TOREX QFN-20 Power Dissipation Manual
Contents
1. TOIREX QFN 20 Power Dissipation Power dissipation data for the QFN 20 is shown in this page The value of power dissipation varies with the mount board conditions Please use this data as one of reference data taken in the described condition 1 Measurement Condition Reference data Condition Mount on a board Ambient Natural convection ie Soldering Lead Pb free am ee Board Dimensions 40 x 40 mm 1600 mm2 in one side ee Copper Cu traces occupy 50 of the board area In top and back faces Package heat sink is tied to the copper traces Material Glass Epoxy FR 4 Thickness 1 6 mm Through hole 5 x 0 8 Diameter xe oS sores eae 28 9 See RRR TONS Patatatae oes ate KS Evaluation Board Unit mm 2 Power Dissipation vs Ambient Temperature Board Mount Tj max 125 C Ambient Temperature C Power Dissipation Pd mW Thermal Resistance C W 1000 46N00 PdvsTa Power Dissipation Pd mW o gt oO oO 25 45 65 85 105 125 Ambient Temperature Ta C
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TOREX QFN 20 Power Dissipation Manual