TOREX USP-6B04 Manual(1)
Contents
1. eUSP 6B04 Power Dissipation Power dissipation data for the USP 6B04 is shown in this page The value of power dissipation varies with the mount board conditions Please use this data as one of reference data taken in the described condition 1 Measurement Condition Reference data 40 0 Condition Mount on a board Ambient Natural convection Soldering Lead Pb free Board Dimensions 40mmx40mm 1600mm in one side 1st Inner Metal Layer about 50 2nd Inner Metal Layer about 50 3rd Inner Metal Layer about 50 4th Inner Metal Layer about 50 Each heat sink back metal is connected to the Inner layers respectively Material Glass Epoxy FR 4 Thickness 1 0 mm Through hole 4 x 0 4 Diameter Evaluation Board Unit mm 2 Power Dissipation vs Ambient temperature Board Mount Tjmax 125 C Ambient ee Power Dissipation Pd mW Thermal Resistance C W 166 67 45 bo So 105 Ambient TemperatureTa CC
Download Pdf Manuals
Related Search
TOREX USP 6B04 Manual(1) torex s.p.a