 f 1 KHz f 1 KHz Vs 9V RL 40 14 490 Po 2W Po 4 5W Vs 14V 40 to 40 000 Vs 14V 1 2 75 Vs 14V R 40 f 1 KHz Po 1W Rg 500 Rg 10KQ Rg 500 Rg 10 KQ Vs 12V fripple 100 Hz Vripple 0 5 Vrms 39 5 Rg 10 Filter with noise bendwidth 22Hz to 22 KHz by SGS THOMSON TDA1904 3 10 TDA1904 Figure 1 Testand application circuit 529212 4 is necessary only for Vs lt 6V Figure 2 P C board and components layout of fig 1 1 1 scale 265 0153 4 10 T TDA1904 APPLICATION SUGGESTION The recommended values of the external compo 3 in order to obtain the maximum output power nents are those shown on the application circuit of Different values can be used The following table fig 1 can
3. Powerdip in following advantages which8 pins from 9 to 1 6 are attachedto the frame 1 An overload on the output even if itis perma remove the heat produced by the chip nent or an above limit ambient temperature Figure 21 shows a PC board copper area used as can be easily tolerated since the Tj cannot be a heatsink 2 65 mm higher than 150 The thermal resistance junction ambient is 35 2 Theheatsinkcan have a smallerfactor of safety compared with that of a conventional circuit Thereis no possibility of devicedamagedueto Figure 21 Example of heatsink using PC board high junction temperature copper I 65 mm If for any reason the junction temperature in crease up to 150 C the thermal shut down simply reduces the power dissipation and the current consumption 8 10 TDA1904 POWERDIP PACKAGE MECHANICAL DATA 5 9 10 TDA1904 Information furnished is believed to be accurate and reliable However SGS THOMSON Microelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use No license is granted by implication or otherwise under any patent or patent rights of SGS THOMSON Microelectronics Specifications mentioned in this publication are subject to change without notice This publication supersedes and replaces all info
4. help the designer When the supply voltage Vs is less than 6V a 680 resistor must be connected between pin 2 and pin Recomm Larger than Smaller than Allowed range R1 10 Increase of gain Decrease of gain 9R3 Increase quiescent Feedback resistors current Lm ss mm 4 7 R2 R3 Frequency stability Danger of oscillation at high frequencies with inductive loads Increase of the output swing with low supply voltage Input DC Higher cost lower Higher low decoupling noise frequency cutoff Higher noise C2 0 1 uF Supply voltage Danger of bypass oscillations C3 22 uF Ripple rejection Increase of SVR Degradation of SVR 2 2 uF 100027 increase of the switch on time C4 2 2 uF Inverting input DC Increase of the Higher low 0 1 QF decoupling switch on noise frequency cutoff C5 47 uF Bootstrap Increase of the 10 uF 100uF distortion at low frequency 0 22 uF Frequency stability Danger of oscillation F C7 1000 uF Output DC Higher low decoupling frequency cutoff Sr SGS THOMSON 5 10 ale EE Ss anus TDA1904 Figure 3 Quiescent output Figure 4 Quiescent drain Figure 5 Output power vs voltage vs supply voltage current vs supply voltage supply voltage Figure 6 Distortion vs Figure 7 Distortion vs Figu
5. re 8 Distortion vs output power output power output power i 4 z Ry f TEKH H Figure 9 Distortion vs Figure 10 Distortion vs Figure 11 Distortion vs output power output power output power 6 10 M Figure 12 Distortion vs frequency a4 mh Figure 15 Distortion vs frequency Figure 18 Total power dissipation and efficiency vs output power Figure 13 Distortion vs frequency Figure 16 Supply voltage rejection vs frequency SYR Figure 19 Total power dissipation and efficiency vs output power SGS IHOMSON TDA1904 Figure 14 Distortion vs frequency Figure 17 Total power dissipation and efficiency vs output power Figure 20 Total power dissipation and efficiency vs output power 7 10 TDA1904 THERMAL SHUT DOWN MOUNTING INSTRUCTION The presence of a thermal limiting circuit offers the The TDA 1904 is assembled in the
6. rmation previously supplied SGS THOMSON Microelectronics products are not authorizedfor use as critical componentsin life support devices or systems withoutexpress written approval of SGS THOMSON Microelectronics 1994 SGS THOMSON Microelectronics All Rights Reserved SGS THOMSON Microelectronics GROUP OF COMPANIES Australia Brazil France Germany Hong Kong Italy Japan Korea Malaysia Malta Morocco The Netherlands Singapore Spain Sweden Switzerland Taiwan Thaliand United Kingdom U S A P MM SS THOMSON
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SGS THOMSON TDA1904 Manual(1)